DE9101744U1 - - Google Patents
Info
- Publication number
- DE9101744U1 DE9101744U1 DE9101744U DE9101744U DE9101744U1 DE 9101744 U1 DE9101744 U1 DE 9101744U1 DE 9101744 U DE9101744 U DE 9101744U DE 9101744 U DE9101744 U DE 9101744U DE 9101744 U1 DE9101744 U1 DE 9101744U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/284—Electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9101744U DE9101744U1 (fr) | 1991-02-15 | 1991-02-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9101744U DE9101744U1 (fr) | 1991-02-15 | 1991-02-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9101744U1 true DE9101744U1 (fr) | 1991-05-08 |
Family
ID=6864307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9101744U Expired - Lifetime DE9101744U1 (fr) | 1991-02-15 | 1991-02-15 |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9101744U1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19739011A1 (de) * | 1997-09-06 | 1999-03-18 | Telefunken Microelectron | Elektronische Baugruppe mit optimiertem Bauelementeträger |
DE19902950A1 (de) * | 1998-06-24 | 1999-12-30 | Wuerth Elektronik Gmbh & Co Kg | Verfahren zum Herstellen einer Leiterplatte und Leiterplatte |
DE10118009A1 (de) * | 2001-04-10 | 2002-10-17 | Endress & Hauser Gmbh & Co Kg | Vorrichtung zur Bestimmung und/oder Überwachung des Füllstands eines Füllguts in einem Behälter |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2460635A1 (de) * | 1974-12-20 | 1976-06-24 | Siemens Ag | Elektronische baugruppe fuer den vhf- und uhf-bereich |
DE2554965C2 (fr) * | 1974-12-20 | 1987-11-12 | International Business Machines Corp., Armonk, N.Y., Us | |
DE3744617A1 (de) * | 1987-12-31 | 1989-07-13 | Bosch Gmbh Robert | Kontaktierteil |
DE3939911A1 (de) * | 1988-12-16 | 1990-06-21 | Gen Electric | Fluessigkeitssensor mit hoher empfindlichkeit bei fast leerem behaelter |
-
1991
- 1991-02-15 DE DE9101744U patent/DE9101744U1/de not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2460635A1 (de) * | 1974-12-20 | 1976-06-24 | Siemens Ag | Elektronische baugruppe fuer den vhf- und uhf-bereich |
DE2554965C2 (fr) * | 1974-12-20 | 1987-11-12 | International Business Machines Corp., Armonk, N.Y., Us | |
DE3744617A1 (de) * | 1987-12-31 | 1989-07-13 | Bosch Gmbh Robert | Kontaktierteil |
DE3939911A1 (de) * | 1988-12-16 | 1990-06-21 | Gen Electric | Fluessigkeitssensor mit hoher empfindlichkeit bei fast leerem behaelter |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19739011A1 (de) * | 1997-09-06 | 1999-03-18 | Telefunken Microelectron | Elektronische Baugruppe mit optimiertem Bauelementeträger |
DE19902950A1 (de) * | 1998-06-24 | 1999-12-30 | Wuerth Elektronik Gmbh & Co Kg | Verfahren zum Herstellen einer Leiterplatte und Leiterplatte |
DE10118009A1 (de) * | 2001-04-10 | 2002-10-17 | Endress & Hauser Gmbh & Co Kg | Vorrichtung zur Bestimmung und/oder Überwachung des Füllstands eines Füllguts in einem Behälter |
DE10118009B4 (de) * | 2001-04-10 | 2006-12-14 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung zur Bestimmung und/oder Überwachung des Füllstands eines Füllguts in einem Behälter |