DK103277A - Halvlederbyggeelement med elektriske kontakter og fremgangsmade til fremstilling af sadanne kontakter - Google Patents

Halvlederbyggeelement med elektriske kontakter og fremgangsmade til fremstilling af sadanne kontakter

Info

Publication number
DK103277A
DK103277A DK103277A DK103277A DK103277A DK 103277 A DK103277 A DK 103277A DK 103277 A DK103277 A DK 103277A DK 103277 A DK103277 A DK 103277A DK 103277 A DK103277 A DK 103277A
Authority
DK
Denmark
Prior art keywords
contacts
procedure
making
construction element
semiconductor construction
Prior art date
Application number
DK103277A
Other languages
Danish (da)
English (en)
Inventor
W Heywang
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of DK103277A publication Critical patent/DK103277A/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01039—Yttrium [Y]
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/12033—Gunn diode
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Manufacture Of Switches (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
DK103277A 1976-03-12 1977-03-09 Halvlederbyggeelement med elektriske kontakter og fremgangsmade til fremstilling af sadanne kontakter DK103277A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762610539 DE2610539A1 (de) 1976-03-12 1976-03-12 Halbleiterbauelement mit elektrischen kontakten und verfahren zur herstellung solcher kontakte

Publications (1)

Publication Number Publication Date
DK103277A true DK103277A (da) 1977-09-13

Family

ID=5972327

Family Applications (1)

Application Number Title Priority Date Filing Date
DK103277A DK103277A (da) 1976-03-12 1977-03-09 Halvlederbyggeelement med elektriske kontakter og fremgangsmade til fremstilling af sadanne kontakter

Country Status (14)

Country Link
US (1) US4164811A (fr)
JP (1) JPS52111376A (fr)
AT (1) AT361983B (fr)
BE (1) BE852341A (fr)
CA (1) CA1065499A (fr)
CH (1) CH614071A5 (fr)
DE (1) DE2610539A1 (fr)
DK (1) DK103277A (fr)
FR (1) FR2344129A1 (fr)
GB (1) GB1531394A (fr)
IT (1) IT1077688B (fr)
MX (1) MX143414A (fr)
NL (1) NL7702439A (fr)
SE (1) SE7702371L (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103659U (fr) * 1977-01-25 1978-08-21
JPS5915376B2 (ja) * 1977-10-18 1984-04-09 信越ポリマ−株式会社 電子回路部品
GB2138205B (en) * 1983-04-13 1986-11-05 Philips Electronic Associated Methods of manufacturing a microwave circuit
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
DE69622412T2 (de) * 1995-08-29 2003-03-20 Minnesota Mining & Mfg Verfahren zur herstellung einer elektronischen anordnung mit klebeverbindung mittels eines nachgiebigen substrats
JP2006082479A (ja) * 2004-09-17 2006-03-30 Koito Mfg Co Ltd 車輌用灯具の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2990498A (en) * 1956-07-02 1961-06-27 Gen Electric Capacitor
US2977672A (en) * 1958-12-12 1961-04-04 Gen Electric Method of making bonded wire circuit
US3213404A (en) * 1961-08-01 1965-10-19 Thomas & Betts Corp Means for connecting electrical conductors
US3418444A (en) * 1963-10-21 1968-12-24 Elco Corp Method and apparatus for bonding through insulating material
US3300851A (en) * 1964-01-02 1967-01-31 Gen Electric Method of making bonded wire circuits
US3368276A (en) * 1964-08-03 1968-02-13 Coilcraft Inc Method for mounting a circuit element
US3390252A (en) * 1965-10-22 1968-06-25 Philco Ford Corp Electric heating tool
US4012833A (en) * 1973-12-28 1977-03-22 Sony Corporation Method of making display structure having light emitting diodes
US4024627A (en) * 1974-04-29 1977-05-24 Amp Incorporated Package mounting of electronic chips, such as light emitting diodes
US4079284A (en) * 1976-05-03 1978-03-14 U.S. Philips Corporation Mounting piezoelectric elements

Also Published As

Publication number Publication date
BE852341A (fr) 1977-07-01
ATA149277A (de) 1980-09-15
SE7702371L (sv) 1977-09-13
FR2344129B1 (fr) 1981-12-11
JPS52111376A (en) 1977-09-19
CH614071A5 (fr) 1979-10-31
IT1077688B (it) 1985-05-04
GB1531394A (en) 1978-11-08
FR2344129A1 (fr) 1977-10-07
AT361983B (de) 1981-04-10
CA1065499A (fr) 1979-10-30
DE2610539A1 (de) 1977-09-22
US4164811A (en) 1979-08-21
NL7702439A (nl) 1977-09-14
MX143414A (es) 1981-05-06

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