DK1051891T3 - Fremgangsmåde til fremstilling af en bærer forsynet med afskærmning mod forstyrrende stråling og afskærmningsmateriale - Google Patents

Fremgangsmåde til fremstilling af en bærer forsynet med afskærmning mod forstyrrende stråling og afskærmningsmateriale

Info

Publication number
DK1051891T3
DK1051891T3 DK99902935T DK99902935T DK1051891T3 DK 1051891 T3 DK1051891 T3 DK 1051891T3 DK 99902935 T DK99902935 T DK 99902935T DK 99902935 T DK99902935 T DK 99902935T DK 1051891 T3 DK1051891 T3 DK 1051891T3
Authority
DK
Denmark
Prior art keywords
shielding
manufacture
carrier provided
interfering radiation
against interfering
Prior art date
Application number
DK99902935T
Other languages
Danish (da)
English (en)
Inventor
Pieter Dick Bergshoeff
Jacob Joost Machielse
Stephanus Gerardus Blankenborg
Original Assignee
Stork Screens Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stork Screens Bv filed Critical Stork Screens Bv
Application granted granted Critical
Publication of DK1051891T3 publication Critical patent/DK1051891T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Air Bags (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Buffer Packaging (AREA)
  • Discharging, Photosensitive Material Shape In Electrophotography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Catalysts (AREA)
DK99902935T 1998-02-04 1999-02-03 Fremgangsmåde til fremstilling af en bærer forsynet med afskærmning mod forstyrrende stråling og afskærmningsmateriale DK1051891T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1008197A NL1008197C2 (nl) 1998-02-04 1998-02-04 Werkwijze voor het vervaardigen van een drager met een afscherming voor stoorstraling, alsmede afschermingsmateriaal.
PCT/NL1999/000056 WO1999040770A1 (en) 1998-02-04 1999-02-03 Method of fabricating a support provided with shielding against interfering radiation, and shielding material

Publications (1)

Publication Number Publication Date
DK1051891T3 true DK1051891T3 (da) 2002-09-09

Family

ID=19766459

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99902935T DK1051891T3 (da) 1998-02-04 1999-02-03 Fremgangsmåde til fremstilling af en bærer forsynet med afskærmning mod forstyrrende stråling og afskærmningsmateriale

Country Status (22)

Country Link
EP (1) EP1051891B1 (id)
JP (1) JP2002502729A (id)
KR (1) KR20010040649A (id)
CN (2) CN101119629A (id)
AT (1) ATE218031T1 (id)
AU (1) AU752537B2 (id)
BR (1) BR9909093A (id)
CA (1) CA2319322A1 (id)
DE (1) DE69901537T2 (id)
DK (1) DK1051891T3 (id)
ES (1) ES2178379T3 (id)
HU (1) HU222659B1 (id)
ID (1) ID28255A (id)
NL (1) NL1008197C2 (id)
NO (1) NO20003942L (id)
PL (1) PL342037A1 (id)
PT (1) PT1051891E (id)
RU (1) RU2217887C2 (id)
TR (1) TR200002277T2 (id)
TW (1) TW445205B (id)
WO (1) WO1999040770A1 (id)
ZA (1) ZA99881B (id)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004500714A (ja) 2000-02-28 2004-01-08 アメスベリー　グループ，　インコーポレイテッド Ｅｍｉシールドのための方法および装置
KR20020086586A (ko) * 2000-02-28 2002-11-18 아메스 베리 그룹, 인크 이엠아이 차폐부품 및 그 제조방법
NL1016549C2 (nl) * 2000-10-06 2002-04-10 Stork Screens Bv Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
US6376281B1 (en) 2000-10-27 2002-04-23 Honeywell International, Inc. Physical vapor deposition target/backing plate assemblies
CN100375675C (zh) * 2001-07-03 2008-03-19 贝卡尔特股份有限公司 一种制造层结构的方法
US6818291B2 (en) * 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
CN100418394C (zh) * 2006-09-14 2008-09-10 同济大学 一类无机非金属导电、电磁屏蔽粉体及其制备方法和应用
DE102007051482A1 (de) * 2007-10-25 2009-04-30 Evonik Röhm Gmbh Verfahren zur Herstellung von beschichteten Formkörpern
CN101998817A (zh) * 2009-08-12 2011-03-30 鸿富锦精密工业（深圳）有限公司 抗电磁干扰模塑件及其制备方法
AU2013327016A1 (en) * 2012-10-04 2015-04-30 Niitek, Inc. Shieldings for metal detector heads and manufacturing methods thereof
US20210195814A1 (en) * 2018-09-14 2021-06-24 Hewlett-Packard Development Company, L.P. Electronic devices with emi protection films

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB766257A (en) * 1953-08-25 1957-01-16 Edison Swan Electric Co Ltd Improvements relating to the coating of plastic material
US4403004A (en) * 1981-10-23 1983-09-06 Transfer Print Foils, Inc. Sandwich metalized resin laminate
JPS61205110A (ja) * 1985-03-08 1986-09-11 Dainippon Printing Co Ltd 電磁波シ−ルド性成型品の製造方法
JPH0218996A (ja) * 1988-07-06 1990-01-23 Mishima Kosan Co Ltd 金属めっきを施したアモルファス合金材料及びめっき方法
US5462771A (en) * 1992-11-09 1995-10-31 Akira Motoki Method of manufacturing electromagnetic wave shielding plastic molding
SE504039C2 (sv) * 1994-06-14 1996-10-21 Ericsson Telefon Ab L M Sätt att formspruta plast
DE19611137A1 (de) * 1996-03-21 1997-09-25 Lpw Anlagen Gmbh Verfahren zur galvanotechnischen Direktmetallisierung einer Kunststoffoberfläche

Also Published As

Publication number Publication date
ATE218031T1 (de) 2002-06-15
AU752537B2 (en) 2002-09-19
KR20010040649A (ko) 2001-05-15
ZA99881B (en) 1999-08-05
CA2319322A1 (en) 1999-08-12
BR9909093A (pt) 2000-12-05
EP1051891B1 (en) 2002-05-22
NO20003942L (no) 2000-10-04
TW445205B (en) 2001-07-11
CN1290473A (zh) 2001-04-04
ID28255A (id) 2001-05-10
WO1999040770A1 (en) 1999-08-12
TR200002277T2 (tr) 2000-11-21
HU222659B1 (hu) 2003-09-29
HUP0102091A3 (en) 2001-10-29
NL1008197C2 (nl) 1999-08-05
PT1051891E (pt) 2002-09-30
DE69901537D1 (de) 2002-06-27
RU2217887C2 (ru) 2003-11-27
AU2302399A (en) 1999-08-23
HUP0102091A2 (hu) 2001-09-28
EP1051891A1 (en) 2000-11-15
ES2178379T3 (es) 2002-12-16
DE69901537T2 (de) 2002-10-17
NO20003942D0 (no) 2000-08-03
PL342037A1 (en) 2001-05-21
CN101119629A (zh) 2008-02-06
JP2002502729A (ja) 2002-01-29

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