DE69827865D1 - Monoblockstruktur mit gestapelten Bauelementen - Google Patents

Monoblockstruktur mit gestapelten Bauelementen

Info

Publication number
DE69827865D1
DE69827865D1 DE69827865T DE69827865T DE69827865D1 DE 69827865 D1 DE69827865 D1 DE 69827865D1 DE 69827865 T DE69827865 T DE 69827865T DE 69827865 T DE69827865 T DE 69827865T DE 69827865 D1 DE69827865 D1 DE 69827865D1
Authority
DE
Germany
Prior art keywords
stacked components
monobloc structure
monobloc
stacked
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69827865T
Other languages
English (en)
Other versions
DE69827865T2 (de
Inventor
Claude Drevon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel SA filed Critical Alcatel SA
Application granted granted Critical
Publication of DE69827865D1 publication Critical patent/DE69827865D1/de
Publication of DE69827865T2 publication Critical patent/DE69827865T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06551—Conductive connections on the side of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
DE69827865T 1997-02-10 1998-02-09 Monoblockstruktur mit gestapelten Bauelementen Expired - Lifetime DE69827865T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9701481A FR2759527B1 (fr) 1997-02-10 1997-02-10 Structure monobloc de composants empiles
FR9701481 1997-02-10

Publications (2)

Publication Number Publication Date
DE69827865D1 true DE69827865D1 (de) 2005-01-05
DE69827865T2 DE69827865T2 (de) 2005-12-01

Family

ID=9503502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69827865T Expired - Lifetime DE69827865T2 (de) 1997-02-10 1998-02-09 Monoblockstruktur mit gestapelten Bauelementen

Country Status (6)

Country Link
US (1) US6188128B1 (de)
EP (1) EP0858108B1 (de)
JP (1) JP4303324B2 (de)
CA (1) CA2226419A1 (de)
DE (1) DE69827865T2 (de)
FR (1) FR2759527B1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2797348B1 (fr) * 1999-08-02 2001-10-19 Cit Alcatel Procede d'obtention d'un module, a haute densite, a partir de composants electroniques, modulaires, encapsules et module ainsi obtenu
FR2805082B1 (fr) * 2000-02-11 2003-01-31 3D Plus Sa Procede d'interconnexion en trois dimensions et dispositif electronique obtenu par ce procede
JP2006324568A (ja) * 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd 多層モジュールとその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370203A (en) * 1965-07-19 1968-02-20 United Aircraft Corp Integrated circuit modules
US3746934A (en) * 1971-05-06 1973-07-17 Siemens Ag Stack arrangement of semiconductor chips
FR2663702B1 (fr) 1990-06-21 1995-05-12 Skf France Butee d'embrayage comportant des moyens de solidarisation avec l'organe de manóoeuvre.
FR2688629A1 (fr) * 1992-03-10 1993-09-17 Thomson Csf Procede et dispositif d'encapsulation en trois dimensions de pastilles semi-conductrices.
JPH0637202A (ja) * 1992-07-20 1994-02-10 Mitsubishi Electric Corp マイクロ波ｉｃ用パッケージ
US5291061A (en) * 1993-04-06 1994-03-01 Micron Semiconductor, Inc. Multi-chip stacked devices
US5406125A (en) * 1993-04-15 1995-04-11 Martin Marietta Corp. Semiconductor device having a metalized via hole
FR2730534B1 (fr) 1995-02-09 1997-04-04 Valeo Butee de debrayage a commande hydraulique pour un embrayage a diaphragme de vehicule automobile
WO1996027282A1 (en) * 1995-03-02 1996-09-06 Circuit Components Incorporated A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology
FR2747239B1 (fr) * 1996-04-04 1998-05-15 Alcatel Espace Module hyperfrequence compact
US5953588A (en) * 1996-12-21 1999-09-14 Irvine Sensors Corporation Stackable layers containing encapsulated IC chips

Also Published As

Publication number Publication date
JPH10242382A (ja) 1998-09-11
EP0858108A1 (de) 1998-08-12
US6188128B1 (en) 2001-02-13
EP0858108B1 (de) 2004-12-01
CA2226419A1 (fr) 1998-08-10
JP4303324B2 (ja) 2009-07-29
DE69827865T2 (de) 2005-12-01
FR2759527A1 (fr) 1998-08-14
FR2759527B1 (fr) 2002-07-19

Similar Documents

Publication Publication Date Title
DE69827870D1 (de) Drebohrmeissel mit beweglichen Formation-eingreifenden Elementen
DE69823749D1 (de) Vergaser mit multiplen Verwirbelungsvorrichtungen
DE69731501D1 (de) Lastbetätigungsschaltung
DE69737411D1 (de) Induktor mit verbesserten Q-Wert
DE69808240T2 (de) Speicherungselement
FI972638A (fi) Muovilaminaatti
DE979167T1 (de) Filmstruktur
DE69818003D1 (de) Verbindungstruktur
DE69836751D1 (de) Dienste mit rufunabhängigen modulen
DE59806397D1 (de) Kraftspeicher
DE69827865D1 (de) Monoblockstruktur mit gestapelten Bauelementen
ATA203497A (de) Speicheranordnung
DE69841667D1 (de) Halbleiteranordnungen mit MOS-Gatter
ID20897A (id) Susunan penutup-rapat
DE59812131D1 (de) Wandleranordnung mit trenneinrichtung
FI103524B (fi) Liitosjärjestely
KR970038743U (ko) 팰릿
DE69813613T2 (de) Palette
ITRM970524A3 (it) Il toglisinghiozzo
ATA65497A (de) Bauelement
KR970038744U (ko) 팰릿
KR980004053U (ko) 개스통 보관함
KR970062185U (ko) 팔레트의 트레이 고정구조
BR7700308U (pt) Disposição em pallet múltiplo
ES1037533Y (es) Estructura modular simple.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ALCATEL LUCENT, PARIS, FR