DE9100864U1 - Flüssigkeitskühlkörper - Google Patents
FlüssigkeitskühlkörperInfo
- Publication number
- DE9100864U1 DE9100864U1 DE9100864U DE9100864U DE9100864U1 DE 9100864 U1 DE9100864 U1 DE 9100864U1 DE 9100864 U DE9100864 U DE 9100864U DE 9100864 U DE9100864 U DE 9100864U DE 9100864 U1 DE9100864 U1 DE 9100864U1
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- liquid cooling
- cooling body
- chamber
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 title claims description 50
- 238000001816 cooling Methods 0.000 claims description 114
- 239000002826 coolant Substances 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 12
- 238000005192 partition Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000110 cooling liquid Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9100864U DE9100864U1 (de) | 1991-01-25 | 1991-01-25 | Flüssigkeitskühlkörper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9100864U DE9100864U1 (de) | 1991-01-25 | 1991-01-25 | Flüssigkeitskühlkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9100864U1 true DE9100864U1 (de) | 1991-04-18 |
Family
ID=6863686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9100864U Expired - Lifetime DE9100864U1 (de) | 1991-01-25 | 1991-01-25 | Flüssigkeitskühlkörper |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9100864U1 (ru) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4131739A1 (de) * | 1991-09-24 | 1993-04-01 | Behr Industrietech Gmbh & Co | Kuehleinrichtung fuer elektrische bauelemente |
DE4322665A1 (de) * | 1992-07-16 | 1994-01-20 | Fuji Electric Co Ltd | Kühlvorrichtung für eine Halbleiterleistungsvorrichtung |
EP0611235A1 (fr) * | 1993-02-12 | 1994-08-17 | FERRAZ Société Anonyme | Echangeur de chaleur pour composants électroniques et appareillages électrotechniques |
DE4322933A1 (de) * | 1993-07-09 | 1995-01-12 | Abb Patent Gmbh | Flüssigkeitskühlkörper mit hydraulischem Kühlmittelanschluß |
-
1991
- 1991-01-25 DE DE9100864U patent/DE9100864U1/de not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4131739A1 (de) * | 1991-09-24 | 1993-04-01 | Behr Industrietech Gmbh & Co | Kuehleinrichtung fuer elektrische bauelemente |
DE4322665A1 (de) * | 1992-07-16 | 1994-01-20 | Fuji Electric Co Ltd | Kühlvorrichtung für eine Halbleiterleistungsvorrichtung |
EP0611235A1 (fr) * | 1993-02-12 | 1994-08-17 | FERRAZ Société Anonyme | Echangeur de chaleur pour composants électroniques et appareillages électrotechniques |
FR2701554A1 (fr) * | 1993-02-12 | 1994-08-19 | Transcal | Echangeur de chaleur pour composants électroniques et appareillages électro-techniques. |
DE4322933A1 (de) * | 1993-07-09 | 1995-01-12 | Abb Patent Gmbh | Flüssigkeitskühlkörper mit hydraulischem Kühlmittelanschluß |
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