DE9017728U1 - Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen - Google Patents

Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen

Info

Publication number
DE9017728U1
DE9017728U1 DE9017728U DE9017728U DE9017728U1 DE 9017728 U1 DE9017728 U1 DE 9017728U1 DE 9017728 U DE9017728 U DE 9017728U DE 9017728 U DE9017728 U DE 9017728U DE 9017728 U1 DE9017728 U1 DE 9017728U1
Authority
DE
Germany
Prior art keywords
sputtering
cathode
target
projections
sputtering surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9017728U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold AG filed Critical Leybold AG
Priority to DE9017728U priority Critical patent/DE9017728U1/de
Priority claimed from DE4042286A external-priority patent/DE4042286C1/de
Publication of DE9017728U1 publication Critical patent/DE9017728U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE9017728U 1990-12-31 1990-12-31 Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen Expired - Lifetime DE9017728U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9017728U DE9017728U1 (de) 1990-12-31 1990-12-31 Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4042286A DE4042286C1 (ko) 1990-12-31 1990-12-31
DE9017728U DE9017728U1 (de) 1990-12-31 1990-12-31 Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen

Publications (1)

Publication Number Publication Date
DE9017728U1 true DE9017728U1 (de) 1991-11-14

Family

ID=25899901

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9017728U Expired - Lifetime DE9017728U1 (de) 1990-12-31 1990-12-31 Zerstäubungskatode für die Beschichtung von Substraten in Katodenzerstäubungsanlagen

Country Status (1)

Country Link
DE (1) DE9017728U1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0625792A1 (en) * 1993-05-19 1994-11-23 Applied Materials, Inc. Apparatus and process for increasing uniformity of sputtering rate in sputtering apparatus
FR2707670A1 (fr) * 1993-07-15 1995-01-20 Balzers Hochvakuum Cible pour installations de pulvérisation cathodique.
WO1997039161A1 (de) * 1996-04-13 1997-10-23 Singulus Technologies Ag Vorrichtung zur kathodenzerstäubung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0625792A1 (en) * 1993-05-19 1994-11-23 Applied Materials, Inc. Apparatus and process for increasing uniformity of sputtering rate in sputtering apparatus
US5538603A (en) * 1993-05-19 1996-07-23 Applied Materials, Inc. Apparatus and process for increasing uniformity of sputtering rate in sputtering apparatus
FR2707670A1 (fr) * 1993-07-15 1995-01-20 Balzers Hochvakuum Cible pour installations de pulvérisation cathodique.
WO1997039161A1 (de) * 1996-04-13 1997-10-23 Singulus Technologies Ag Vorrichtung zur kathodenzerstäubung
US6096180A (en) * 1996-04-13 2000-08-01 Singulus Technologies Ag Cathodic sputtering device

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