DE69616186D1 - Bei Raumtemperatur stabiler, flexibler einkomponenten Epoxidklebstoff mit thermischer Leitfähigkeit - Google Patents

Bei Raumtemperatur stabiler, flexibler einkomponenten Epoxidklebstoff mit thermischer Leitfähigkeit

Info

Publication number
DE69616186D1
DE69616186D1 DE69616186T DE69616186T DE69616186D1 DE 69616186 D1 DE69616186 D1 DE 69616186D1 DE 69616186 T DE69616186 T DE 69616186T DE 69616186 T DE69616186 T DE 69616186T DE 69616186 D1 DE69616186 D1 DE 69616186D1
Authority
DE
Germany
Prior art keywords
flexible
stable
room temperature
thermal conductivity
epoxy adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69616186T
Other languages
English (en)
Other versions
DE69616186T2 (de
Inventor
Ralph D Hermansen
Steven E Lau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of DE69616186D1 publication Critical patent/DE69616186D1/de
Publication of DE69616186T2 publication Critical patent/DE69616186T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4035—Hydrazines; Hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
DE69616186T 1995-07-19 1996-07-18 Bei Raumtemperatur stabiler, flexibler einkomponenten Epoxidklebstoff mit thermischer Leitfähigkeit Expired - Lifetime DE69616186T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50416895A 1995-07-19 1995-07-19

Publications (2)

Publication Number Publication Date
DE69616186D1 true DE69616186D1 (de) 2001-11-29
DE69616186T2 DE69616186T2 (de) 2002-07-11

Family

ID=24005142

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69616186T Expired - Lifetime DE69616186T2 (de) 1995-07-19 1996-07-18 Bei Raumtemperatur stabiler, flexibler einkomponenten Epoxidklebstoff mit thermischer Leitfähigkeit

Country Status (6)

Country Link
US (1) US6060539A (de)
EP (1) EP0754741B1 (de)
KR (1) KR100196754B1 (de)
DE (1) DE69616186T2 (de)
HK (1) HK1013662A1 (de)
TW (1) TW360701B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5681883A (en) * 1996-03-05 1997-10-28 Advanced Ceramics Corporation Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
US6890999B2 (en) * 1997-11-04 2005-05-10 Rohm And Haas Company Coating powder of epoxy resin and low temperature curing agent
US6703070B1 (en) 1997-11-04 2004-03-09 Morton International, Inc. One-component, low temperature curable coating powder
MXPA01012770A (es) * 1999-05-26 2002-07-22 Henkel Corp Revestimientos de autodeposicion y procesos para los mismos.
US7235514B2 (en) * 2000-07-28 2007-06-26 Tri-Mack Plastics Manufacturing Corp. Tribological materials and structures and methods for making the same
US20030082385A1 (en) * 2001-07-13 2003-05-01 Toray Composites (America), Inc. Quick cure carbon fiber reinforced epoxy resin
US20040072927A1 (en) * 2002-10-14 2004-04-15 Hachikian Zakar Raffi Two-part epoxy adhesives with improved flexibility and process for making and using same
US7550097B2 (en) * 2003-09-03 2009-06-23 Momentive Performance Materials, Inc. Thermal conductive material utilizing electrically conductive nanoparticles
WO2007077567A1 (en) * 2005-12-30 2007-07-12 Council Of Scientific And Industrial Research Multifunctional alcohols obtained from cardanol, multifunctional acrylic crosslinker and pendant phosphorous flame retardant derivatives thereof
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
DE102006017858A1 (de) * 2006-04-18 2007-10-25 GM Global Technology Operations, Inc., Detroit Hafttreibungserhöhungsmittel und Verbindungsanordnung von Bauteilen mit Haftreibungserhöhungsmittel
EP2139629B1 (de) * 2007-03-26 2018-09-05 LORD Corporation Verfahren zur herstellung heterogener verbundwerkstoffen
US8039551B2 (en) * 2007-07-20 2011-10-18 Ppg Industries Ohio, Inc. Modified epoxy resins comprising the reaction product of rosin and a linking molecule and aqueous dispersions and coatings comprising such resins
US7812101B2 (en) * 2007-07-20 2010-10-12 Ppg Industries Ohio, Inc. Modified epoxy resins comprising the reaction product of a biomass derived compound and an epoxy resin, and aqueous dispersions and coatings comprising such resins
US8057592B2 (en) * 2007-07-20 2011-11-15 Ppg Industries Ohio, Inc. Cationic electrodepositable coatings comprising rosin
US7868066B2 (en) * 2007-07-20 2011-01-11 Ppg Industries Ohio, Inc. Aqueous dispersions and coatings comprising modified epoxy resins comprising the reaction product of rosin and a dienophile
EP2401898A1 (de) * 2009-02-25 2012-01-04 3M Innovative Properties Company Artikel mit einer dichtung mit feuchtigkeitsdurchlassbeständigkeit und verfahren
CN102803406B (zh) * 2009-06-12 2015-10-14 洛德公司 防止基底被雷击的方法
DE102009028100A1 (de) * 2009-07-29 2011-02-03 Henkel Ag & Co. Kgaa Schlagzähmodifizierte Zusammensetzung auf Epoxidharzbasis
CN101928540B (zh) * 2009-10-16 2013-07-10 北京工业大学 一种环氧导电胶及其制备方法
US8642709B2 (en) 2010-03-23 2014-02-04 Henkel Ag & Co. Kgaa Epoxy resin composition with reduced toxicity
DE102010028586A1 (de) * 2010-05-05 2011-11-10 Henkel Ag & Co. Kgaa 1K-Epoxidharzzusammensetzung mit verringerter Toxizität
US9464214B2 (en) * 2014-02-25 2016-10-11 The Boeing Company Thermally conductive flexible adhesive for aerospace applications
BR112017011540A2 (pt) * 2015-01-16 2018-02-27 Halliburton Energy Services Inc método e composição de resina curável
TWI654218B (zh) 2018-01-08 2019-03-21 財團法人工業技術研究院 樹脂組合物與導熱材料的形成方法
EP3778736A1 (de) 2019-08-15 2021-02-17 Sika Technology Ag Thermisch expandierbare zusammensetzungen mit einem chemischen treibmittel
EP4077516A4 (de) * 2019-12-19 2024-01-24 Henkel AG & Co. KGaA Silikonfreies thermisches grenzflächenmaterial mit reaktivem verdünner

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3996175A (en) * 1971-06-25 1976-12-07 Ciba-Geigy Corporation Storage-stable, quick-curing epoxide resin moulding materials
US3759914A (en) * 1971-08-10 1973-09-18 Du Pont Improved curing compositions for epoxy resins comprising latent amine curing agent and accelerator
GB2164944B (en) * 1984-08-01 1988-06-08 Toho Rayon Kk Prepregs and method for production thereof
US4833226A (en) * 1987-08-26 1989-05-23 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
JPH0668091B2 (ja) * 1987-10-27 1994-08-31 三菱電機株式会社 熱硬化性絶縁樹脂ペースト
US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
JPH07119273B2 (ja) * 1990-05-30 1995-12-20 ソマール株式会社 エポキシ樹脂組成物の製造方法
DE69229262T2 (de) * 1992-03-16 2000-01-20 Raytheon Co., Lexington Wärmetransferklebstoff
JP3454437B2 (ja) * 1992-10-02 2003-10-06 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 低粘度無溶媒の一液型エポキシ樹脂接着性組成物

Also Published As

Publication number Publication date
KR100196754B1 (ko) 1999-06-15
US6060539A (en) 2000-05-09
DE69616186T2 (de) 2002-07-11
EP0754741A3 (de) 1997-07-02
EP0754741A2 (de) 1997-01-22
KR970006451A (ko) 1997-02-21
HK1013662A1 (en) 1999-09-03
EP0754741B1 (de) 2001-10-24
TW360701B (en) 1999-06-11

Similar Documents

Publication Publication Date Title
DE69616186D1 (de) Bei Raumtemperatur stabiler, flexibler einkomponenten Epoxidklebstoff mit thermischer Leitfähigkeit
DE69606296D1 (de) Wärmeübertragungskreislauf mit kapillaren pumpen
DE69621897D1 (de) Biegsames Heizelement
DE69602035D1 (de) Schmelzkleber mit niedriger Anwendungstemperatur
DE69222189D1 (de) Markierungselement mit silikonkleber
DE69626615D1 (de) Thermistor mit positivem Temperaturkoeffizient
DE69937164D1 (de) Heissschmelzklebstoff mit niedriger Anwendungstemperatur
DK0863721T3 (da) Elektronisk stetoskop med idealiserede klokke- og membrantilstande
DE69621498D1 (de) Zusammensetzung mit positivem Temperaturkoeffizienten
DE69616187D1 (de) Bei Raumtemperatur stabiler flexibler Einkomponenten-Epoxidklebstoff
DE69517396D1 (de) Geschäumtes Druckklebemittel
DE69629858D1 (de) Elektronisches Thermometer mit hörbarem Temperaturanstieg
DE69627511D1 (de) Wärmetauscher aus polymerenbändern
DE69128524D1 (de) Hitze- und feuchtigkeitsbeständiger film
DE69610453D1 (de) Weichmagnetischer dünner Film und Dünnfilmmagnetelement unter Verwendung desselben
DE68928400D1 (de) Zusammengesetztes temperaturempfindliches Element und ein solches enthaltender Stirnflächen-Wärmeerzeuger
DE69523283D1 (de) Flüssigkeitsverdampfer mit niedriger temperatur
BR9201051A (pt) Composicoes adesivas e escorvador
DE69803426D1 (de) Legierung mit niedrigem wärmeausdehnungskoeffizient
DE69834585D1 (de) Magnetischer dünner Film und Magnetelement unter Verwendung desselben
DE69602636D1 (de) Photographisches Silberhalogenid-Element mit Polyester-Schichtträger und verbesserter Trockenhaftung
DE59605550D1 (de) Integrierte Schaltung mit thermischer Abregelung
PT8672T (pt) Aquecedor do ambiente de salas e de agua de consumo
ITPN940032A0 (it) Apparecchio frigorifero con termostato antiscoppio
FR2740544B1 (fr) Emetteurs thermiques auto-equilibres

Legal Events

Date Code Title Description
8364 No opposition during term of opposition