DE69830676D1 - CMP Suspension mit hoher Selektivität - Google Patents

CMP Suspension mit hoher Selektivität

Info

Publication number
DE69830676D1
DE69830676D1 DE69830676T DE69830676T DE69830676D1 DE 69830676 D1 DE69830676 D1 DE 69830676D1 DE 69830676 T DE69830676 T DE 69830676T DE 69830676 T DE69830676 T DE 69830676T DE 69830676 D1 DE69830676 D1 DE 69830676D1
Authority
DE
Germany
Prior art keywords
high selectivity
cmp suspension
cmp
suspension
selectivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69830676T
Other languages
German (de)
English (en)
Inventor
Jennifer A Sees
Jagdish Prasad
Lindsey H Hall
Ashutosh Misra
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69830676D1 publication Critical patent/DE69830676D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Element Separation (AREA)
  • Weting (AREA)
DE69830676T 1997-01-10 1998-01-09 CMP Suspension mit hoher Selektivität Expired - Lifetime DE69830676D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3502397P 1997-01-10 1997-01-10

Publications (1)

Publication Number Publication Date
DE69830676D1 true DE69830676D1 (de) 2005-08-04

Family

ID=21880142

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69830676T Expired - Lifetime DE69830676D1 (de) 1997-01-10 1998-01-09 CMP Suspension mit hoher Selektivität

Country Status (3)

Country Link
EP (1) EP0853110B1 (enExample)
JP (1) JPH10233378A (enExample)
DE (1) DE69830676D1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2785614B1 (fr) * 1998-11-09 2001-01-26 Clariant France Sa Nouveau procede de polissage mecano-chimique selectif entre une couche d'oxyde de silicium et une couche de nitrure de silicium
CN1422314A (zh) 2000-04-11 2003-06-04 卡伯特微电子公司 用于优先除去氧化硅的系统
DE10063492A1 (de) * 2000-12-20 2002-06-27 Bayer Ag Verfahren zum chemisch-mechanischen Polieren von Isolationsschichten nach der STI-Technik bei erhöhten Temperaturen
JP2002346912A (ja) * 2001-05-18 2002-12-04 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板及びその製造方法
KR100444302B1 (ko) * 2001-12-29 2004-08-11 주식회사 하이닉스반도체 반도체 소자 제조방법
US7071105B2 (en) 2003-02-03 2006-07-04 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
JP5878020B2 (ja) * 2009-11-11 2016-03-08 株式会社クラレ 化学的機械的研磨用スラリー並びにそれを用いる基板の研磨方法
JP5481166B2 (ja) * 2009-11-11 2014-04-23 株式会社クラレ 化学的機械的研磨用スラリー
JP5321430B2 (ja) * 2009-12-02 2013-10-23 信越半導体株式会社 シリコンウェーハ研磨用研磨剤およびシリコンウェーハの研磨方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU164439B (enExample) * 1972-06-14 1974-02-28
JPS5935429A (ja) * 1982-08-12 1984-02-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 半導体ウエハの製造方法

Also Published As

Publication number Publication date
EP0853110B1 (en) 2005-06-29
EP0853110A1 (en) 1998-07-15
JPH10233378A (ja) 1998-09-02

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Legal Events

Date Code Title Description
8332 No legal effect for de