DE9312005U1 - ELECTRIC COMPONENT IN CHIP DESIGN - Google Patents

ELECTRIC COMPONENT IN CHIP DESIGN

Info

Publication number
DE9312005U1
DE9312005U1 DE9312005U DE9312005U DE9312005U1 DE 9312005 U1 DE9312005 U1 DE 9312005U1 DE 9312005 U DE9312005 U DE 9312005U DE 9312005 U DE9312005 U DE 9312005U DE 9312005 U1 DE9312005 U1 DE 9312005U1
Authority
DE
Germany
Prior art keywords
housing
cover
electrical component
chip design
electric component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9312005U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Siemens Matsushita Components GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components GmbH and Co KG filed Critical Siemens Matsushita Components GmbH and Co KG
Priority to DE9312005U priority Critical patent/DE9312005U1/en
Publication of DE9312005U1 publication Critical patent/DE9312005U1/en
Priority to FR9409517A priority patent/FR2711462B1/en
Priority to JP20025994A priority patent/JPH0766044A/en
Priority to CN94218668U priority patent/CN2225089Y/en
Priority to GB9416263A priority patent/GB2281447A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)

Description

6 1 5 O 6 DE6 1 5 O 6 EN

Siemens Matsushita Components GmbH & Co.KGSiemens Matsushita Components GmbH & Co.KG

Elektrisches Bauelement in Chip-Bauweise 5Electrical component in chip design 5

Die Erfindung betrifft ein elektrisches Bauelement in Chip-Bauweise, insbesondere Datenleitungsdrossel, das in ein durch einen Deckel verschlossenes Kunststoffgehäuse eingebaut ist.
10The invention relates to an electrical component in chip design, in particular a data line choke, which is installed in a plastic housing closed by a cover.
10

Aufgabe der Erfindung ist es, ein derartiges Gehäuse anzugeben, bei dem die zwei Gehäusehälften in einfacher Weise dicht miteinander verbunden sind.The object of the invention is to provide such a housing in which the two housing halves are connected to one another in a simple and sealed manner.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß am Gehäuse und/oder am Deckel Energierichtungsgeber angeordnet sind und daß Gehäuse und Deckel mittels einer Ultraschall-Schweißung dicht miteinander verbunden sind.This object is achieved according to the invention in that energy directors are arranged on the housing and/or on the cover and in that the housing and cover are tightly connected to one another by means of ultrasonic welding.

0 Vorteilhafterweise bestehen Gehäuse und Deckel aus einem temperaturbeständigen Material, vorzugsweise aus PoIyphenylensulfid (PPS).0 The housing and cover are advantageously made of a temperature-resistant material, preferably polyphenylene sulfide (PPS).

Ferner können beispielsweise flach ausgebildete Anschlußelemente direkt im Gehäuse eingespritzt sein.Furthermore, flat connection elements can be injected directly into the housing.

Die Erfindung wird anhand der folgenden Ausführungsbeispiele erläutert.The invention is explained using the following embodiments.

In der dazugehörenden Zeichnung zeigenIn the accompanying drawing,

FIG 1 ein in ein Gehäuse eingebautes elektrisches BauelementFIG 1 an electrical component installed in a housing

G 1 5 O 6 DEG 1 5 O 6 EN

FIG 2 einen Gehäusedeckel mit Energierichtungsgeber.FIG 2 a housing cover with energy director.

In der FIG 1 ist ein elektrisches Bauelement 1, beispielsweise eine Datenleitungsdrossel, dargestellt, die in ein Gehäuse eingebaut ist, das aus einem becherförmigen Teil 2 und einem Deckel 3 besteht, die an einer Stelle 4 durch eine Ultraschall-Schweißung dicht miteinander verbunden sind. Im becherförmigen Gehäuseteil 2 sind Anschlußelemente 5 eingespritzt, die vorzugsweise flach ausgebildet sind, wobei im Fall eines Bauelementes 1, das als Datenleitungsdrossel ausgebildet ist, vier Anschlußelemente 5 vorhanden sind. An ihren oberen Enden 6 werden die Wicklungen der Drossel 1 angeschlossen, was in der FIG 1 nicht dargestellt ist.FIG 1 shows an electrical component 1, for example a data line choke, which is installed in a housing consisting of a cup-shaped part 2 and a cover 3, which are tightly connected to one another at one point 4 by ultrasonic welding. Connection elements 5 are injected into the cup-shaped housing part 2, which are preferably flat, whereby in the case of a component 1 that is designed as a data line choke, there are four connection elements 5. The windings of the choke 1 are connected to their upper ends 6, which is not shown in FIG 1.

In der FIG 2 ist ein Deckel 3 dargestellt, der an seinen zu verschweißenden Randbereichen einen Energierichtungsgeber 7 besitzt.FIG 2 shows a cover 3 which has an energy director 7 on its edge areas to be welded.

Diese Energierichtungsgeber können aber auch im Randbereich des becherförmigen Gehäuseteils 2 angeordnet sein und ermöglichen eine Nahfeldschweißung.However, these energy directors can also be arranged in the edge area of the cup-shaped housing part 2 and enable near-field welding.

Claims (4)

G 1 5 O 6 DE SchutzansprücheG 1 5 O 6 DE Protection claims 1. Elektrisches Bauelement in Chipbauweise, insbesondere Datenleitungsdrossel, das in ein durch einen Deckel verschlossenes Kunststoffgehäuse eingebaut ist, dadurch gekennzeichnet, daß am Gehäuse (2) und/oder am Deckel (3) Energierichtungsgeber (7) angeordnet sind, und daß Gehäuse (2) und Deckel (3) mittels einer Ultraschall-Schweißung (4) dicht miteinander verbunden sind.1. Electrical component in chip design, in particular a data line choke, which is installed in a plastic housing closed by a cover, characterized in that energy directors (7) are arranged on the housing (2) and/or on the cover (3), and that the housing (2) and cover (3) are tightly connected to one another by means of an ultrasonic weld (4). 2. Elektrisches Bauelement nach Anspruch 1, dadurch gekennzeichnet, daß Gehäuse (2) und Deckel (3) aus einem temperaturbeständigen Material, vorzugsweise aus Polyphenylensulfid (PPS), bestehen.2. Electrical component according to claim 1, characterized in that the housing (2) and cover (3) consist of a temperature-resistant material, preferably polyphenylene sulfide (PPS). 3. Elektrisches Bauelement nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß Anschlußelemente (5) im Gehäuse (2) eingespritzt sind.3. Electrical component according to claim 1 or 2, characterized in that connection elements (5) are injected into the housing (2). 4. Elektrisches Bauelement nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Anschlußelemente (5) flach ausgebildet sind.4. Electrical component according to one of claims 1 to 3, characterized in that the connection elements (5) are flat.
DE9312005U 1993-08-11 1993-08-11 ELECTRIC COMPONENT IN CHIP DESIGN Expired - Lifetime DE9312005U1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE9312005U DE9312005U1 (en) 1993-08-11 1993-08-11 ELECTRIC COMPONENT IN CHIP DESIGN
FR9409517A FR2711462B1 (en) 1993-08-11 1994-08-01 Electrical component produced in the manner of a microchip.
JP20025994A JPH0766044A (en) 1993-08-11 1994-08-03 Electrical part of chip form
CN94218668U CN2225089Y (en) 1993-08-11 1994-08-11 Electric component in chips
GB9416263A GB2281447A (en) 1993-08-11 1994-08-11 Electrical component in an ultrasonic welded plastic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9312005U DE9312005U1 (en) 1993-08-11 1993-08-11 ELECTRIC COMPONENT IN CHIP DESIGN

Publications (1)

Publication Number Publication Date
DE9312005U1 true DE9312005U1 (en) 1993-09-23

Family

ID=6896663

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9312005U Expired - Lifetime DE9312005U1 (en) 1993-08-11 1993-08-11 ELECTRIC COMPONENT IN CHIP DESIGN

Country Status (5)

Country Link
JP (1) JPH0766044A (en)
CN (1) CN2225089Y (en)
DE (1) DE9312005U1 (en)
FR (1) FR2711462B1 (en)
GB (1) GB2281447A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19752847A1 (en) * 1997-11-28 1999-06-10 Siemens Matsushita Components Chip-type toroidal core choke e.g. for data and signal transmission lines

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1498439A (en) * 1976-04-27 1978-01-18 Welwyn Electric Ltd Electronic component or assembly of components with insulating envelope
DE2844830C3 (en) * 1978-10-14 1981-07-09 Standard Elektrik Lorenz Ag, 7000 Stuttgart Method for manufacturing a capacitor with a closed plastic housing formed from two half-shells
DD157841A1 (en) * 1981-03-31 1982-12-08 Gerhard Hoffmann METHOD FOR THE PLASTERING OF ELECTRONIC COMPONENTS
US4490706A (en) * 1981-07-09 1984-12-25 Tdk Corporation Electronic parts
US4628148A (en) * 1984-03-27 1986-12-09 Toko, Inc. Encapsulated electronic circuit
DE3515772C2 (en) * 1985-05-02 1995-05-11 Bosch Gmbh Robert Housing consisting of two housing shells
JPS6237950A (en) * 1985-08-12 1987-02-18 Matsushita Electronics Corp Electronic-part mounting package
NO911774D0 (en) * 1991-05-06 1991-05-06 Sensonor As DEVICE FOR ENCAPLING A FUNCTIONAL ORGANIZATION AND PROCEDURE FOR PRODUCING THE SAME.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19752847A1 (en) * 1997-11-28 1999-06-10 Siemens Matsushita Components Chip-type toroidal core choke e.g. for data and signal transmission lines
DE19752847C2 (en) * 1997-11-28 1999-12-09 Siemens Matsushita Components Data line choke in chip design

Also Published As

Publication number Publication date
FR2711462B1 (en) 1996-02-02
GB2281447A (en) 1995-03-01
GB9416263D0 (en) 1994-10-05
CN2225089Y (en) 1996-04-17
JPH0766044A (en) 1995-03-10
FR2711462A1 (en) 1995-04-28

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