DK0662715T3 - Pakke til halvlederindretninger med parallelle delelementer og fremgangsmåde - Google Patents

Pakke til halvlederindretninger med parallelle delelementer og fremgangsmåde

Info

Publication number
DK0662715T3
DK0662715T3 DK94120975T DK94120975T DK0662715T3 DK 0662715 T3 DK0662715 T3 DK 0662715T3 DK 94120975 T DK94120975 T DK 94120975T DK 94120975 T DK94120975 T DK 94120975T DK 0662715 T3 DK0662715 T3 DK 0662715T3
Authority
DK
Denmark
Prior art keywords
elements
semiconductor device
device package
parallel sub
sub
Prior art date
Application number
DK94120975T
Other languages
English (en)
Inventor
Donald L Watrous
Victor A K Temple
Homer H Ii Glascock
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Application granted granted Critical
Publication of DK0662715T3 publication Critical patent/DK0662715T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
  • Die Bonding (AREA)
DK94120975T 1994-01-06 1994-12-30 Pakke til halvlederindretninger med parallelle delelementer og fremgangsmåde DK0662715T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/177,974 US5473193A (en) 1994-01-06 1994-01-06 Package for parallel subelement semiconductor devices

Publications (1)

Publication Number Publication Date
DK0662715T3 true DK0662715T3 (da) 2001-12-03

Family

ID=22650686

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94120975T DK0662715T3 (da) 1994-01-06 1994-12-30 Pakke til halvlederindretninger med parallelle delelementer og fremgangsmåde

Country Status (7)

Country Link
US (1) US5473193A (da)
EP (1) EP0662715B1 (da)
JP (1) JPH07254659A (da)
KR (1) KR950034710A (da)
CA (1) CA2139453A1 (da)
DE (1) DE69428770D1 (da)
DK (1) DK0662715T3 (da)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5767546A (en) * 1994-12-30 1998-06-16 Siliconix Incorporated Laternal power mosfet having metal strap layer to reduce distributed resistance
US5665996A (en) * 1994-12-30 1997-09-09 Siliconix Incorporated Vertical power mosfet having thick metal layer to reduce distributed resistance
US7692211B1 (en) * 2001-07-03 2010-04-06 Silicon Power Corporation Super GTO-based power blocks

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4007452A (en) * 1975-07-28 1977-02-08 Intel Corporation Wafer scale integration system
JPS57181131A (en) * 1981-04-30 1982-11-08 Toshiba Corp Pressure-contact type semiconductor device
JPS60239051A (ja) * 1984-05-11 1985-11-27 Mitsubishi Electric Corp 半導体装置
EP0244767A3 (en) * 1986-05-05 1988-08-03 Silicon Power Corporation Hermetic semiconductor enclosure and process of manufacture
JPS63278264A (ja) * 1987-05-08 1988-11-15 Mitsubishi Electric Corp Ｍｏｓｆｅｔモジユ−ル
US5038197A (en) * 1990-06-26 1991-08-06 Harris Semiconductor Patents, Inc. Hermetically sealed die package with floating source
DE59107655D1 (de) * 1991-02-22 1996-05-09 Asea Brown Boveri Abschaltbares Hochleistungs-Halbleiterbauelement
US5248901A (en) * 1992-01-21 1993-09-28 Harris Corporation Semiconductor devices and methods of assembly thereof

Also Published As

Publication number Publication date
JPH07254659A (ja) 1995-10-03
EP0662715A1 (en) 1995-07-12
DE69428770D1 (de) 2001-11-29
EP0662715B1 (en) 2001-10-24
KR950034710A (ko) 1995-12-28
US5473193A (en) 1995-12-05
CA2139453A1 (en) 1995-07-07

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