DE69610745T2 - Elektrische Verbindung - Google Patents
Elektrische VerbindungInfo
- Publication number
- DE69610745T2 DE69610745T2 DE69610745T DE69610745T DE69610745T2 DE 69610745 T2 DE69610745 T2 DE 69610745T2 DE 69610745 T DE69610745 T DE 69610745T DE 69610745 T DE69610745 T DE 69610745T DE 69610745 T2 DE69610745 T2 DE 69610745T2
- Authority
- DE
- Germany
- Prior art keywords
- electrical connection
- electrical
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19617595A JP3611637B2 (ja) | 1995-07-07 | 1995-07-07 | 回路部材の電気接続構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69610745D1 DE69610745D1 (de) | 2000-11-30 |
DE69610745T2 true DE69610745T2 (de) | 2001-02-22 |
Family
ID=16353454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69610745T Expired - Fee Related DE69610745T2 (de) | 1995-07-07 | 1996-07-05 | Elektrische Verbindung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5723894A (de) |
EP (1) | EP0752587B1 (de) |
JP (1) | JP3611637B2 (de) |
DE (1) | DE69610745T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10291877B4 (de) * | 2001-04-26 | 2009-01-02 | Advantest Corp. | Mikroschalter und Verfahren zum Herstellen eines Mikroschalters |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6482013B2 (en) | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US7579269B2 (en) * | 1993-11-16 | 2009-08-25 | Formfactor, Inc. | Microelectronic spring contact elements |
US6727580B1 (en) | 1993-11-16 | 2004-04-27 | Formfactor, Inc. | Microelectronic spring contact elements |
US7073254B2 (en) | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
US20020009827A1 (en) | 1997-08-26 | 2002-01-24 | Masud Beroz | Microelectronic unit forming methods and materials |
US6228686B1 (en) | 1995-09-18 | 2001-05-08 | Tessera, Inc. | Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions |
JP3838381B2 (ja) * | 1995-11-22 | 2006-10-25 | 株式会社アドバンテスト | プローブカード |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US7063541B2 (en) | 1997-03-17 | 2006-06-20 | Formfactor, Inc. | Composite microelectronic spring structure and method for making same |
US7714235B1 (en) | 1997-05-06 | 2010-05-11 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
US6441315B1 (en) | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
EP1135690B1 (de) * | 1998-12-02 | 2003-06-04 | Formfactor, Inc. | Lithographische kontaktstrukturen |
US6672875B1 (en) | 1998-12-02 | 2004-01-06 | Formfactor, Inc. | Spring interconnect structures |
US6268015B1 (en) | 1998-12-02 | 2001-07-31 | Formfactor | Method of making and using lithographic contact springs |
US6255126B1 (en) * | 1998-12-02 | 2001-07-03 | Formfactor, Inc. | Lithographic contact elements |
US6491968B1 (en) | 1998-12-02 | 2002-12-10 | Formfactor, Inc. | Methods for making spring interconnect structures |
US6060336A (en) * | 1998-12-11 | 2000-05-09 | C.F. Wan Incorporated | Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore |
KR100470386B1 (ko) * | 1998-12-26 | 2005-05-19 | 주식회사 하이닉스반도체 | 멀티-칩패키지 |
US6040749A (en) * | 1998-12-30 | 2000-03-21 | Honeywell Inc. | Apparatus and method for operating a micromechanical switch |
US6057520A (en) * | 1999-06-30 | 2000-05-02 | Mcnc | Arc resistant high voltage micromachined electrostatic switch |
US6229683B1 (en) | 1999-06-30 | 2001-05-08 | Mcnc | High voltage micromachined electrostatic switch |
US6713374B2 (en) | 1999-07-30 | 2004-03-30 | Formfactor, Inc. | Interconnect assemblies and methods |
EP1208595A2 (de) * | 1999-07-30 | 2002-05-29 | Formfactor, Inc. | Verbindungsstruktur und methode |
US7435108B1 (en) * | 1999-07-30 | 2008-10-14 | Formfactor, Inc. | Variable width resilient conductive contact structures |
US6359374B1 (en) | 1999-11-23 | 2002-03-19 | Mcnc | Miniature electrical relays using a piezoelectric thin film as an actuating element |
US6373682B1 (en) | 1999-12-15 | 2002-04-16 | Mcnc | Electrostatically controlled variable capacitor |
US6485273B1 (en) | 2000-09-01 | 2002-11-26 | Mcnc | Distributed MEMS electrostatic pumping devices |
US6590267B1 (en) | 2000-09-14 | 2003-07-08 | Mcnc | Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods |
US6377438B1 (en) | 2000-10-23 | 2002-04-23 | Mcnc | Hybrid microelectromechanical system tunable capacitor and associated fabrication methods |
US6396620B1 (en) | 2000-10-30 | 2002-05-28 | Mcnc | Electrostatically actuated electromagnetic radiation shutter |
US6811406B2 (en) * | 2001-04-12 | 2004-11-02 | Formfactor, Inc. | Microelectronic spring with additional protruding member |
US6731492B2 (en) | 2001-09-07 | 2004-05-04 | Mcnc Research And Development Institute | Overdrive structures for flexible electrostatic switch |
US6759311B2 (en) | 2001-10-31 | 2004-07-06 | Formfactor, Inc. | Fan out of interconnect elements attached to semiconductor wafer |
GB2388468B (en) * | 2002-02-08 | 2005-05-04 | Microsaic Systems Ltd | Microengineered electrical connectors |
US6992399B2 (en) * | 2002-05-24 | 2006-01-31 | Northrop Grumman Corporation | Die connected with integrated circuit component for electrical signal passing therebetween |
US7002225B2 (en) * | 2002-05-24 | 2006-02-21 | Northrup Grumman Corporation | Compliant component for supporting electrical interface component |
US20060006514A1 (en) * | 2004-07-07 | 2006-01-12 | Manish Sharma | Interconnecting integrated circuits using MEMS |
US7448412B2 (en) * | 2004-07-23 | 2008-11-11 | Afa Controls Llc | Microvalve assemblies and related structures and related methods |
US7375434B2 (en) * | 2004-09-13 | 2008-05-20 | Infineon Technologies Ag | Semiconductor chip with flexible contacts at a face |
US7251160B2 (en) * | 2005-03-16 | 2007-07-31 | Sandisk Corporation | Non-volatile memory and method with power-saving read and program-verify operations |
US7952184B2 (en) * | 2006-08-31 | 2011-05-31 | Micron Technology, Inc. | Distributed semiconductor device methods, apparatus, and systems |
US7754532B2 (en) * | 2006-10-19 | 2010-07-13 | Micron Technology, Inc. | High density chip packages, methods of forming, and systems including same |
US20100263999A1 (en) * | 2007-12-13 | 2010-10-21 | Dimitrios Peroulis | Low-cost process-independent rf mems switch |
US8441272B2 (en) * | 2008-12-30 | 2013-05-14 | Stmicroelectronics S.R.L. | MEMS probe for probe cards for integrated circuits |
JP5673181B2 (ja) * | 2011-02-15 | 2015-02-18 | トヨタ自動車株式会社 | 半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2533511B2 (ja) * | 1987-01-19 | 1996-09-11 | 株式会社日立製作所 | 電子部品の接続構造とその製造方法 |
EP0529503A1 (de) * | 1991-08-22 | 1993-03-03 | Hewlett-Packard Company | Flip-chip-Vorrichtung mit flexibler Befestigung |
US5536963A (en) * | 1994-05-11 | 1996-07-16 | Regents Of The University Of Minnesota | Microdevice with ferroelectric for sensing or applying a force |
US5602422A (en) * | 1995-06-16 | 1997-02-11 | Minnesota Mining And Manufacturing Company | Flexible leads for tape ball grid array circuit |
-
1995
- 1995-07-07 JP JP19617595A patent/JP3611637B2/ja not_active Expired - Fee Related
-
1996
- 1996-07-03 US US08/675,768 patent/US5723894A/en not_active Expired - Lifetime
- 1996-07-05 EP EP96304979A patent/EP0752587B1/de not_active Expired - Lifetime
- 1996-07-05 DE DE69610745T patent/DE69610745T2/de not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10291877B4 (de) * | 2001-04-26 | 2009-01-02 | Advantest Corp. | Mikroschalter und Verfahren zum Herstellen eines Mikroschalters |
Also Published As
Publication number | Publication date |
---|---|
EP0752587A3 (de) | 1997-09-10 |
EP0752587A2 (de) | 1997-01-08 |
JPH0927521A (ja) | 1997-01-28 |
EP0752587B1 (de) | 2000-10-25 |
DE69610745D1 (de) | 2000-11-30 |
US5723894A (en) | 1998-03-03 |
JP3611637B2 (ja) | 2005-01-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD COMPANY (A DELAWARE CORPORATION), |
|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |