DK1138111T3 - Electrostatic retention device - Google Patents

Electrostatic retention device

Info

Publication number
DK1138111T3
DK1138111T3 DK99971977T DK99971977T DK1138111T3 DK 1138111 T3 DK1138111 T3 DK 1138111T3 DK 99971977 T DK99971977 T DK 99971977T DK 99971977 T DK99971977 T DK 99971977T DK 1138111 T3 DK1138111 T3 DK 1138111T3
Authority
DK
Denmark
Prior art keywords
electrodes
electrostatic
retention device
maintaining
treatment
Prior art date
Application number
DK99971977T
Other languages
Danish (da)
Inventor
Yvon Pellegrin
Jose Hernandez
Richard Claude
William Hale
Original Assignee
Semco Engineering S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semco Engineering S A filed Critical Semco Engineering S A
Application granted granted Critical
Publication of DK1138111T3 publication Critical patent/DK1138111T3/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Motor Or Generator Frames (AREA)
  • Excavating Of Shafts Or Tunnels (AREA)
  • Liquid Crystal (AREA)
  • Plasma Technology (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Materials For Medical Uses (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

The invention concerns an electrostatic maintaining device particularly designed for maintaining wafers made of conductor or semiconductor material such as silicon while they are being subjected to micromachining processes or any other type of treatment such as plasma treatment in a vacuum chamber for instance. The device consists of an electrically insulating surface beneath which are arranged at least two electrodes. The electrodes are powered by a direct current whereof the polarities are periodically inverted so as to release the accumulated static charges.
DK99971977T 1998-11-10 1999-11-10 Electrostatic retention device DK1138111T3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9814161A FR2785737B1 (en) 1998-11-10 1998-11-10 ELECTROSTATIC HOLDING DEVICE
PCT/FR1999/002767 WO2000028654A1 (en) 1998-11-10 1999-11-10 Electrostatic maintaining device

Publications (1)

Publication Number Publication Date
DK1138111T3 true DK1138111T3 (en) 2003-04-22

Family

ID=9532599

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99971977T DK1138111T3 (en) 1998-11-10 1999-11-10 Electrostatic retention device

Country Status (9)

Country Link
EP (1) EP1138111B1 (en)
JP (1) JP4763890B2 (en)
AT (1) ATE230526T1 (en)
AU (1) AU1166500A (en)
CA (1) CA2350653C (en)
DE (1) DE69904755T2 (en)
DK (1) DK1138111T3 (en)
FR (1) FR2785737B1 (en)
WO (1) WO2000028654A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7232591B2 (en) * 2002-04-09 2007-06-19 Matsushita Electric Industrial Co., Ltd. Method of using an adhesive for temperature control during plasma processing
FR2878371B1 (en) * 2004-11-25 2007-03-02 Semco Engineering Sa Sa ELECTROSTATIC HOLDING DEVICE WITH SEVERAL POWER SOURCES
JP6281825B2 (en) * 2013-03-29 2018-02-21 株式会社クリエイティブテクノロジー Chuck device
WO2017192911A1 (en) 2016-05-04 2017-11-09 Idea Pond Llc Adaptive flashlight control module

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724510A (en) * 1986-12-12 1988-02-09 Tegal Corporation Electrostatic wafer clamp
JPS63257481A (en) * 1987-04-14 1988-10-25 Abisare:Kk Static retainer
US5001594A (en) * 1989-09-06 1991-03-19 Mcnc Electrostatic handling device
JPH0435043A (en) * 1990-05-31 1992-02-05 Fujitsu Ltd Electrostatic chuck
US5055964A (en) * 1990-09-07 1991-10-08 International Business Machines Corporation Electrostatic chuck having tapered electrodes
JPH04132239A (en) * 1990-09-21 1992-05-06 Fujitsu Ltd Wafer chuck
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
EP0620953B1 (en) * 1992-11-06 1998-02-04 Varian Associates, Inc. Electrostatic wafer clamp
JPH0855900A (en) * 1994-08-11 1996-02-27 Fujitsu Ltd Electrostatic attraction method and its device and manufacture of semiconductor device
EP0871843B1 (en) * 1994-10-17 2003-05-14 Varian Semiconductor Equipment Associates Inc. Mounting member and method for clamping a flat thin conductive workpiece
JP3191139B2 (en) * 1994-12-14 2001-07-23 株式会社日立製作所 Sample holding device
JP3911787B2 (en) * 1996-09-19 2007-05-09 株式会社日立製作所 Sample processing apparatus and sample processing method

Also Published As

Publication number Publication date
ATE230526T1 (en) 2003-01-15
DE69904755T2 (en) 2003-10-16
DE69904755D1 (en) 2003-02-06
AU1166500A (en) 2000-05-29
JP4763890B2 (en) 2011-08-31
WO2000028654A1 (en) 2000-05-18
CA2350653C (en) 2008-01-15
JP2003520416A (en) 2003-07-02
EP1138111A1 (en) 2001-10-04
FR2785737A1 (en) 2000-05-12
EP1138111B1 (en) 2003-01-02
CA2350653A1 (en) 2000-05-18
FR2785737B1 (en) 2001-01-05

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