DE9017728U1 - Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen - Google Patents
Zerstäubungskatode für die Beschichtung von Substraten in KatodenzerstäubungsanlagenInfo
- Publication number
- DE9017728U1 DE9017728U1 DE9017728U DE9017728U DE9017728U1 DE 9017728 U1 DE9017728 U1 DE 9017728U1 DE 9017728 U DE9017728 U DE 9017728U DE 9017728 U DE9017728 U DE 9017728U DE 9017728 U1 DE9017728 U1 DE 9017728U1
- Authority
- DE
- Germany
- Prior art keywords
- sputtering
- cathode
- target
- projections
- sputtering surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004544 sputter deposition Methods 0.000 title claims description 53
- 239000011248 coating agent Substances 0.000 title claims description 8
- 238000000576 coating method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 title claims description 8
- 230000005291 magnetic effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000013077 target material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000000889 atomisation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 206010041662 Splinter Diseases 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9017728U DE9017728U1 (de) | 1990-12-31 | 1990-12-31 | Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4042286A DE4042286C1 (ko) | 1990-12-31 | 1990-12-31 | |
DE9017728U DE9017728U1 (de) | 1990-12-31 | 1990-12-31 | Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9017728U1 true DE9017728U1 (de) | 1991-11-14 |
Family
ID=25899901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9017728U Expired - Lifetime DE9017728U1 (de) | 1990-12-31 | 1990-12-31 | Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9017728U1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0625792A1 (en) * | 1993-05-19 | 1994-11-23 | Applied Materials, Inc. | Apparatus and process for increasing uniformity of sputtering rate in sputtering apparatus |
FR2707670A1 (fr) * | 1993-07-15 | 1995-01-20 | Balzers Hochvakuum | Cible pour installations de pulvérisation cathodique. |
WO1997039161A1 (de) * | 1996-04-13 | 1997-10-23 | Singulus Technologies Ag | Vorrichtung zur kathodenzerstäubung |
-
1990
- 1990-12-31 DE DE9017728U patent/DE9017728U1/de not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0625792A1 (en) * | 1993-05-19 | 1994-11-23 | Applied Materials, Inc. | Apparatus and process for increasing uniformity of sputtering rate in sputtering apparatus |
US5538603A (en) * | 1993-05-19 | 1996-07-23 | Applied Materials, Inc. | Apparatus and process for increasing uniformity of sputtering rate in sputtering apparatus |
FR2707670A1 (fr) * | 1993-07-15 | 1995-01-20 | Balzers Hochvakuum | Cible pour installations de pulvérisation cathodique. |
WO1997039161A1 (de) * | 1996-04-13 | 1997-10-23 | Singulus Technologies Ag | Vorrichtung zur kathodenzerstäubung |
US6096180A (en) * | 1996-04-13 | 2000-08-01 | Singulus Technologies Ag | Cathodic sputtering device |
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