DE69615929D1 - Optischer Lagekalibrierungssystem - Google Patents

Optischer Lagekalibrierungssystem

Info

Publication number
DE69615929D1
DE69615929D1 DE69615929T DE69615929T DE69615929D1 DE 69615929 D1 DE69615929 D1 DE 69615929D1 DE 69615929 T DE69615929 T DE 69615929T DE 69615929 T DE69615929 T DE 69615929T DE 69615929 D1 DE69615929 D1 DE 69615929D1
Authority
DE
Germany
Prior art keywords
calibration system
optical position
position calibration
optical
calibration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69615929T
Other languages
English (en)
Other versions
DE69615929T2 (de
Inventor
Richard F Landau
Edward D Schultheis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Semiconductor Equipment Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Semiconductor Equipment Associates Inc filed Critical Varian Semiconductor Equipment Associates Inc
Publication of DE69615929D1 publication Critical patent/DE69615929D1/de
Application granted granted Critical
Publication of DE69615929T2 publication Critical patent/DE69615929T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
DE69615929T 1995-06-07 1996-06-04 Optischer Lagekalibrierungssystem Expired - Fee Related DE69615929T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/474,027 US5742393A (en) 1995-06-07 1995-06-07 Optical position calibration system

Publications (2)

Publication Number Publication Date
DE69615929D1 true DE69615929D1 (de) 2001-11-22
DE69615929T2 DE69615929T2 (de) 2002-06-13

Family

ID=23881910

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69615929T Expired - Fee Related DE69615929T2 (de) 1995-06-07 1996-06-04 Optischer Lagekalibrierungssystem

Country Status (5)

Country Link
US (1) US5742393A (de)
EP (1) EP0747933B1 (de)
JP (1) JP3982644B2 (de)
KR (1) KR970003754A (de)
DE (1) DE69615929T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6647303B1 (en) * 1999-10-15 2003-11-11 Data I/O Corporation Feeder/programming/buffer control system and control method
US6303509B1 (en) * 1999-10-29 2001-10-16 Taiwan Semiconductor Manufacturing Company Method to calibrate the wafer transfer for oxide etcher (with clamp)
US6629053B1 (en) * 1999-11-22 2003-09-30 Lam Research Corporation Method and apparatus for determining substrate offset using optimization techniques
JP3674864B2 (ja) * 2003-03-25 2005-07-27 忠素 玉井 真空処理装置
KR100553710B1 (ko) * 2004-03-23 2006-02-24 삼성전자주식회사 반도체 웨이퍼를 검사하는 검사 시스템 및 검사 방법
JP2013045817A (ja) * 2011-08-23 2013-03-04 Hitachi High-Technologies Corp 真空処理装置および真空処理方法
US9496160B2 (en) 2013-08-21 2016-11-15 Applied Materials, Inc. Workpiece orienting and centering with a factory interface
WO2015196367A1 (zh) * 2014-06-24 2015-12-30 昂纳自动化技术（深圳）有限公司 一种电子烟雾化器密封圈装配质量检测装置及方法
JP6862903B2 (ja) * 2017-02-23 2021-04-21 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
US10861723B2 (en) 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
CN107941161A (zh) * 2017-11-27 2018-04-20 上海卫星装备研究所 一种热真空环境下的天线面阵热变形非接触测量系统
DE102019111580A1 (de) * 2018-05-28 2019-11-28 Besi Switzerland Ag Verfahren zur Kalibrierung einer Vorrichtung für die Montage von Bauelementen

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667109A (en) * 1984-03-09 1987-05-19 Canon Kabushiki Kaisha Alignment device
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
US4833790A (en) * 1987-05-11 1989-05-30 Lam Research Method and system for locating and positioning circular workpieces
JPS6430242A (en) * 1987-07-27 1989-02-01 Oki Electric Ind Co Ltd Pre-alignment of semiconductor wafer
JP2611251B2 (ja) * 1987-08-28 1997-05-21 株式会社ニコン 基板搬送装置
JPH0656864B2 (ja) * 1987-10-21 1994-07-27 富士電機株式会社 半導体ウエハの搬送位置決め方式
US5102280A (en) * 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
EP0597637B1 (de) * 1992-11-12 2000-08-23 Applied Materials, Inc. System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
US5256871A (en) * 1992-12-22 1993-10-26 Emhart Glass Machinery Investments Inc. Machine for video inspection of glass containers with intersecting light beams
US5452078A (en) * 1993-06-17 1995-09-19 Ann F. Koo Method and apparatus for finding wafer index marks and centers
US5511005A (en) * 1994-02-16 1996-04-23 Ade Corporation Wafer handling and processing system

Also Published As

Publication number Publication date
EP0747933B1 (de) 2001-10-17
US5742393A (en) 1998-04-21
EP0747933A1 (de) 1996-12-11
KR970003754A (ko) 1997-01-28
JPH09115981A (ja) 1997-05-02
JP3982644B2 (ja) 2007-09-26
DE69615929T2 (de) 2002-06-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee