DK1414066T3 - Fremgangsmåde til overvågning af effekthalvlederkomponenter - Google Patents

Fremgangsmåde til overvågning af effekthalvlederkomponenter

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Publication number
DK1414066T3
DK1414066T3 DK03023086T DK03023086T DK1414066T3 DK 1414066 T3 DK1414066 T3 DK 1414066T3 DK 03023086 T DK03023086 T DK 03023086T DK 03023086 T DK03023086 T DK 03023086T DK 1414066 T3 DK1414066 T3 DK 1414066T3
Authority
DK
Denmark
Prior art keywords
power semiconductor
contact areas
semiconductor components
electrically separated
monitoring power
Prior art date
Application number
DK03023086T
Other languages
English (en)
Inventor
Reinhrad Dr Herzer
Mario Dr Netzel
Jan Lehmann
Sascha Pawel
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10249712A external-priority patent/DE10249712B3/de
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK1414066T3 publication Critical patent/DK1414066T3/da

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
    • G01R31/275—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements for testing individual semiconductor components within integrated circuits
    • G—PHYSICS
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Power Conversion In General (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DK03023086T 2002-10-25 2003-10-15 Fremgangsmåde til overvågning af effekthalvlederkomponenter DK1414066T3 (da)

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DE10249712A DE10249712B3 (de) 2002-10-25 2002-10-25 Schaltungsanordnung und Verfahren zur Überwachung von Leistungshalbleiterbauelementen
DE10316357A DE10316357B4 (de) 2002-10-25 2003-04-10 Verfahren zur Überwachung von Leistungshalbleiterbauelementen

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US8853835B2 (en) 2012-10-05 2014-10-07 Infineon Technologies Ag Chip arrangements, a chip package and a method for manufacturing a chip arrangement
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IT1311277B1 (it) * 1999-12-23 2002-03-12 St Microelectronics Srl Dispositivo elettronico con collegamenti a doppio filo, metodo difabbricazione di tale dispositivo elettronico e metodo di verifica
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ATE438199T1 (de) 2009-08-15
EP1414066A1 (de) 2004-04-28
DE10316357A1 (de) 2004-11-04
DE10316357B4 (de) 2005-02-10
EP1414066B1 (de) 2009-07-29
ES2328124T3 (es) 2009-11-10

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