DE9308380U1 - Vorrichtung zum Kühlen eines Prozessors - Google Patents
Vorrichtung zum Kühlen eines ProzessorsInfo
- Publication number
- DE9308380U1 DE9308380U1 DE9308380U DE9308380U DE9308380U1 DE 9308380 U1 DE9308380 U1 DE 9308380U1 DE 9308380 U DE9308380 U DE 9308380U DE 9308380 U DE9308380 U DE 9308380U DE 9308380 U1 DE9308380 U1 DE 9308380U1
- Authority
- DE
- Germany
- Prior art keywords
- cooling device
- processor cooling
- processor
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9308380U DE9308380U1 (de) | 1993-06-04 | 1993-06-04 | Vorrichtung zum Kühlen eines Prozessors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9308380U DE9308380U1 (de) | 1993-06-04 | 1993-06-04 | Vorrichtung zum Kühlen eines Prozessors |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9308380U1 true DE9308380U1 (de) | 1993-10-07 |
Family
ID=6894049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9308380U Expired - Lifetime DE9308380U1 (de) | 1993-06-04 | 1993-06-04 | Vorrichtung zum Kühlen eines Prozessors |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9308380U1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013005114A1 (de) * | 2013-03-18 | 2014-09-18 | ARCTIC (HK) Limited | Vorrichtung zum Kühlen eines elektronischen Bauteils auf einer Leiterplatte |
-
1993
- 1993-06-04 DE DE9308380U patent/DE9308380U1/de not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013005114A1 (de) * | 2013-03-18 | 2014-09-18 | ARCTIC (HK) Limited | Vorrichtung zum Kühlen eines elektronischen Bauteils auf einer Leiterplatte |
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