DE69916301D1 - Verbesserung der prüfbarkeit von multi-chip-modulen durch dielektrikumszwischenschichten aus polarisiertem polymer - Google Patents

Verbesserung der prüfbarkeit von multi-chip-modulen durch dielektrikumszwischenschichten aus polarisiertem polymer

Info

Publication number
DE69916301D1
DE69916301D1 DE69916301T DE69916301T DE69916301D1 DE 69916301 D1 DE69916301 D1 DE 69916301D1 DE 69916301 T DE69916301 T DE 69916301T DE 69916301 T DE69916301 T DE 69916301T DE 69916301 D1 DE69916301 D1 DE 69916301D1
Authority
DE
Germany
Prior art keywords
laser
testability
electro
improvement
electric field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69916301T
Other languages
English (en)
Other versions
DE69916301T2 (de
Inventor
K Charles
M Mechtel
S Francomacaro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johns Hopkins University
US Department of Navy
Original Assignee
Johns Hopkins University
US Department of Navy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johns Hopkins University, US Department of Navy filed Critical Johns Hopkins University
Application granted granted Critical
Publication of DE69916301D1 publication Critical patent/DE69916301D1/de
Publication of DE69916301T2 publication Critical patent/DE69916301T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G01R1/071—Non contact-making probes containing electro-optic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318513—Test of Multi-Chip-Moduls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Optical Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Spinning Methods And Devices For Manufacturing Artificial Fibers (AREA)
  • Polarising Elements (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
DE69916301T 1998-10-14 1999-10-12 Verbesserung der prüfbarkeit von multi-chip-modulen durch dielektrikumszwischenschichten aus polarisiertem polymer Expired - Lifetime DE69916301T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10414598P 1998-10-14 1998-10-14
US104145P 1998-10-14
PCT/US1999/023692 WO2000022443A1 (en) 1998-10-14 1999-10-12 Improving multi-chip module testability using poled-polymer interlayer dielectrics

Publications (2)

Publication Number Publication Date
DE69916301D1 true DE69916301D1 (de) 2004-05-13
DE69916301T2 DE69916301T2 (de) 2005-03-24

Family

ID=22298883

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69916301T Expired - Lifetime DE69916301T2 (de) 1998-10-14 1999-10-12 Verbesserung der prüfbarkeit von multi-chip-modulen durch dielektrikumszwischenschichten aus polarisiertem polymer

Country Status (8)

Country Link
US (1) US6271671B1 (de)
EP (1) EP1121602B1 (de)
KR (1) KR20010083905A (de)
CN (1) CN1137385C (de)
AT (1) ATE263974T1 (de)
DE (1) DE69916301T2 (de)
TW (1) TW479139B (de)
WO (1) WO2000022443A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6713318B2 (en) * 2001-03-28 2004-03-30 Intel Corporation Flip chip interconnection using no-clean flux
WO2004031791A2 (en) * 2002-10-03 2004-04-15 Applied Materials Israel, Ltd. System and method for defect localization on electrical test structures
FR2859020B1 (fr) * 2003-08-22 2005-11-04 Centre Nat Rech Scient Dispositif et procede de detection et de mesure non invasives des proprietes d'un milieu
FR2859024B1 (fr) * 2003-08-22 2005-12-09 Centre Nat Rech Scient Dispositif et procede de detection et de mesure non invasives d'un champ electrique
US7053647B2 (en) * 2004-05-07 2006-05-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method of detecting potential bridging effects between conducting lines in an integrated circuit
US6982819B2 (en) * 2004-05-10 2006-01-03 Ciencia, Inc. Electro-optic array interface

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4656116A (en) * 1983-10-12 1987-04-07 Ciba-Geigy Corporation Radiation-sensitive coating composition
US5272434A (en) * 1987-06-20 1993-12-21 Schlumberger Technologies, Inc. Method and apparatus for electro-optically testing circuits
DE3825066A1 (de) * 1988-07-23 1990-01-25 Roehm Gmbh Verfahren zur herstellung von duennen, anisotropen schichten auf oberflaechenstrukturierten traegern
US5397684A (en) * 1993-04-27 1995-03-14 International Business Machines Corporation Antireflective polyimide dielectric for photolithography
US5872360A (en) * 1996-12-12 1999-02-16 Intel Corporation Method and apparatus using an infrared laser based optical probe for measuring electric fields directly from active regions in an integrated circuit

Also Published As

Publication number Publication date
US6271671B1 (en) 2001-08-07
TW479139B (en) 2002-03-11
CN1331802A (zh) 2002-01-16
KR20010083905A (ko) 2001-09-03
DE69916301T2 (de) 2005-03-24
EP1121602B1 (de) 2004-04-07
CN1137385C (zh) 2004-02-04
EP1121602A1 (de) 2001-08-08
ATE263974T1 (de) 2004-04-15
WO2000022443A1 (en) 2000-04-20

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