DE69518708D1 - Verfahren zur herstellung einer vorrichtung durch direktes bestrahlen von einigen teilen der oberflaeche der vorrichtung durch eine maske und durch indirektes bestrahlen von anderen teilen durch die maske via einer reflektierenden oberflaeche unter herstellung eines musters - Google Patents

Verfahren zur herstellung einer vorrichtung durch direktes bestrahlen von einigen teilen der oberflaeche der vorrichtung durch eine maske und durch indirektes bestrahlen von anderen teilen durch die maske via einer reflektierenden oberflaeche unter herstellung eines musters

Info

Publication number
DE69518708D1
DE69518708D1 DE69518708T DE69518708T DE69518708D1 DE 69518708 D1 DE69518708 D1 DE 69518708D1 DE 69518708 T DE69518708 T DE 69518708T DE 69518708 T DE69518708 T DE 69518708T DE 69518708 D1 DE69518708 D1 DE 69518708D1
Authority
DE
Germany
Prior art keywords
parts
mask
irradiating
producing
indirectly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69518708T
Other languages
English (en)
Other versions
DE69518708T2 (de
Inventor
Johannes Nellissen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE69518708D1 publication Critical patent/DE69518708D1/de
Publication of DE69518708T2 publication Critical patent/DE69518708T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
DE69518708T 1994-04-15 1995-04-07 Verfahren zur herstellung einer vorrichtung durch direktes bestrahlen von einigen teilen der oberflaeche der vorrichtung durch eine maske und durch indirektes bestrahlen von anderen teilen durch die maske via einer reflektierenden oberflaeche unter herstellung eines musters Expired - Lifetime DE69518708T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94201028 1994-04-15
PCT/IB1995/000247 WO1995028820A1 (en) 1994-04-15 1995-04-07 Method of manufacturing a device, by irradiating some parts of the surface of the device directly through a mask, and other parts indirectly through the mask and via a reflecting surface, thereby producing a pattern

Publications (2)

Publication Number Publication Date
DE69518708D1 true DE69518708D1 (de) 2000-10-12
DE69518708T2 DE69518708T2 (de) 2001-06-07

Family

ID=8216805

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69518708T Expired - Lifetime DE69518708T2 (de) 1994-04-15 1995-04-07 Verfahren zur herstellung einer vorrichtung durch direktes bestrahlen von einigen teilen der oberflaeche der vorrichtung durch eine maske und durch indirektes bestrahlen von anderen teilen durch die maske via einer reflektierenden oberflaeche unter herstellung eines musters

Country Status (8)

Country Link
US (1) US5686230A (de)
EP (1) EP0704145B1 (de)
JP (1) JP3736850B2 (de)
KR (1) KR100371729B1 (de)
DE (1) DE69518708T2 (de)
MY (1) MY112900A (de)
TW (1) TW353857B (de)
WO (1) WO1995028820A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5955776A (en) * 1996-12-04 1999-09-21 Ball Semiconductor, Inc. Spherical shaped semiconductor integrated circuit
US6097472A (en) * 1997-04-17 2000-08-01 Canon Kabushiki Kaisha Apparatus and method for exposing a pattern on a ball-like device material
US6130742A (en) * 1997-10-17 2000-10-10 Ball Semiconductor, Ltd. Exposure apparatus for a ball shaped substrate
US6071315A (en) * 1998-07-10 2000-06-06 Ball Semiconductor, Inc. Two-dimensional to three-dimensional VLSI design
US6061118A (en) * 1998-07-10 2000-05-09 Ball Semiconductor, Inc. Reflection system for imaging on a nonplanar substrate
US6696223B2 (en) * 1999-02-19 2004-02-24 Agilent Technologies, Inc. Method for performing photolithography
DE10045072A1 (de) * 2000-09-12 2002-04-04 Epcos Ag Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einer nichtplanen Oberfläche und Verwendung des Verfahrens
US20050170287A1 (en) * 2004-01-30 2005-08-04 Kanga Rustom S. Photosensitive printing sleeves and method of forming the same
KR20120010043A (ko) 2010-07-23 2012-02-02 삼성모바일디스플레이주식회사 다결정 실리콘층의 제조 방법 및 상기 다결정 실리콘층 제조 방법을 포함하는 박막 트랜지스터의 제조 방법
EP3165966A1 (de) * 2015-11-06 2017-05-10 Paul Scherrer Institut Verfahren zur selektiven oberflächenbearbeitung mittels gerichteter strahlen

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1658509A (en) * 1925-10-07 1928-02-07 Wadsworth Watch Case Co Surface-ornamenting process and apparatus
GB784761A (en) * 1954-08-18 1957-10-16 Aladdin Ind Inc Method of and apparatus for producing coils photographically
US3645179A (en) * 1969-03-27 1972-02-29 Ibm Apparatus for exposing photoresist in cylinders
US3645178A (en) * 1969-03-27 1972-02-29 Ibm Apparatus for exposing photoresist in cylinders
US3614225A (en) * 1969-11-06 1971-10-19 Western Electric Co Photoprinting apparatus
US4102734A (en) * 1976-10-05 1978-07-25 Mbi, Inc. Method for producing a design on an arcuate surface
US5147760A (en) * 1989-07-21 1992-09-15 Mitsubishi Denki Kabushiki Kaisha Method of exposing printed wiring boards having through holes
JPH0476985A (ja) * 1990-07-18 1992-03-11 Cmk Corp プリント配線板の製造法
US5461455A (en) * 1993-08-23 1995-10-24 International Business Machines Corporation Optical system for the projection of patterned light onto the surfaces of three dimensional objects

Also Published As

Publication number Publication date
EP0704145A1 (de) 1996-04-03
DE69518708T2 (de) 2001-06-07
US5686230A (en) 1997-11-11
MY112900A (en) 2001-10-31
TW353857B (en) 1999-03-01
JP3736850B2 (ja) 2006-01-18
JPH08511913A (ja) 1996-12-10
KR100371729B1 (ko) 2003-04-08
WO1995028820A1 (en) 1995-10-26
EP0704145B1 (de) 2000-09-06
KR960703313A (ko) 1996-06-19

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)