DE875472C - Method for connecting metal parts with bodies made of metallized, ceramic material or glass by soldering - Google Patents

Method for connecting metal parts with bodies made of metallized, ceramic material or glass by soldering

Info

Publication number
DE875472C
DE875472C DER5105A DER0005105A DE875472C DE 875472 C DE875472 C DE 875472C DE R5105 A DER5105 A DE R5105A DE R0005105 A DER0005105 A DE R0005105A DE 875472 C DE875472 C DE 875472C
Authority
DE
Germany
Prior art keywords
soldering
metallized
glass
metal
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DER5105A
Other languages
German (de)
Inventor
Josef Klar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROEDERSTEIN KONDENSATOREN
Ernst Roederstein Spezialfabrik fuer Kondensatoren GmbH
Original Assignee
ROEDERSTEIN KONDENSATOREN
Ernst Roederstein Spezialfabrik fuer Kondensatoren GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROEDERSTEIN KONDENSATOREN, Ernst Roederstein Spezialfabrik fuer Kondensatoren GmbH filed Critical ROEDERSTEIN KONDENSATOREN
Priority to DER5105A priority Critical patent/DE875472C/en
Application granted granted Critical
Publication of DE875472C publication Critical patent/DE875472C/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/20—Uniting glass pieces by fusing without substantial reshaping
    • C03B23/207—Uniting glass rods, glass tubes, or hollow glassware

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)

Description

Verfahren zum Verbinden von Metallteilen mit Körpern aus metallisiertem, keramischem Stoff oder Glas durch Löten Leim Löten von metallisierten Keramikrohren besteht die Schwierigkeit, eine vakuumdichte Lötverbindung zwischen Rohr und Kappe ohne nennenswerten Ausschuß herzustellen. Durch das Löten mittels Lötkolben muß wesentlich mehr Kontaktwärme übertragen werden, als zum Schmelzen des Zinns notwendig ist, wodurch die metallisierte Schicht leicht überhitzt wird, mit dem Zinn amalgamiert und sich stellenweise oder ganz ablöst. Die gleiche Erscheinung zeigt sich beim Löten mittels direkter oder indirekter Widerstandserwärmung. Diese Nachteile können behoben werden, wenn man ein regelbares Hochfrequenzfeld zum Erhitzen der Metallkappe verwendet, welches so ausgebildet und bemessen ist, daß die Eindringtiefe der Hochfrequenz in einem entsprechenden Verhältnis zwischen Kappenstärke und metallisierter Schicht steht, wobei die Kappe wesentlich mehr als die metallisierte Schicht erhitzt wird.Process for connecting metal parts with bodies made of metallized, ceramic material or glass by soldering glue soldering of metallized ceramic tubes there is the difficulty of creating a vacuum-tight soldered connection between the tube and the cap without producing significant rejects. By soldering with a soldering iron must significantly more contact heat is transferred than is necessary to melt the tin is amalgamated with the tin, causing the metallized layer to be slightly overheated and separates in places or entirely. The same phenomenon can be seen in the Soldering by means of direct or indirect resistance heating. These disadvantages can can be remedied if you have an adjustable high frequency field to heat the metal cap used, which is designed and dimensioned so that the penetration depth of the high frequency in a corresponding ratio between cap thickness and metallized layer stands, with the cap being heated significantly more than the metallized layer.

Wenn man nun einen Ring, z. B. aus Zinn, in die Kappe legt oder über das keramische Rohr auf den Metallrand schiebt, schmilzt im Hochfrequenzfeld zuerst das Zinn und übernimmt die zusätzliche Erwärmung der Metallschicht, wodurch eine einwandfreie Lötung ohne Zerstörungserscheinungen der Metallschicht gewährleistet wird.If you now have a ring, e.g. B. made of tin, in the cap or over pushing the ceramic tube onto the metal edge, it melts first in the high-frequency field the tin and takes on the extra Heating of the metal layer, resulting in perfect soldering without any signs of destruction of the metal layer is guaranteed.

Analog verhalten sich im Hochfrequenzfeld Metallrohre, in welche keramische oder Glasdurchführungen eingelötet werden. Der Lötvorgang wird durch Zeitschalter oder empirisch gesteuert.In the high-frequency field, metal pipes behave analogously, and in which ceramic pipes or glass feedthroughs are soldered in. The soldering process is controlled by time switches or controlled empirically.

Das erfindungsgemäße Verfahren ist besonders geeignet zum Löten von dichten Rohrkondensatoren in metallisiertem Keramik- oder Metallrohr.The inventive method is particularly suitable for soldering sealed tube capacitors in a metallized ceramic or metal tube.

Claims (5)

PATENTANSPRÜCHE: i. Verfahren zum Verbinden von Metallteilen mit Körpern aus metallisiertem, keramischem Stoff oder Glas, z. B. Rohren, dadurch gekennzeichnet, daß die für den Lötprozeß erforderliche Hitze in einem regelbaren Hochfrequenzfeld erzeugt wird, das so bemessen ist, daß die Eindringtiefe der Hochfrequenz in einem entsprechenden Verhältnis zwischen .der Stärke des Metallteils und der metallisierten Schicht steht und ersterer wesentlich stärker erhitzt wird als letztere. PATENT CLAIMS: i. Method for joining metal parts to bodies made of metallized, ceramic material or glass, e.g. B. pipes, characterized in that that the heat required for the soldering process in an adjustable high-frequency field is generated, which is dimensioned so that the depth of penetration of the high frequency in one corresponding ratio between .the thickness of the metal part and the metallized Layer is standing and the former is heated much more strongly than the latter. 2. Verfahren nach Anspruch i, dadurch gekennzeichnet, daß das Hochfrequenzfeld so bemessen wird, daß die Eindringtiefe in Eisen o, i mm nicht übersteigt. 2. Procedure according to claim i, characterized in that the high-frequency field is dimensioned so that the penetration depth in iron does not exceed 0.1 mm. 3. Verfahren nach Anspruch i, gekennzeichnet durch seine Anwendung zum Einlöten von keramischen oder Glasdurchführungen in metallische Flächen, z. B. in Metallrohre. 3. The method according to claim i, characterized by its use for soldering ceramic or glass feedthroughs in metallic surfaces, e.g. B. in metal pipes. 4. Verfahren nach Anspruch i bis 3, gekennzeichnet durch seine Anwendung zum Auflöten von Metallkappen auf metallisierte Keramik-oder Glasrohre. 4. The method according to claim i to 3, characterized by its application for soldering metal caps to metallized ones Ceramic or glass tubes. 5. Verfahren nach Anspruch i bis ¢, dadurch gekennzeichnet, daß der Lötvorgang .durch Zeitschalter oder empirisch gesteuert wird. Angezogene Druckschriften: Französische Patentschrift Nr. 949 619.5. The method according to claim i to ¢, characterized in that that the soldering process is controlled by time switches or empirically. Dressed Publications: French Patent No. 949 619.
DER5105A 1950-12-28 1950-12-28 Method for connecting metal parts with bodies made of metallized, ceramic material or glass by soldering Expired DE875472C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DER5105A DE875472C (en) 1950-12-28 1950-12-28 Method for connecting metal parts with bodies made of metallized, ceramic material or glass by soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DER5105A DE875472C (en) 1950-12-28 1950-12-28 Method for connecting metal parts with bodies made of metallized, ceramic material or glass by soldering

Publications (1)

Publication Number Publication Date
DE875472C true DE875472C (en) 1953-05-04

Family

ID=7396784

Family Applications (1)

Application Number Title Priority Date Filing Date
DER5105A Expired DE875472C (en) 1950-12-28 1950-12-28 Method for connecting metal parts with bodies made of metallized, ceramic material or glass by soldering

Country Status (1)

Country Link
DE (1) DE875472C (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR949619A (en) * 1946-07-24 1949-09-05 Thomson Houston Comp Francaise Sealing for ceramics and its production process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR949619A (en) * 1946-07-24 1949-09-05 Thomson Houston Comp Francaise Sealing for ceramics and its production process

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