DK1075878T3 - Washers for use with ultra-liquid - Google Patents

Washers for use with ultra-liquid

Info

Publication number
DK1075878T3
DK1075878T3 DK00410075T DK00410075T DK1075878T3 DK 1075878 T3 DK1075878 T3 DK 1075878T3 DK 00410075 T DK00410075 T DK 00410075T DK 00410075 T DK00410075 T DK 00410075T DK 1075878 T3 DK1075878 T3 DK 1075878T3
Authority
DK
Denmark
Prior art keywords
ultra
washers
liquid
tub
rinsing
Prior art date
Application number
DK00410075T
Other languages
Danish (da)
Other versions
DK1075878T5 (en
Inventor
Victoria Oravec
Original Assignee
Vaco Microtechnologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vaco Microtechnologies filed Critical Vaco Microtechnologies
Publication of DK1075878T3 publication Critical patent/DK1075878T3/en
Application granted granted Critical
Publication of DK1075878T5 publication Critical patent/DK1075878T5/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Abstract

The rinsing tub using ultra pure liquids has a rinsing chamber (20) defined by a casing (14) with a perforated base (26) connected to a primary cleaning fluid reservoir. The rinsing chamber has projection nozzles (32,32a) for connection to a second reservoir and connected to the base. A deflector (16) adjacent to the edge recess (18) feeds the upwardly projected liquids toward the center of the tub
DK00410075T 1999-08-12 2000-07-12 Washers for use with ultra-liquid DK1075878T5 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9910532A FR2797405B1 (en) 1999-08-12 1999-08-12 ULTRA CLEAN LIQUID RINSING BIN

Publications (2)

Publication Number Publication Date
DK1075878T3 true DK1075878T3 (en) 2004-03-29
DK1075878T5 DK1075878T5 (en) 2004-05-10

Family

ID=9549172

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00410075T DK1075878T5 (en) 1999-08-12 2000-07-12 Washers for use with ultra-liquid

Country Status (9)

Country Link
US (1) US6412504B1 (en)
EP (1) EP1075878B1 (en)
JP (1) JP2001102351A (en)
KR (1) KR20010050040A (en)
AT (1) ATE253990T1 (en)
DE (1) DE60006460T2 (en)
DK (1) DK1075878T5 (en)
FR (1) FR2797405B1 (en)
TW (1) TW478971B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1168422B1 (en) * 2000-06-27 2009-12-16 Imec Method and apparatus for liquid-treating and drying a substrate
KR20030028046A (en) * 2001-09-27 2003-04-08 삼성전자주식회사 Wet type apparatus for wafer treatment
FR2833753B1 (en) * 2001-12-18 2004-02-20 Vaco Microtechnologies DEVICE FOR ENGRAVING, RINSING, AND DRYING SUBSTRATES IN AN ULTRA-CLEAN ATMOSPHERE
JP4514140B2 (en) * 2005-02-28 2010-07-28 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
WO2009026805A1 (en) * 2007-08-29 2009-03-05 Shenzhen Jingrui Industry Co., Ltd. Vegetable washing machine
JP2009141022A (en) * 2007-12-04 2009-06-25 Tokyo Electron Ltd Substrate processing apparatus
WO2013028641A1 (en) * 2011-08-19 2013-02-28 Akrion Systems Llc Reduced consumption stand alone rinse tool having self-contained closed-loop fluid circuit, and method of rinsing substrates using the same
US8746260B2 (en) * 2011-10-04 2014-06-10 Phillip Alston Hewitt System and method for cleaning tokens
CN111069166A (en) * 2019-12-18 2020-04-28 保山市嵘煌药业有限公司 Yunnan sealwort processing equipment
TWI726728B (en) * 2020-05-22 2021-05-01 辛耘企業股份有限公司 Wafer rinsing device
US11682567B2 (en) * 2020-06-30 2023-06-20 Applied Materials, Inc. Cleaning system with in-line SPM processing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5415698A (en) * 1992-06-29 1995-05-16 Matsushita Electric Industrial Co., Ltd. Method for cleaning semiconductor wafers
JPH06177104A (en) * 1992-10-08 1994-06-24 Fuji Electric Co Ltd Wafer cleaning equipment
US5656097A (en) * 1993-10-20 1997-08-12 Verteq, Inc. Semiconductor wafer cleaning system
JP3146841B2 (en) * 1994-03-28 2001-03-19 信越半導体株式会社 Wafer rinse equipment
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
JP3343775B2 (en) * 1996-09-04 2002-11-11 東京エレクトロン株式会社 Ultrasonic cleaning equipment
JPH1116868A (en) * 1997-06-27 1999-01-22 Toshiba Corp Method and equipment for replacing chemical
US6138698A (en) * 1997-11-20 2000-10-31 Tokyo Electron Limited Ultrasonic cleaning apparatus

Also Published As

Publication number Publication date
DE60006460T2 (en) 2004-08-26
TW478971B (en) 2002-03-11
DK1075878T5 (en) 2004-05-10
KR20010050040A (en) 2001-06-15
JP2001102351A (en) 2001-04-13
FR2797405B1 (en) 2001-10-26
FR2797405A1 (en) 2001-02-16
US6412504B1 (en) 2002-07-02
ATE253990T1 (en) 2003-11-15
EP1075878A1 (en) 2001-02-14
DE60006460D1 (en) 2003-12-18
EP1075878B1 (en) 2003-11-12

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