DK1430758T3 - Elektrisk kredslöbsindretning med flere elektrisk med hinanden forbundne kredslöbskomponenter - Google Patents

Elektrisk kredslöbsindretning med flere elektrisk med hinanden forbundne kredslöbskomponenter

Info

Publication number
DK1430758T3
DK1430758T3 DK02772075T DK02772075T DK1430758T3 DK 1430758 T3 DK1430758 T3 DK 1430758T3 DK 02772075 T DK02772075 T DK 02772075T DK 02772075 T DK02772075 T DK 02772075T DK 1430758 T3 DK1430758 T3 DK 1430758T3
Authority
DK
Denmark
Prior art keywords
electrically connected
circuit arrangement
components
conductor track
circuit components
Prior art date
Application number
DK02772075T
Other languages
Danish (da)
English (en)
Inventor
Johann Otto
Martin Honsberg-Riedl
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of DK1430758T3 publication Critical patent/DK1430758T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
    • H05B41/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
DK02772075T 2001-09-27 2002-09-19 Elektrisk kredslöbsindretning med flere elektrisk med hinanden forbundne kredslöbskomponenter DK1430758T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10147758 2001-09-27

Publications (1)

Publication Number Publication Date
DK1430758T3 true DK1430758T3 (da) 2006-12-04

Family

ID=7700545

Family Applications (1)

Application Number Title Priority Date Filing Date
DK02772075T DK1430758T3 (da) 2001-09-27 2002-09-19 Elektrisk kredslöbsindretning med flere elektrisk med hinanden forbundne kredslöbskomponenter

Country Status (9)

Country Link
US (1) US20040246683A1 (es)
EP (1) EP1430758B1 (es)
JP (1) JP2005505144A (es)
CN (1) CN1288950C (es)
AT (1) ATE336160T1 (es)
DE (1) DE50207814D1 (es)
DK (1) DK1430758T3 (es)
ES (1) ES2266572T3 (es)
WO (1) WO2003030607A1 (es)

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US20070034360A1 (en) * 2005-06-08 2007-02-15 Hall Jack P High performance cooling assembly for electronics
US7307841B2 (en) * 2005-07-28 2007-12-11 Delphi Technologies, Inc. Electronic package and method of cooling electronics
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
EP2271971B1 (en) 2008-04-21 2015-05-27 Liquidcool Solutions, Inc. A case and rack system for liquid submersion cooling of electronic devices connected in an array
EP2321849B1 (en) * 2008-08-11 2022-01-12 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
US8018720B2 (en) * 2009-06-25 2011-09-13 International Business Machines Corporation Condenser structures with fin cavities facilitating vapor condensation cooling of coolant
US7885074B2 (en) * 2009-06-25 2011-02-08 International Business Machines Corporation Direct jet impingement-assisted thermosyphon cooling apparatus and method
US8490679B2 (en) * 2009-06-25 2013-07-23 International Business Machines Corporation Condenser fin structures facilitating vapor condensation cooling of coolant
US8059405B2 (en) * 2009-06-25 2011-11-15 International Business Machines Corporation Condenser block structures with cavities facilitating vapor condensation cooling of coolant
US8014150B2 (en) * 2009-06-25 2011-09-06 International Business Machines Corporation Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
JP5257472B2 (ja) 2010-04-02 2013-08-07 株式会社デンソー 電子装置
JP5626200B2 (ja) * 2011-01-06 2014-11-19 株式会社豊田自動織機 電気部品の固定構造
CN103096616A (zh) * 2013-01-05 2013-05-08 陈夏新 电路板上的贴片功率元件的导热结构
US9144179B2 (en) * 2013-02-01 2015-09-22 Dell Products, L.P. System and method for powering multiple electronic devices operating within an immersion cooling vessel
FR3002410B1 (fr) * 2013-02-20 2016-06-03 Bull Sas Carte electronique pourvue d'un systeme de refroidissement liquide
EP2994809B1 (en) 2013-05-06 2019-08-28 Green Revolution Cooling, Inc. System and method of packaging computing resources for space and fire-resistance
US9756766B2 (en) 2014-05-13 2017-09-05 Green Revolution Cooling, Inc. System and method for air-cooling hard drives in liquid-cooled server rack
US11359865B2 (en) 2018-07-23 2022-06-14 Green Revolution Cooling, Inc. Dual Cooling Tower Time Share Water Treatment System
DE102019214565A1 (de) * 2019-09-24 2021-03-25 Zf Friedrichshafen Ag Elektronikmodul eines Elektroantriebs mit direktgekühlten Elektronikbauteilen
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand

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Publication number Priority date Publication date Assignee Title
US3766439A (en) * 1972-01-12 1973-10-16 Gen Electric Electronic module using flexible printed circuit board with heat sink means
DE2522309C3 (de) * 1975-05-20 1979-10-11 Waldemar 4500 Osnabrueck Riepe Flüssigkeitspumpe
US4498851A (en) * 1980-05-02 1985-02-12 Piezo Electric Products, Inc. Solid state blower
GB2126802B (en) * 1982-09-03 1985-06-05 Standard Telephones Cables Ltd High density packaging for electronic circuits
US4780062A (en) * 1985-10-09 1988-10-25 Murata Manufacturing Co., Ltd. Piezoelectric fan
US4834619A (en) * 1987-11-10 1989-05-30 The Boeing Company Ducted oscillatory blade fan
US4928206A (en) * 1988-11-23 1990-05-22 Ncr Corporation Foldable printed circuit board
US4923000A (en) * 1989-03-03 1990-05-08 Microelectronics And Computer Technology Corporation Heat exchanger having piezoelectric fan means
US5104626A (en) * 1990-09-07 1992-04-14 Yang Tai Her Vibrating diffusion type aromatic device
US5462685A (en) * 1993-12-14 1995-10-31 Ferrofluidics Corporation Ferrofluid-cooled electromagnetic device and improved cooling method
US6043978A (en) * 1997-12-15 2000-03-28 Eaton Corporation Cooling device for circuit breakers
US6504713B1 (en) * 1998-01-22 2003-01-07 Iv Phoenix Group, Inc. Ultra-rugged, high-performance computer system
US6175501B1 (en) * 1998-12-31 2001-01-16 Lucent Technologies Inc. Method and arrangement for cooling an electronic assembly
US6938678B1 (en) * 2000-06-23 2005-09-06 Lucent Technologies Inc. Arrangement for liquid cooling an electrical assembly using assisted flow

Also Published As

Publication number Publication date
DE50207814D1 (de) 2006-09-21
JP2005505144A (ja) 2005-02-17
CN1288950C (zh) 2006-12-06
US20040246683A1 (en) 2004-12-09
ATE336160T1 (de) 2006-09-15
ES2266572T3 (es) 2007-03-01
CN1640218A (zh) 2005-07-13
WO2003030607A1 (de) 2003-04-10
EP1430758A1 (de) 2004-06-23
EP1430758B1 (de) 2006-08-09

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