DE69615929D1 - Optischer Lagekalibrierungssystem - Google Patents
Optischer LagekalibrierungssystemInfo
- Publication number
- DE69615929D1 DE69615929D1 DE69615929T DE69615929T DE69615929D1 DE 69615929 D1 DE69615929 D1 DE 69615929D1 DE 69615929 T DE69615929 T DE 69615929T DE 69615929 T DE69615929 T DE 69615929T DE 69615929 D1 DE69615929 D1 DE 69615929D1
- Authority
- DE
- Germany
- Prior art keywords
- calibration system
- optical position
- position calibration
- optical
- calibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/474,027 US5742393A (en) | 1995-06-07 | 1995-06-07 | Optical position calibration system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69615929D1 true DE69615929D1 (de) | 2001-11-22 |
DE69615929T2 DE69615929T2 (de) | 2002-06-13 |
Family
ID=23881910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69615929T Expired - Fee Related DE69615929T2 (de) | 1995-06-07 | 1996-06-04 | Optischer Lagekalibrierungssystem |
Country Status (5)
Country | Link |
---|---|
US (1) | US5742393A (de) |
EP (1) | EP0747933B1 (de) |
JP (1) | JP3982644B2 (de) |
KR (1) | KR970003754A (de) |
DE (1) | DE69615929T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6647303B1 (en) | 1999-10-15 | 2003-11-11 | Data I/O Corporation | Feeder/programming/buffer control system and control method |
US6303509B1 (en) * | 1999-10-29 | 2001-10-16 | Taiwan Semiconductor Manufacturing Company | Method to calibrate the wafer transfer for oxide etcher (with clamp) |
US6629053B1 (en) * | 1999-11-22 | 2003-09-30 | Lam Research Corporation | Method and apparatus for determining substrate offset using optimization techniques |
JP3674864B2 (ja) * | 2003-03-25 | 2005-07-27 | 忠素 玉井 | 真空処理装置 |
KR100553710B1 (ko) * | 2004-03-23 | 2006-02-24 | 삼성전자주식회사 | 반도체 웨이퍼를 검사하는 검사 시스템 및 검사 방법 |
JP2013045817A (ja) * | 2011-08-23 | 2013-03-04 | Hitachi High-Technologies Corp | 真空処理装置および真空処理方法 |
US9496160B2 (en) | 2013-08-21 | 2016-11-15 | Applied Materials, Inc. | Workpiece orienting and centering with a factory interface |
WO2015196367A1 (zh) * | 2014-06-24 | 2015-12-30 | 昂纳自动化技术(深圳)有限公司 | 一种电子烟雾化器密封圈装配质量检测装置及方法 |
JP6862903B2 (ja) * | 2017-02-23 | 2021-04-21 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及び記憶媒体 |
US10861723B2 (en) | 2017-08-08 | 2020-12-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | EFEM robot auto teaching methodology |
DE102018100003B4 (de) * | 2017-08-08 | 2020-03-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methodologie zum automatischen Anlernen eines EFEM-Roboters |
CN107941161A (zh) * | 2017-11-27 | 2018-04-20 | 上海卫星装备研究所 | 一种热真空环境下的天线面阵热变形非接触测量系统 |
DE102019111580A1 (de) * | 2018-05-28 | 2019-11-28 | Besi Switzerland Ag | Verfahren zur Kalibrierung einer Vorrichtung für die Montage von Bauelementen |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4667109A (en) * | 1984-03-09 | 1987-05-19 | Canon Kabushiki Kaisha | Alignment device |
US4819167A (en) * | 1987-04-20 | 1989-04-04 | Applied Materials, Inc. | System and method for detecting the center of an integrated circuit wafer |
US4833790A (en) * | 1987-05-11 | 1989-05-30 | Lam Research | Method and system for locating and positioning circular workpieces |
JPS6430242A (en) * | 1987-07-27 | 1989-02-01 | Oki Electric Ind Co Ltd | Pre-alignment of semiconductor wafer |
JP2611251B2 (ja) * | 1987-08-28 | 1997-05-21 | 株式会社ニコン | 基板搬送装置 |
JPH0656864B2 (ja) * | 1987-10-21 | 1994-07-27 | 富士電機株式会社 | 半導体ウエハの搬送位置決め方式 |
US5102280A (en) * | 1989-03-07 | 1992-04-07 | Ade Corporation | Robot prealigner |
EP0597637B1 (de) * | 1992-11-12 | 2000-08-23 | Applied Materials, Inc. | System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum |
US5256871A (en) * | 1992-12-22 | 1993-10-26 | Emhart Glass Machinery Investments Inc. | Machine for video inspection of glass containers with intersecting light beams |
US5452078A (en) * | 1993-06-17 | 1995-09-19 | Ann F. Koo | Method and apparatus for finding wafer index marks and centers |
US5511005A (en) * | 1994-02-16 | 1996-04-23 | Ade Corporation | Wafer handling and processing system |
-
1995
- 1995-06-07 US US08/474,027 patent/US5742393A/en not_active Expired - Fee Related
-
1996
- 1996-05-24 JP JP15182696A patent/JP3982644B2/ja not_active Expired - Fee Related
- 1996-06-04 DE DE69615929T patent/DE69615929T2/de not_active Expired - Fee Related
- 1996-06-04 KR KR1019960020525A patent/KR970003754A/ko active IP Right Grant
- 1996-06-04 EP EP96304063A patent/EP0747933B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0747933B1 (de) | 2001-10-17 |
KR970003754A (ko) | 1997-01-28 |
JP3982644B2 (ja) | 2007-09-26 |
EP0747933A1 (de) | 1996-12-11 |
DE69615929T2 (de) | 2002-06-13 |
US5742393A (en) | 1998-04-21 |
JPH09115981A (ja) | 1997-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |