DE9301744U1 - Kühlvorrichtung für Mikroprozessor - Google Patents
Kühlvorrichtung für MikroprozessorInfo
- Publication number
- DE9301744U1 DE9301744U1 DE9301744U DE9301744U DE9301744U1 DE 9301744 U1 DE9301744 U1 DE 9301744U1 DE 9301744 U DE9301744 U DE 9301744U DE 9301744 U DE9301744 U DE 9301744U DE 9301744 U1 DE9301744 U1 DE 9301744U1
- Authority
- DE
- Germany
- Prior art keywords
- cooling device
- fan
- heat sink
- vibration
- clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims description 15
- 238000013016 damping Methods 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000000872 buffer Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9301744U DE9301744U1 (de) | 1993-02-09 | 1993-02-09 | Kühlvorrichtung für Mikroprozessor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9301744U DE9301744U1 (de) | 1993-02-09 | 1993-02-09 | Kühlvorrichtung für Mikroprozessor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE9301744U1 true DE9301744U1 (de) | 1993-04-01 |
Family
ID=6889128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE9301744U Expired - Lifetime DE9301744U1 (de) | 1993-02-09 | 1993-02-09 | Kühlvorrichtung für Mikroprozessor |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE9301744U1 (da) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0632500A1 (en) * | 1993-05-27 | 1995-01-04 | Nippon Densan Corporation | Heat sink fan |
| EP0641023A1 (en) * | 1993-08-25 | 1995-03-01 | International Business Machines Corporation | Convertible cooling module for air or water cooling of electronic circuit components |
-
1993
- 1993-02-09 DE DE9301744U patent/DE9301744U1/de not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0632500A1 (en) * | 1993-05-27 | 1995-01-04 | Nippon Densan Corporation | Heat sink fan |
| US5484013A (en) * | 1993-05-27 | 1996-01-16 | Nippon Densan Corporation | Heat sink fan |
| EP0641023A1 (en) * | 1993-08-25 | 1995-03-01 | International Business Machines Corporation | Convertible cooling module for air or water cooling of electronic circuit components |
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