DK1075878T3 - Washers for use with ultra-liquid - Google Patents
Washers for use with ultra-liquidInfo
- Publication number
- DK1075878T3 DK1075878T3 DK00410075T DK00410075T DK1075878T3 DK 1075878 T3 DK1075878 T3 DK 1075878T3 DK 00410075 T DK00410075 T DK 00410075T DK 00410075 T DK00410075 T DK 00410075T DK 1075878 T3 DK1075878 T3 DK 1075878T3
- Authority
- DK
- Denmark
- Prior art keywords
- ultra
- washers
- liquid
- tub
- rinsing
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title abstract 3
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Weting (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
The rinsing tub using ultra pure liquids has a rinsing chamber (20) defined by a casing (14) with a perforated base (26) connected to a primary cleaning fluid reservoir. The rinsing chamber has projection nozzles (32,32a) for connection to a second reservoir and connected to the base. A deflector (16) adjacent to the edge recess (18) feeds the upwardly projected liquids toward the center of the tub
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9910532A FR2797405B1 (en) | 1999-08-12 | 1999-08-12 | ULTRA CLEAN LIQUID RINSING BIN |
Publications (2)
Publication Number | Publication Date |
---|---|
DK1075878T3 true DK1075878T3 (en) | 2004-03-29 |
DK1075878T5 DK1075878T5 (en) | 2004-05-10 |
Family
ID=9549172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK00410075T DK1075878T5 (en) | 1999-08-12 | 2000-07-12 | Washers for use with ultra-liquid |
Country Status (9)
Country | Link |
---|---|
US (1) | US6412504B1 (en) |
EP (1) | EP1075878B1 (en) |
JP (1) | JP2001102351A (en) |
KR (1) | KR20010050040A (en) |
AT (1) | ATE253990T1 (en) |
DE (1) | DE60006460T2 (en) |
DK (1) | DK1075878T5 (en) |
FR (1) | FR2797405B1 (en) |
TW (1) | TW478971B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1168422B1 (en) * | 2000-06-27 | 2009-12-16 | Imec | Method and apparatus for liquid-treating and drying a substrate |
KR20030028046A (en) * | 2001-09-27 | 2003-04-08 | 삼성전자주식회사 | Wet type apparatus for wafer treatment |
FR2833753B1 (en) * | 2001-12-18 | 2004-02-20 | Vaco Microtechnologies | DEVICE FOR ENGRAVING, RINSING, AND DRYING SUBSTRATES IN AN ULTRA-CLEAN ATMOSPHERE |
JP4514140B2 (en) * | 2005-02-28 | 2010-07-28 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
WO2009026805A1 (en) * | 2007-08-29 | 2009-03-05 | Shenzhen Jingrui Industry Co., Ltd. | Vegetable washing machine |
JP2009141022A (en) * | 2007-12-04 | 2009-06-25 | Tokyo Electron Ltd | Substrate processing apparatus |
WO2013028641A1 (en) * | 2011-08-19 | 2013-02-28 | Akrion Systems Llc | Reduced consumption stand alone rinse tool having self-contained closed-loop fluid circuit, and method of rinsing substrates using the same |
US8746260B2 (en) * | 2011-10-04 | 2014-06-10 | Phillip Alston Hewitt | System and method for cleaning tokens |
CN111069166A (en) * | 2019-12-18 | 2020-04-28 | 保山市嵘煌药业有限公司 | Yunnan sealwort processing equipment |
TWI726728B (en) * | 2020-05-22 | 2021-05-01 | 辛耘企業股份有限公司 | Wafer rinsing device |
US11682567B2 (en) | 2020-06-30 | 2023-06-20 | Applied Materials, Inc. | Cleaning system with in-line SPM processing |
CN118002546B (en) * | 2024-04-08 | 2024-06-04 | 江苏英思特半导体科技有限公司 | Automatic cleaning device for silicon wafer |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5415698A (en) * | 1992-06-29 | 1995-05-16 | Matsushita Electric Industrial Co., Ltd. | Method for cleaning semiconductor wafers |
JPH06177104A (en) * | 1992-10-08 | 1994-06-24 | Fuji Electric Co Ltd | Wafer cleaning equipment |
US5656097A (en) * | 1993-10-20 | 1997-08-12 | Verteq, Inc. | Semiconductor wafer cleaning system |
JP3146841B2 (en) * | 1994-03-28 | 2001-03-19 | 信越半導体株式会社 | Wafer rinse equipment |
US5520205A (en) * | 1994-07-01 | 1996-05-28 | Texas Instruments Incorporated | Apparatus for wafer cleaning with rotation |
JP3343775B2 (en) * | 1996-09-04 | 2002-11-11 | 東京エレクトロン株式会社 | Ultrasonic cleaning equipment |
JPH1116868A (en) * | 1997-06-27 | 1999-01-22 | Toshiba Corp | Method and equipment for replacing chemical |
US6138698A (en) * | 1997-11-20 | 2000-10-31 | Tokyo Electron Limited | Ultrasonic cleaning apparatus |
-
1999
- 1999-08-12 FR FR9910532A patent/FR2797405B1/en not_active Expired - Fee Related
-
2000
- 2000-07-12 DK DK00410075T patent/DK1075878T5/en active
- 2000-07-12 DE DE60006460T patent/DE60006460T2/en not_active Expired - Fee Related
- 2000-07-12 AT AT00410075T patent/ATE253990T1/en not_active IP Right Cessation
- 2000-07-12 EP EP00410075A patent/EP1075878B1/en not_active Expired - Lifetime
- 2000-07-17 US US09/618,061 patent/US6412504B1/en not_active Expired - Fee Related
- 2000-07-18 TW TW089114307A patent/TW478971B/en not_active IP Right Cessation
- 2000-08-08 JP JP2000239484A patent/JP2001102351A/en not_active Withdrawn
- 2000-08-10 KR KR1020000046319A patent/KR20010050040A/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE60006460D1 (en) | 2003-12-18 |
EP1075878B1 (en) | 2003-11-12 |
JP2001102351A (en) | 2001-04-13 |
TW478971B (en) | 2002-03-11 |
FR2797405A1 (en) | 2001-02-16 |
ATE253990T1 (en) | 2003-11-15 |
US6412504B1 (en) | 2002-07-02 |
EP1075878A1 (en) | 2001-02-14 |
DE60006460T2 (en) | 2004-08-26 |
DK1075878T5 (en) | 2004-05-10 |
FR2797405B1 (en) | 2001-10-26 |
KR20010050040A (en) | 2001-06-15 |
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