DE69518708D1 - Verfahren zur herstellung einer vorrichtung durch direktes bestrahlen von einigen teilen der oberflaeche der vorrichtung durch eine maske und durch indirektes bestrahlen von anderen teilen durch die maske via einer reflektierenden oberflaeche unter herstellung eines musters - Google Patents
Verfahren zur herstellung einer vorrichtung durch direktes bestrahlen von einigen teilen der oberflaeche der vorrichtung durch eine maske und durch indirektes bestrahlen von anderen teilen durch die maske via einer reflektierenden oberflaeche unter herstellung eines mustersInfo
- Publication number
- DE69518708D1 DE69518708D1 DE69518708T DE69518708T DE69518708D1 DE 69518708 D1 DE69518708 D1 DE 69518708D1 DE 69518708 T DE69518708 T DE 69518708T DE 69518708 T DE69518708 T DE 69518708T DE 69518708 D1 DE69518708 D1 DE 69518708D1
- Authority
- DE
- Germany
- Prior art keywords
- parts
- mask
- irradiating
- producing
- indirectly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94201028 | 1994-04-15 | ||
PCT/IB1995/000247 WO1995028820A1 (en) | 1994-04-15 | 1995-04-07 | Method of manufacturing a device, by irradiating some parts of the surface of the device directly through a mask, and other parts indirectly through the mask and via a reflecting surface, thereby producing a pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69518708D1 true DE69518708D1 (de) | 2000-10-12 |
DE69518708T2 DE69518708T2 (de) | 2001-06-07 |
Family
ID=8216805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69518708T Expired - Lifetime DE69518708T2 (de) | 1994-04-15 | 1995-04-07 | Verfahren zur herstellung einer vorrichtung durch direktes bestrahlen von einigen teilen der oberflaeche der vorrichtung durch eine maske und durch indirektes bestrahlen von anderen teilen durch die maske via einer reflektierenden oberflaeche unter herstellung eines musters |
Country Status (8)
Country | Link |
---|---|
US (1) | US5686230A (de) |
EP (1) | EP0704145B1 (de) |
JP (1) | JP3736850B2 (de) |
KR (1) | KR100371729B1 (de) |
DE (1) | DE69518708T2 (de) |
MY (1) | MY112900A (de) |
TW (1) | TW353857B (de) |
WO (1) | WO1995028820A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5955776A (en) * | 1996-12-04 | 1999-09-21 | Ball Semiconductor, Inc. | Spherical shaped semiconductor integrated circuit |
US6097472A (en) * | 1997-04-17 | 2000-08-01 | Canon Kabushiki Kaisha | Apparatus and method for exposing a pattern on a ball-like device material |
US6130742A (en) * | 1997-10-17 | 2000-10-10 | Ball Semiconductor, Ltd. | Exposure apparatus for a ball shaped substrate |
US6071315A (en) * | 1998-07-10 | 2000-06-06 | Ball Semiconductor, Inc. | Two-dimensional to three-dimensional VLSI design |
JP2002520838A (ja) * | 1998-07-10 | 2002-07-09 | ボール セミコンダクター インコーポレイテッド | 非平面基板での結像用反射システム |
US6696223B2 (en) * | 1999-02-19 | 2004-02-24 | Agilent Technologies, Inc. | Method for performing photolithography |
DE10045072A1 (de) * | 2000-09-12 | 2002-04-04 | Epcos Ag | Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einer nichtplanen Oberfläche und Verwendung des Verfahrens |
US20050170287A1 (en) * | 2004-01-30 | 2005-08-04 | Kanga Rustom S. | Photosensitive printing sleeves and method of forming the same |
KR20120010043A (ko) | 2010-07-23 | 2012-02-02 | 삼성모바일디스플레이주식회사 | 다결정 실리콘층의 제조 방법 및 상기 다결정 실리콘층 제조 방법을 포함하는 박막 트랜지스터의 제조 방법 |
EP3165966A1 (de) * | 2015-11-06 | 2017-05-10 | Paul Scherrer Institut | Verfahren zur selektiven oberflächenbearbeitung mittels gerichteter strahlen |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1658509A (en) * | 1925-10-07 | 1928-02-07 | Wadsworth Watch Case Co | Surface-ornamenting process and apparatus |
GB784761A (en) * | 1954-08-18 | 1957-10-16 | Aladdin Ind Inc | Method of and apparatus for producing coils photographically |
US3645178A (en) * | 1969-03-27 | 1972-02-29 | Ibm | Apparatus for exposing photoresist in cylinders |
US3645179A (en) * | 1969-03-27 | 1972-02-29 | Ibm | Apparatus for exposing photoresist in cylinders |
US3614225A (en) * | 1969-11-06 | 1971-10-19 | Western Electric Co | Photoprinting apparatus |
US4102734A (en) * | 1976-10-05 | 1978-07-25 | Mbi, Inc. | Method for producing a design on an arcuate surface |
US5147760A (en) * | 1989-07-21 | 1992-09-15 | Mitsubishi Denki Kabushiki Kaisha | Method of exposing printed wiring boards having through holes |
JPH0476985A (ja) * | 1990-07-18 | 1992-03-11 | Cmk Corp | プリント配線板の製造法 |
US5461455A (en) * | 1993-08-23 | 1995-10-24 | International Business Machines Corporation | Optical system for the projection of patterned light onto the surfaces of three dimensional objects |
-
1995
- 1995-04-07 KR KR1019950705639A patent/KR100371729B1/ko not_active IP Right Cessation
- 1995-04-07 WO PCT/IB1995/000247 patent/WO1995028820A1/en active IP Right Grant
- 1995-04-07 EP EP95913301A patent/EP0704145B1/de not_active Expired - Lifetime
- 1995-04-07 DE DE69518708T patent/DE69518708T2/de not_active Expired - Lifetime
- 1995-04-07 JP JP52683995A patent/JP3736850B2/ja not_active Expired - Lifetime
- 1995-04-13 MY MYPI95000965A patent/MY112900A/en unknown
- 1995-04-13 US US08/423,243 patent/US5686230A/en not_active Expired - Lifetime
- 1995-04-22 TW TW084103984A patent/TW353857B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH08511913A (ja) | 1996-12-10 |
KR100371729B1 (ko) | 2003-04-08 |
EP0704145A1 (de) | 1996-04-03 |
TW353857B (en) | 1999-03-01 |
WO1995028820A1 (en) | 1995-10-26 |
MY112900A (en) | 2001-10-31 |
KR960703313A (ko) | 1996-06-19 |
US5686230A (en) | 1997-11-11 |
DE69518708T2 (de) | 2001-06-07 |
EP0704145B1 (de) | 2000-09-06 |
JP3736850B2 (ja) | 2006-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de | ||
8370 | Indication of lapse of patent is to be deleted | ||
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |