DE69830525D1 - Ein Verfahren zur Erkennung mindestens eines Bauteils, Vorrichtung zum Erkennen von Bauteilen und eine diese enthaltende Vorrichtung - Google Patents

Ein Verfahren zur Erkennung mindestens eines Bauteils, Vorrichtung zum Erkennen von Bauteilen und eine diese enthaltende Vorrichtung

Info

Publication number
DE69830525D1
DE69830525D1 DE69830525T DE69830525T DE69830525D1 DE 69830525 D1 DE69830525 D1 DE 69830525D1 DE 69830525 T DE69830525 T DE 69830525T DE 69830525 T DE69830525 T DE 69830525T DE 69830525 D1 DE69830525 D1 DE 69830525D1
Authority
DE
Germany
Prior art keywords
detecting
component
components
device containing
detecting components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69830525T
Other languages
English (en)
Other versions
DE69830525T2 (de
Inventor
Yasuaki Aoshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Application granted granted Critical
Publication of DE69830525D1 publication Critical patent/DE69830525D1/de
Publication of DE69830525T2 publication Critical patent/DE69830525T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69830525T 1997-01-20 1998-01-14 Ein Verfahren zur Erkennung mindestens eines Bauteils, Vorrichtung zum Erkennen von Bauteilen und eine diese enthaltende Vorrichtung Expired - Lifetime DE69830525T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP00811697A JP3769089B2 (ja) 1997-01-20 1997-01-20 実装機の部品認識装置
JP811697 1997-01-20

Publications (2)

Publication Number Publication Date
DE69830525D1 true DE69830525D1 (de) 2005-07-21
DE69830525T2 DE69830525T2 (de) 2005-11-03

Family

ID=11684323

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69830525T Expired - Lifetime DE69830525T2 (de) 1997-01-20 1998-01-14 Ein Verfahren zur Erkennung mindestens eines Bauteils, Vorrichtung zum Erkennen von Bauteilen und eine diese enthaltende Vorrichtung

Country Status (4)

Country Link
EP (1) EP0854671B1 (de)
JP (1) JP3769089B2 (de)
KR (1) KR19980070627A (de)
DE (1) DE69830525T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6608320B1 (en) 1998-11-05 2003-08-19 Cyberoptics Corporation Electronics assembly apparatus with height sensing sensor
JP2003503701A (ja) * 1999-06-24 2003-01-28 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 照明モジュール
KR100452782B1 (ko) * 1999-09-02 2004-10-14 마츠시타 덴끼 산교 가부시키가이샤 부품 인식 방법 및 장치와, 부품 실장 방법 및 장치
US6538244B1 (en) 1999-11-03 2003-03-25 Cyberoptics Corporation Pick and place machine with improved vision system including a linescan sensor
US6535291B1 (en) 2000-06-07 2003-03-18 Cyberoptics Corporation Calibration methods for placement machines incorporating on-head linescan sensing
WO2004103053A1 (ja) 2003-05-13 2004-11-25 Matsushita Electric Industrial Co., Ltd. 部品実装機
JP4244696B2 (ja) * 2003-05-13 2009-03-25 パナソニック株式会社 部品実装機
KR100651815B1 (ko) 2005-01-14 2006-12-01 삼성테크윈 주식회사 부품 실장기
KR20100109195A (ko) 2009-03-31 2010-10-08 삼성전자주식회사 조명 밝기 조정 방법 및 이를 이용한 바이오 디스크 드라이브
KR102588842B1 (ko) * 2021-05-26 2023-10-16 지아이씨텍(주) 반도체 공정의 웨이퍼 결함 검출 시스템

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0827239B2 (ja) * 1986-11-14 1996-03-21 オムロン株式会社 照明装置
JPH0235375A (ja) * 1988-07-26 1990-02-05 Toshiba Corp 電子部品実装装置
JP2797697B2 (ja) * 1990-11-13 1998-09-17 松下電器産業株式会社 電子部品の観察装置
JPH04364404A (ja) * 1991-06-11 1992-12-16 Matsushita Electric Ind Co Ltd 電子部品照明方法
JP3307990B2 (ja) * 1992-08-31 2002-07-29 ヤマハ発動機株式会社 物品認識方法および同装置
JP3534817B2 (ja) * 1994-04-19 2004-06-07 松下電器産業株式会社 照明自動設定方法とその装置
JP2916379B2 (ja) * 1994-08-08 1999-07-05 ジューキ株式会社 チップマウンタ
JP2792829B2 (ja) * 1994-12-12 1998-09-03 ヤマハ発動機株式会社 実装機の部品認識装置
JP2703192B2 (ja) * 1994-12-26 1998-01-26 ヤマハ発動機株式会社 実装機の部品認識装置

Also Published As

Publication number Publication date
EP0854671B1 (de) 2005-06-15
JP3769089B2 (ja) 2006-04-19
EP0854671A1 (de) 1998-07-22
DE69830525T2 (de) 2005-11-03
KR19980070627A (ko) 1998-10-26
JPH10209699A (ja) 1998-08-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition