DE69602663D1 - Elektronischer Leistungsmodul - Google Patents

Elektronischer Leistungsmodul

Info

Publication number
DE69602663D1
DE69602663D1 DE69602663T DE69602663T DE69602663D1 DE 69602663 D1 DE69602663 D1 DE 69602663D1 DE 69602663 T DE69602663 T DE 69602663T DE 69602663 T DE69602663 T DE 69602663T DE 69602663 D1 DE69602663 D1 DE 69602663D1
Authority
DE
Germany
Prior art keywords
power module
electronic power
electronic
module
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69602663T
Other languages
English (en)
Other versions
DE69602663T2 (de
Inventor
Gerard Jaeger
Rudolf Dinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asulab AG
Original Assignee
Asulab AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asulab AG filed Critical Asulab AG
Publication of DE69602663D1 publication Critical patent/DE69602663D1/de
Application granted granted Critical
Publication of DE69602663T2 publication Critical patent/DE69602663T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69602663T 1995-03-21 1996-03-14 Elektronischer Leistungsmodul Expired - Fee Related DE69602663T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9503279A FR2732184B1 (fr) 1995-03-21 1995-03-21 Module electrique de puissance

Publications (2)

Publication Number Publication Date
DE69602663D1 true DE69602663D1 (de) 1999-07-08
DE69602663T2 DE69602663T2 (de) 2000-01-27

Family

ID=9477247

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69602663T Expired - Fee Related DE69602663T2 (de) 1995-03-21 1996-03-14 Elektronischer Leistungsmodul

Country Status (6)

Country Link
US (1) US5715142A (de)
EP (1) EP0734066B1 (de)
JP (1) JPH0922981A (de)
CA (1) CA2172206A1 (de)
DE (1) DE69602663T2 (de)
FR (1) FR2732184B1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4022066B2 (ja) * 2001-12-28 2007-12-12 株式会社エンプラス 部材取付構造
US6678163B1 (en) * 2002-12-19 2004-01-13 Westcode Semiconductors Limited Housing for semiconductor chips
US8637981B2 (en) * 2011-03-30 2014-01-28 International Rectifier Corporation Dual compartment semiconductor package with temperature sensor
CN105072872A (zh) * 2015-08-08 2015-11-18 衢州昀睿工业设计有限公司 一种用于功率器件的散热系统
CN113035807B (zh) * 2021-03-08 2022-05-27 广东神思半导体有限公司 一种带有稳定散热结构的三极管

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4538168A (en) * 1981-09-30 1985-08-27 Unitrode Corporation High power semiconductor package
DE3232168A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit druckkontakt
EP0138048B1 (de) * 1983-09-29 1993-12-15 Kabushiki Kaisha Toshiba Halbleiteranordnung in Druckpackung
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US4612601A (en) * 1983-11-30 1986-09-16 Nec Corporation Heat dissipative integrated circuit chip package
EP0168456B1 (de) * 1984-01-23 1988-06-08 Telemecanique Anordnung zum montieren und verbinden von leistungshalbleitern
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture
EP0532244B1 (de) * 1991-09-13 1996-12-18 Fuji Electric Co. Ltd. Halbleiteranordnung
US5225965A (en) * 1992-04-24 1993-07-06 Chrysler Corporation Heat sink load spring assembly
EP0619605B1 (de) * 1993-04-05 1996-08-28 STMicroelectronics S.r.l. Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke

Also Published As

Publication number Publication date
CA2172206A1 (en) 1996-09-22
EP0734066B1 (de) 1999-06-02
FR2732184A1 (fr) 1996-09-27
DE69602663T2 (de) 2000-01-27
EP0734066A1 (de) 1996-09-25
FR2732184B1 (fr) 1997-04-30
JPH0922981A (ja) 1997-01-21
US5715142A (en) 1998-02-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee