DE69939729D1 - Herstellungsverfahren für eine Chipkarte zur Begrenzung mechanischer Spannungen auf ihr - Google Patents

Herstellungsverfahren für eine Chipkarte zur Begrenzung mechanischer Spannungen auf ihr

Info

Publication number
DE69939729D1
DE69939729D1 DE69939729T DE69939729T DE69939729D1 DE 69939729 D1 DE69939729 D1 DE 69939729D1 DE 69939729 T DE69939729 T DE 69939729T DE 69939729 T DE69939729 T DE 69939729T DE 69939729 D1 DE69939729 D1 DE 69939729D1
Authority
DE
Germany
Prior art keywords
manufacturing
chip card
mechanical stresses
limiting mechanical
limiting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69939729T
Other languages
English (en)
Inventor
Jacques Venambre
Francois Bouchez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia France SAS
Original Assignee
Oberthur Technologies SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Technologies SA filed Critical Oberthur Technologies SA
Application granted granted Critical
Publication of DE69939729D1 publication Critical patent/DE69939729D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
DE69939729T 1998-07-07 1999-06-18 Herstellungsverfahren für eine Chipkarte zur Begrenzung mechanischer Spannungen auf ihr Expired - Lifetime DE69939729D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9808673A FR2781068B1 (fr) 1998-07-07 1998-07-07 Procede de fabrication d'une carte a microcircuit permettant de limiter les contraintes mecaniques transmises a celui-ci et carte ainsi obtenue

Publications (1)

Publication Number Publication Date
DE69939729D1 true DE69939729D1 (de) 2008-11-27

Family

ID=9528348

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69939729T Expired - Lifetime DE69939729D1 (de) 1998-07-07 1999-06-18 Herstellungsverfahren für eine Chipkarte zur Begrenzung mechanischer Spannungen auf ihr

Country Status (4)

Country Link
US (1) US6198044B1 (de)
EP (1) EP0971313B1 (de)
DE (1) DE69939729D1 (de)
FR (1) FR2781068B1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538898B1 (en) * 2000-05-01 2003-03-25 Micron Technology, Inc. Method and apparatus of die attachment for BOC and F/C surface mount
WO2002095673A1 (en) * 2001-05-17 2002-11-28 Koninklijke Philips Electronics N.V. Lead-frame configuration for chips
DE10208168C1 (de) * 2002-02-26 2003-08-14 Infineon Technologies Ag Datenträgerkarte

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4861959A (de) * 1971-12-06 1973-08-30
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
FR2632100B1 (fr) * 1988-05-25 1992-02-21 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede
FR2639763B1 (fr) * 1988-11-29 1992-12-24 Schlumberger Ind Sa Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede
CH686325A5 (de) * 1992-11-27 1996-02-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.
DE69512137T2 (de) * 1994-06-15 2000-05-25 Rue Cartes Et Systemes Paris D Herstellungsverfahren und Montage für IC-Karte.
DE4431754C1 (de) * 1994-09-06 1995-11-23 Siemens Ag Trägerelement

Also Published As

Publication number Publication date
FR2781068A1 (fr) 2000-01-14
EP0971313B1 (de) 2008-10-15
US6198044B1 (en) 2001-03-06
FR2781068B1 (fr) 2000-10-13
EP0971313A1 (de) 2000-01-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition