DE9301744U1 - Kühlvorrichtung für Mikroprozessor - Google Patents

Kühlvorrichtung für Mikroprozessor

Info

Publication number
DE9301744U1
DE9301744U1 DE9301744U DE9301744U DE9301744U1 DE 9301744 U1 DE9301744 U1 DE 9301744U1 DE 9301744 U DE9301744 U DE 9301744U DE 9301744 U DE9301744 U DE 9301744U DE 9301744 U1 DE9301744 U1 DE 9301744U1
Authority
DE
Germany
Prior art keywords
cooling device
fan
heat sink
vibration
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9301744U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOFFMANN PETER 5840 SCHWERTE DE
Original Assignee
HOFFMANN PETER 5840 SCHWERTE DE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOFFMANN PETER 5840 SCHWERTE DE filed Critical HOFFMANN PETER 5840 SCHWERTE DE
Priority to DE9301744U priority Critical patent/DE9301744U1/de
Publication of DE9301744U1 publication Critical patent/DE9301744U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE9301744U 1993-02-09 1993-02-09 Kühlvorrichtung für Mikroprozessor Expired - Lifetime DE9301744U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9301744U DE9301744U1 (de) 1993-02-09 1993-02-09 Kühlvorrichtung für Mikroprozessor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9301744U DE9301744U1 (de) 1993-02-09 1993-02-09 Kühlvorrichtung für Mikroprozessor

Publications (1)

Publication Number Publication Date
DE9301744U1 true DE9301744U1 (de) 1993-04-01

Family

ID=6889128

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9301744U Expired - Lifetime DE9301744U1 (de) 1993-02-09 1993-02-09 Kühlvorrichtung für Mikroprozessor

Country Status (1)

Country Link
DE (1) DE9301744U1 (he)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632500A1 (en) * 1993-05-27 1995-01-04 Nippon Densan Corporation Heat sink fan
EP0641023A1 (en) * 1993-08-25 1995-03-01 International Business Machines Corporation Convertible cooling module for air or water cooling of electronic circuit components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632500A1 (en) * 1993-05-27 1995-01-04 Nippon Densan Corporation Heat sink fan
US5484013A (en) * 1993-05-27 1996-01-16 Nippon Densan Corporation Heat sink fan
EP0641023A1 (en) * 1993-08-25 1995-03-01 International Business Machines Corporation Convertible cooling module for air or water cooling of electronic circuit components

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