DE69605892D1 - Federklammer für Elektronik-Baugruppe - Google Patents

Federklammer für Elektronik-Baugruppe

Info

Publication number
DE69605892D1
DE69605892D1 DE69605892T DE69605892T DE69605892D1 DE 69605892 D1 DE69605892 D1 DE 69605892D1 DE 69605892 T DE69605892 T DE 69605892T DE 69605892 T DE69605892 T DE 69605892T DE 69605892 D1 DE69605892 D1 DE 69605892D1
Authority
DE
Germany
Prior art keywords
spring clip
electronics assembly
electronics
assembly
clip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69605892T
Other languages
English (en)
Other versions
DE69605892T2 (de
Inventor
Michael J Luettgen
Jon G Bartanen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co
Original Assignee
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co filed Critical Ford Motor Co
Publication of DE69605892D1 publication Critical patent/DE69605892D1/de
Application granted granted Critical
Publication of DE69605892T2 publication Critical patent/DE69605892T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Clamps And Clips (AREA)
  • Springs (AREA)
DE69605892T 1996-02-05 1996-12-20 Federklammer für Elektronik-Baugruppe Expired - Fee Related DE69605892T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/595,459 US5731955A (en) 1996-02-05 1996-02-05 Spring clip for electronics assembly

Publications (2)

Publication Number Publication Date
DE69605892D1 true DE69605892D1 (de) 2000-02-03
DE69605892T2 DE69605892T2 (de) 2000-05-04

Family

ID=24383317

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69605892T Expired - Fee Related DE69605892T2 (de) 1996-02-05 1996-12-20 Federklammer für Elektronik-Baugruppe

Country Status (4)

Country Link
US (1) US5731955A (de)
EP (1) EP0788155B1 (de)
DE (1) DE69605892T2 (de)
ES (1) ES2140034T3 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6330991B1 (en) * 1997-06-23 2001-12-18 Micron Technology, Inc. Apparatus for mounting an element
US6049963A (en) * 1997-06-23 2000-04-18 Micron Electronics, Inc. Method for mounting an element
US6276041B1 (en) 1997-09-10 2001-08-21 Micron Technology, Inc. Method for coupling computer components
US6349039B1 (en) 1997-09-10 2002-02-19 Micron Technology, Inc. Apparatus for coupling computer components
US6023832A (en) * 1998-01-20 2000-02-15 Micron Electronics, Inc. Cam heat sink clip installation and removal tool and method
FR2778309B1 (fr) * 1998-04-30 2000-07-21 Valeo Electronique Dispositif pour le blocage mecanique d'un composant electronique par rapport a un support et procede de montage d'une carte a circuit imprime sur un support utilisant un tel dispositif
US6377447B1 (en) 1999-09-16 2002-04-23 Micron Technology, Inc. Quick release disk drive to chassis mounting apparatus and method
US6407924B1 (en) 2001-01-09 2002-06-18 International Business Machines Corporation Enhanced thermal path mechanical tolerance system
DE102006018716A1 (de) * 2006-04-20 2007-10-25 Ebm-Papst Mulfingen Gmbh & Co. Kg Anordnung zur Kontaktierung von Leistungshalbleitern an einer Kühlfläche
US20090052139A1 (en) * 2007-08-23 2009-02-26 Kuping Lai Heat-Dissipation Apparatus For Communication Device With Card Slot
US9312201B2 (en) 2010-12-30 2016-04-12 Schneider Electric It Corporation Heat dissipation device
US8893770B2 (en) * 2011-07-29 2014-11-25 Schneider Electric It Corporation Heat sink assembly for electronic components
CN108336892B (zh) * 2017-05-25 2021-11-16 泰达电子股份有限公司 电源模块及其组装结构与组装方法
US11647611B2 (en) * 2019-04-05 2023-05-09 Dana Tm4 Inc. Thermal interface for plurality of discrete electronic devices
CN110325008B (zh) * 2019-07-04 2024-03-22 杭州洲钜电子科技有限公司 多功率管电路板组装装置
KR102511000B1 (ko) * 2021-06-14 2023-03-17 제엠제코(주) 반도체 패키지용 클립 구조체 및 이를 포함하는 반도체 패키지

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4693698A (en) * 1981-11-16 1987-09-15 Rockford Acromatic Products Co. Composite roller for the tripod of a free-plunging constant velocity universal joint
FR2578710B1 (fr) * 1985-03-07 1988-03-04 Bendix Electronics Sa Agrafe multiple de fixation et dispositif de montage collectif de composants electroniques de puissance
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture
US4964198A (en) * 1988-09-21 1990-10-23 Avvid Engineering, Inc. V-shaped clip for attaching a semiconductor device to a heat sink
US5122480A (en) * 1990-04-30 1992-06-16 Motorola, Inc. Method for assembling a heat sink to a circuit element using a retentive spring force
FR2663809B1 (fr) * 1990-06-21 1996-07-19 Siemens Automotive Sa Organe multiple de retenue a ressort et son procede de fabrication.
DE9014091U1 (de) * 1990-10-10 1992-02-13 Robert Bosch Gmbh, 7000 Stuttgart, De
US5225965A (en) * 1992-04-24 1993-07-06 Chrysler Corporation Heat sink load spring assembly
US5274193A (en) * 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
US5466970A (en) * 1992-08-24 1995-11-14 Thermalloy, Inc. Hooked spring clip
US5314345A (en) * 1992-10-09 1994-05-24 Trw Inc. Electrical connection system with interlock
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5436798A (en) * 1994-01-21 1995-07-25 Wakefield Engineering, Inc. Spring clip and heat sink assembly for electronic components

Also Published As

Publication number Publication date
US5731955A (en) 1998-03-24
DE69605892T2 (de) 2000-05-04
EP0788155B1 (de) 1999-12-29
ES2140034T3 (es) 2000-02-16
EP0788155A1 (de) 1997-08-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee