DK559685D0 - CONTACTING A MICROWAVE CONNECTED ON A SUBSTRATE - Google Patents

CONTACTING A MICROWAVE CONNECTED ON A SUBSTRATE

Info

Publication number
DK559685D0
DK559685D0 DK559685A DK559685A DK559685D0 DK 559685 D0 DK559685 D0 DK 559685D0 DK 559685 A DK559685 A DK 559685A DK 559685 A DK559685 A DK 559685A DK 559685 D0 DK559685 D0 DK 559685D0
Authority
DK
Denmark
Prior art keywords
substrate
microwave
contacting
metal frame
substrates
Prior art date
Application number
DK559685A
Other languages
Danish (da)
Other versions
DK163465C (en
DK559685A (en
DK163465B (en
Inventor
Wolfgang Schiller
Original Assignee
Ant Nachrichtentech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ant Nachrichtentech filed Critical Ant Nachrichtentech
Publication of DK559685D0 publication Critical patent/DK559685D0/en
Publication of DK559685A publication Critical patent/DK559685A/en
Publication of DK163465B publication Critical patent/DK163465B/en
Application granted granted Critical
Publication of DK163465C publication Critical patent/DK163465C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

1. A microwave circuit disposed on a substrate, which circuit is connected to plug connections and/or other microwave circuits on adjacent substrates and is connected with respect to ground to a housing receiving the substrate, wherein the substrate is electrically conductively secured with its ground side to a metal frame, characterized in that the metal frame (4, 20) is provided with laterally protruding tongues (5, 6, 7, 19) that are screwed to the housing, and that attached to some of the tongues (6, 7, 19) are substrates (8, 9, 15) of flexible material on top of which are planar lead segments (10, 11, 17) that are connected both to the microwave circuit on the substrate (2, 3), via soldered-on wires (12, 13, 16), and to planar lead segments (17) of adjacent substrates (3) or to leads (14) of plug connections (15).
DK559685A 1984-12-04 1985-12-03 CONTACTING A MICROWAVE CONNECTED ON A SUBSTRATE DK163465C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843444076 DE3444076A1 (en) 1984-12-04 1984-12-04 CONTACTING A MICROWAVE CIRCUIT ARRANGED ON A SUBSTRATE
DE3444076 1984-12-04

Publications (4)

Publication Number Publication Date
DK559685D0 true DK559685D0 (en) 1985-12-03
DK559685A DK559685A (en) 1986-06-05
DK163465B DK163465B (en) 1992-03-02
DK163465C DK163465C (en) 1992-07-20

Family

ID=6251787

Family Applications (1)

Application Number Title Priority Date Filing Date
DK559685A DK163465C (en) 1984-12-04 1985-12-03 CONTACTING A MICROWAVE CONNECTED ON A SUBSTRATE

Country Status (4)

Country Link
EP (1) EP0183916B1 (en)
AT (1) ATE42431T1 (en)
DE (2) DE3444076A1 (en)
DK (1) DK163465C (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402088A (en) * 1992-12-03 1995-03-28 Ail Systems, Inc. Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2456367A1 (en) * 1971-05-10 1976-08-12 Siemens Ag Mounting plate with conducting paths - has a substrate with thick or thin film circuits and front side conductors like printed circuit
US4042952A (en) * 1976-06-09 1977-08-16 Motorola, Inc. R. F. power transistor device with controlled common lead inductance
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4326180A (en) * 1979-11-05 1982-04-20 Microphase Corporation Microwave backdiode microcircuits and method of making

Also Published As

Publication number Publication date
EP0183916B1 (en) 1989-04-19
DK163465C (en) 1992-07-20
DE3444076A1 (en) 1986-06-05
DK559685A (en) 1986-06-05
ATE42431T1 (en) 1989-05-15
EP0183916A1 (en) 1986-06-11
DE3569638D1 (en) 1989-05-24
DK163465B (en) 1992-03-02

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Legal Events

Date Code Title Description
PBP Patent lapsed