DE69910335D1 - Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band - Google Patents

Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band

Info

Publication number
DE69910335D1
DE69910335D1 DE69910335T DE69910335T DE69910335D1 DE 69910335 D1 DE69910335 D1 DE 69910335D1 DE 69910335 T DE69910335 T DE 69910335T DE 69910335 T DE69910335 T DE 69910335T DE 69910335 D1 DE69910335 D1 DE 69910335D1
Authority
DE
Germany
Prior art keywords
tape
composition
containing silver
photosensitive conductive
treated therewith
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69910335T
Other languages
English (en)
Other versions
DE69910335T2 (de
Inventor
Lorri Drozdyk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69910335D1 publication Critical patent/DE69910335D1/de
Publication of DE69910335T2 publication Critical patent/DE69910335T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
DE69910335T 1998-12-11 1999-09-30 Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band Expired - Fee Related DE69910335T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21023398A 1998-12-11 1998-12-11
US210233 1998-12-11

Publications (2)

Publication Number Publication Date
DE69910335D1 true DE69910335D1 (de) 2003-09-18
DE69910335T2 DE69910335T2 (de) 2004-07-01

Family

ID=22782100

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69910335T Expired - Fee Related DE69910335T2 (de) 1998-12-11 1999-09-30 Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band

Country Status (4)

Country Link
US (1) US6558874B2 (de)
EP (1) EP1008909B1 (de)
JP (1) JP3664620B2 (de)
DE (1) DE69910335T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69910335T2 (de) 1998-12-11 2004-07-01 E.I. Du Pont De Nemours And Co., Wilmington Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band
JP2001154345A (ja) * 1999-11-25 2001-06-08 Dainippon Printing Co Ltd 感光性導電ペーストおよびそれを用いた感光性導電層転写シート
US6994948B2 (en) * 2001-10-12 2006-02-07 E.I. Du Pont De Nemours And Company, Inc. Aqueous developable photoimageable thick film compositions
JP4071171B2 (ja) * 2003-08-21 2008-04-02 太陽インキ製造株式会社 感光性導電組成物およびプラズマディスプレイパネル
US7618704B2 (en) 2003-09-29 2009-11-17 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
US7294449B1 (en) 2003-12-31 2007-11-13 Kovio, Inc. Radiation patternable functional materials, methods of their use, and structures formed therefrom
KR100611446B1 (ko) * 2004-05-18 2006-08-10 제일모직주식회사 수성 현상가능한 감광성 코팅액 조성물의 제조방법
KR100996235B1 (ko) * 2004-06-01 2010-11-25 주식회사 동진쎄미켐 ＰＤＰ 어드레스 전극용 Ｐｂ 미함유 Ａｇ 페이스트 조성물
US7135267B2 (en) * 2004-08-06 2006-11-14 E. I. Du Pont De Nemours And Company Aqueous developable photoimageable compositions for use in photo-patterning methods
US8143326B2 (en) 2004-09-28 2012-03-27 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
US20060231802A1 (en) 2005-04-14 2006-10-19 Takuya Konno Electroconductive thick film composition, electrode, and solar cell formed therefrom
KR100730414B1 (ko) 2005-12-29 2007-06-19 제일모직주식회사 항균 및 대전방지 복합 기능성 하드코팅 조성물, 이의 코팅방법 및 이를 이용한 하드코팅 투명시트
KR101976661B1 (ko) * 2015-04-28 2019-05-09 삼성에스디아이 주식회사 전극 형성용 조성물 및 이로부터 제조된 전극과 태양전지
US9966480B2 (en) * 2015-04-28 2018-05-08 Samsung Sdi Co., Ltd. Electrode composition, electrode manufactured using the same, and solar cell
KR101977886B1 (ko) * 2018-06-18 2019-05-13 영창케미칼 주식회사 패턴 프로파일 개선용 화학증폭형 포지티브 포토레지스트 조성물

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958996A (en) 1973-05-07 1976-05-25 E. I. Du Pont De Nemours And Company Photopolymerizable paste composition
JPS5517714A (en) 1978-07-20 1980-02-07 Tokico Ltd Hydraulic shock absorber
US4353978A (en) 1979-08-14 1982-10-12 E. I. Du Pont De Nemours And Company Polymeric binders for aqueous processable photopolymer compositions
US4522903A (en) 1982-06-11 1985-06-11 E. I. Du Pont De Nemours And Company Sequential automatic registration and imagewise exposure of a sheet substrate
DE3231145A1 (de) 1982-08-21 1984-02-23 Basf Ag, 6700 Ludwigshafen Negativ arbeitendes verfahren zur herstellung von reliefbildern oder resistmustern
US4517251A (en) 1982-09-30 1985-05-14 Jeannine Mosely Blank for folding an octahedron and folded product
US4528261A (en) 1983-03-28 1985-07-09 E. I. Du Pont De Nemours And Company Prelamination, imagewise exposure of photohardenable layer in process for sensitizing, registering and exposing circuit boards
US4613648A (en) 1984-03-29 1986-09-23 E. I. Du Pont De Nemours And Company Castable ceramic compositions
US4555473A (en) 1984-12-06 1985-11-26 E. I. Dupont De Nemours And Company Alkali developable photopolymer crystalline composition
US4613560A (en) 1984-12-28 1986-09-23 E. I. Du Pont De Nemours And Company Photosensitive ceramic coating composition
JPS62100969A (ja) 1985-10-29 1987-05-11 東レ株式会社 糸状発熱体
US4724021A (en) 1986-07-23 1988-02-09 E. I. Du Pont De Nemours And Company Method for making porous bottom-layer dielectric composite structure
US4737446A (en) 1986-12-30 1988-04-12 E. I. Du Pont De Nemours And Company Method for making multilayer circuits using embedded catalyst receptors
US4959295A (en) 1988-05-31 1990-09-25 E. I. Du Pont De Nemours And Company Process of making a photosensitive semi-aqueous developable ceramic coating composition
US4912019A (en) 1988-05-31 1990-03-27 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable ceramic coating composition
US4908296A (en) 1988-05-31 1990-03-13 E. I. Du Pont De Nemours And Company Photosensitive semi-aqueous developable ceramic coating composition
US4925771A (en) 1988-05-31 1990-05-15 E. I. Dupont De Nemours And Company Process of making photosensitive aqueous developable ceramic coating composition including freeze drying the ceramic solid particles
EP0357063A3 (de) 1988-09-02 1991-05-02 E.I. Du Pont De Nemours And Company Keramische lichtempfindliche Beschichtungszusammensetzungen
US5047313A (en) * 1989-08-21 1991-09-10 E. I. Du Pont De Nemours And Company Photosensitive semi-aqueous developable copper conductor composition
US5032490A (en) 1989-08-21 1991-07-16 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable copper conductor composition
EP0432907B1 (de) 1989-11-22 1995-05-17 Johnson Matthey Public Limited Company Verbesserte Pastenzusammensetzungen
US5100764A (en) 1989-12-26 1992-03-31 Iowa State University Research Foundation, Inc. Method of making patterned metal oxide films comprising a sol-gel of metal oxide and a photoactive compound
US5049480A (en) 1990-02-20 1991-09-17 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable silver conductor composition
DE69201714T2 (de) * 1991-11-14 1995-10-05 Du Pont Lichtabsorbierende, dielektrische Zusammensetzungen.
EP0589241B1 (de) * 1992-09-23 1999-04-28 E.I. Du Pont De Nemours And Company Photoempfindliches dielektrisches Schichtmaterial und untereinander verbundene Mehrschichtschaltungen
EP0845445B1 (de) * 1996-06-17 2004-10-27 Toray Industries, Inc. Lichtempfendliche keramische grünfolie, keramische packung , verfahren zu deren herstellung sowie verwendung
US5851732A (en) 1997-03-06 1998-12-22 E. I. Du Pont De Nemours And Company Plasma display panel device fabrication utilizing black electrode between substrate and conductor electrode
US5874197A (en) 1997-09-18 1999-02-23 E. I. Du Pont De Nemours And Company Thermal assisted photosensitive composition and method thereof
JP3947287B2 (ja) * 1997-12-27 2007-07-18 大日本印刷株式会社 感光性導体ペーストおよびこれを用いた転写シート
JPH11246638A (ja) 1998-03-02 1999-09-14 Taiyo Ink Mfg Ltd 感光性組成物及びそれを用いて得られる焼成物パターン
JP3920449B2 (ja) 1998-03-13 2007-05-30 太陽インキ製造株式会社 アルカリ現像型光硬化性組成物及びそれを用いて得られる焼成物パターン
DE69910335T2 (de) 1998-12-11 2004-07-01 E.I. Du Pont De Nemours And Co., Wilmington Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band
US6194124B1 (en) 1999-08-12 2001-02-27 E. I. Du Pont De Nemours And Company Photosensitive ceramic compositions containing polycarbonate polymers

Also Published As

Publication number Publication date
EP1008909B1 (de) 2003-08-13
US6558874B2 (en) 2003-05-06
DE69910335T2 (de) 2004-07-01
US20020182540A1 (en) 2002-12-05
JP2000215731A (ja) 2000-08-04
EP1008909A1 (de) 2000-06-14
JP3664620B2 (ja) 2005-06-29

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee