DE69822973D1 - Aromatische Polyimidfolie mit verbesserter Haftung - Google Patents

Aromatische Polyimidfolie mit verbesserter Haftung

Info

Publication number
DE69822973D1
DE69822973D1 DE69822973T DE69822973T DE69822973D1 DE 69822973 D1 DE69822973 D1 DE 69822973D1 DE 69822973 T DE69822973 T DE 69822973T DE 69822973 T DE69822973 T DE 69822973T DE 69822973 D1 DE69822973 D1 DE 69822973D1
Authority
DE
Germany
Prior art keywords
polyimide film
improved adhesion
aromatic polyimide
aromatic
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69822973T
Other languages
English (en)
Other versions
DE69822973T2 (de
Inventor
Hiroaki Yamaguchi
Hideharu Watakabe
Toshihiko Anno
Hideki Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP32846097A external-priority patent/JP3438556B2/ja
Priority claimed from JP21234598A external-priority patent/JP3894668B2/ja
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Application granted granted Critical
Publication of DE69822973D1 publication Critical patent/DE69822973D1/de
Publication of DE69822973T2 publication Critical patent/DE69822973T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE69822973T 1997-11-28 1998-11-27 Aromatische Polyimidfolie mit verbesserter Haftung Expired - Lifetime DE69822973T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP32846097 1997-11-28
JP32846097A JP3438556B2 (ja) 1997-11-28 1997-11-28 接着性の改良されたポリイミドフィルム、その製法およびその積層体
JP35979297 1997-12-26
JP35979297 1997-12-26
JP21234598 1998-07-28
JP21234598A JP3894668B2 (ja) 1997-12-26 1998-07-28 接着性の改良された耐熱性フィルムの積層体

Publications (2)

Publication Number Publication Date
DE69822973D1 true DE69822973D1 (de) 2004-05-13
DE69822973T2 DE69822973T2 (de) 2005-03-31

Family

ID=27329350

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69822973T Expired - Lifetime DE69822973T2 (de) 1997-11-28 1998-11-27 Aromatische Polyimidfolie mit verbesserter Haftung

Country Status (4)

Country Link
EP (1) EP0919593B1 (de)
KR (1) KR100384052B1 (de)
DE (1) DE69822973T2 (de)
TW (1) TW506977B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2818665B1 (fr) 2000-12-27 2003-09-12 Usinor Fabrication d'une bande metallique pour emballage comportant un revetement constitue d'une couche metallique et d'un film de polymere, et bande obtenue
CN1910041B (zh) * 2004-01-13 2012-11-07 宇部兴产株式会社 聚酰亚胺-金属层压体和聚酰亚胺电路板
DE112014005493T5 (de) * 2013-12-31 2016-08-18 Saint-Gobain Performance Plastics Corporation Verbundwerkstofflager, umfassend eine Polyimidmatrix
CN108384483A (zh) * 2018-01-30 2018-08-10 苏州德佑胶带技术有限公司 抗反弹双面胶带及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3926916A (en) * 1972-12-22 1975-12-16 Du Pont Dielectric composition capable of electrical activation
US4284461A (en) * 1979-11-07 1981-08-18 Nasa Aluminum ion-containing polyimide adhesives
US5260413A (en) * 1990-02-05 1993-11-09 E. I. Du Pont De Nemours And Company Coated, heat-sealable aromatic polyimide film having superior compressive strength
US5106667A (en) * 1990-02-05 1992-04-21 E. I. Du Pont De Nemours And Company Coated, heat-sealable aromatic polyimide film having superior compressive strength
US5272194A (en) * 1992-01-17 1993-12-21 E. I. Du Pont De Nemours And Company Process for preparing a strengthened polyimide film containing organometallic compounds for improving adhesion
JP3280433B2 (ja) * 1992-10-09 2002-05-13 株式会社日清製粉グループ本社 超微粒子を表面に均一に分散付着した繊維または織布およびその製造方法およびそれを用いた繊維強化複合材

Also Published As

Publication number Publication date
DE69822973T2 (de) 2005-03-31
EP0919593A1 (de) 1999-06-02
KR19990045681A (ko) 1999-06-25
EP0919593B1 (de) 2004-04-07
KR100384052B1 (ko) 2004-03-20
TW506977B (en) 2002-10-21

Similar Documents

Publication Publication Date Title
DE69811250T2 (de) Elastische verbundfolie
DE69920281D1 (de) Mit hitze expandierter druckempfindlicher klebefilm
DE69624001T2 (de) Ultraflexible retroreflektierende folie mit beschichteter rückseite
DE69825800D1 (de) Laser mit selektiv veränderter Strombegrenzungsschicht
DE69833444T8 (de) Verbundfolie
DE69818738D1 (de) Abwickelsystem mit Zentralantrieb
DE69826179D1 (de) Laminierte Polyesterfolie
DE69822824D1 (de) Etikettenkonstruktionen mit kernabziehschicht
PT966287E (pt) Comprimidos de oxacarbazepina revestidos com pelicula
ID21040A (id) Film poliamida yang mudah melekat
DE69511709D1 (de) Mit klebmittel beschichteter film
ID22653A (id) Struktur film
DE69515108T2 (de) Dickfilm-Leiterzusammensetzungen mit verbesserter Haftung
DE69831667D1 (de) Dickfilm Heizeinrichtungen
DK1044106T3 (da) Lamineret cook-in film
DE19882928T1 (de) Folie mit verbesserten Selbstklebeeigenschaften
DE69733045D1 (de) Antistatischer aromatischer Polyimid-Film
DE69822205D1 (de) Beschichtete gestreckte polyesterfolie
DE69713206D1 (de) Haftbare Selbstzündungs-Folie
DE69721701D1 (de) Verbundfilm
DE69811327T2 (de) Härtbare Silikonelastomere mit grundierungsfreier Haftung
DE59703262D1 (de) Etikettenrolle mit Anhängeelement
DE69822973D1 (de) Aromatische Polyimidfolie mit verbesserter Haftung
KR970005628A (ko) 적층 폴리아미드 필름
DE69736284D1 (de) Wasserfeste Filmschicht

Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition