DE69517700D1 - Schärfungsverfahren für emissionstellen durch oxydation bei niedriger temperatur - Google Patents

Schärfungsverfahren für emissionstellen durch oxydation bei niedriger temperatur

Info

Publication number
DE69517700D1
DE69517700D1 DE69517700T DE69517700T DE69517700D1 DE 69517700 D1 DE69517700 D1 DE 69517700D1 DE 69517700 T DE69517700 T DE 69517700T DE 69517700 T DE69517700 T DE 69517700T DE 69517700 D1 DE69517700 D1 DE 69517700D1
Authority
DE
Germany
Prior art keywords
oxydation
low temperature
emission points
arming procedure
arming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69517700T
Other languages
English (en)
Other versions
DE69517700T2 (de
Inventor
A Cathey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of DE69517700D1 publication Critical patent/DE69517700D1/de
Application granted granted Critical
Publication of DE69517700T2 publication Critical patent/DE69517700T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • H01J9/022Manufacture of electrodes or electrode systems of cold cathodes
    • H01J9/025Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
DE69517700T 1994-11-04 1995-11-02 Schärfungsverfahren für emissionstellen durch oxydation bei niedriger temperatur Expired - Lifetime DE69517700T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33481894A 1994-11-04 1994-11-04
PCT/US1995/014326 WO1996014650A1 (en) 1994-11-04 1995-11-02 Method for sharpening emitter sites using low temperature oxidation processes

Publications (2)

Publication Number Publication Date
DE69517700D1 true DE69517700D1 (de) 2000-08-03
DE69517700T2 DE69517700T2 (de) 2000-11-23

Family

ID=23308964

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69517700T Expired - Lifetime DE69517700T2 (de) 1994-11-04 1995-11-02 Schärfungsverfahren für emissionstellen durch oxydation bei niedriger temperatur

Country Status (7)

Country Link
US (2) US6312965B1 (de)
EP (1) EP0789931B1 (de)
JP (1) JP3095780B2 (de)
KR (1) KR100287271B1 (de)
AU (1) AU4145196A (de)
DE (1) DE69517700T2 (de)
WO (1) WO1996014650A1 (de)

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US6187604B1 (en) * 1994-09-16 2001-02-13 Micron Technology, Inc. Method of making field emitters using porous silicon
AU4145196A (en) 1994-11-04 1996-05-31 Micron Display Technology, Inc. Method for sharpening emitter sites using low temperature oxidation processes
US6080032A (en) * 1997-10-10 2000-06-27 Micron Technology, Inc. Process for low temperature semiconductor fabrication
AU8041698A (en) * 1998-02-27 1999-09-15 Isle Bright Limited Field emitter and method for producing the same
US6104139A (en) * 1998-08-31 2000-08-15 Candescent Technologies Corporation Procedures and apparatus for turning-on and turning-off elements within a field emission display device
US6165808A (en) 1998-10-06 2000-12-26 Micron Technology, Inc. Low temperature process for sharpening tapered silicon structures
US6436839B1 (en) * 1999-06-01 2002-08-20 Taiwan Semiconductor Manufacturing Company Increasing programming silicide process window by forming native oxide film on amourphous Si after metal etching
US7105997B1 (en) * 1999-08-31 2006-09-12 Micron Technology, Inc. Field emitter devices with emitters having implanted layer
JP4109084B2 (ja) * 2002-11-05 2008-06-25 オリンパス株式会社 医療情報システム及び医療情報管理方法
KR100502821B1 (ko) * 2002-12-26 2005-07-22 이호영 구리산화물 또는 구리 나노와이어로 이루어진 전자방출팁의 저온 형성 방법 및 이 방법에 의해 제조된 전자방출팁을 포함하는 디스플레이 장치 또는 광원
US7273638B2 (en) * 2003-01-07 2007-09-25 International Business Machines Corp. High density plasma oxidation
US7974119B2 (en) 2008-07-10 2011-07-05 Seagate Technology Llc Transmission gate-based spin-transfer torque memory unit
WO2010024447A2 (ja) * 2008-09-01 2010-03-04 財団法人新産業創造研究機構 カラーセンター含有酸化マグネシウムとその薄膜、波長可変レーザー媒体、レーザー装置、光源デバイス
US7936580B2 (en) 2008-10-20 2011-05-03 Seagate Technology Llc MRAM diode array and access method
US9030867B2 (en) * 2008-10-20 2015-05-12 Seagate Technology Llc Bipolar CMOS select device for resistive sense memory
US7936583B2 (en) 2008-10-30 2011-05-03 Seagate Technology Llc Variable resistive memory punchthrough access method
US7825478B2 (en) * 2008-11-07 2010-11-02 Seagate Technology Llc Polarity dependent switch for resistive sense memory
US8178864B2 (en) 2008-11-18 2012-05-15 Seagate Technology Llc Asymmetric barrier diode
US8203869B2 (en) 2008-12-02 2012-06-19 Seagate Technology Llc Bit line charge accumulation sensing for resistive changing memory
US8159856B2 (en) 2009-07-07 2012-04-17 Seagate Technology Llc Bipolar select device for resistive sense memory
US8158964B2 (en) 2009-07-13 2012-04-17 Seagate Technology Llc Schottky diode switch and memory units containing the same
US8617952B2 (en) 2010-09-28 2013-12-31 Seagate Technology Llc Vertical transistor with hardening implatation
US8648426B2 (en) 2010-12-17 2014-02-11 Seagate Technology Llc Tunneling transistors

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US3500102A (en) 1967-05-15 1970-03-10 Us Army Thin electron tube with electron emitters at intersections of crossed conductors
US3798752A (en) 1971-03-11 1974-03-26 Nippon Electric Co Method of producing a silicon gate insulated-gate field effect transistor
US3814968A (en) 1972-02-11 1974-06-04 Lucas Industries Ltd Solid state radiation sensitive field electron emitter and methods of fabrication thereof
US3970887A (en) 1974-06-19 1976-07-20 Micro-Bit Corporation Micro-structure field emission electron source
DE3853744T2 (de) 1987-07-15 1996-01-25 Canon Kk Elektronenemittierende Vorrichtung.
FR2623013A1 (fr) 1987-11-06 1989-05-12 Commissariat Energie Atomique Source d'electrons a cathodes emissives a micropointes et dispositif de visualisation par cathodoluminescence excitee par emission de champ,utilisant cette source
US4874981A (en) 1988-05-10 1989-10-17 Sri International Automatically focusing field emission electrode
US5228878A (en) 1989-12-18 1993-07-20 Seiko Epson Corporation Field electron emission device production method
US5039625A (en) 1990-04-27 1991-08-13 Mcnc Maximum areal density recessed oxide isolation (MADROX) process
FR2663462B1 (fr) 1990-06-13 1992-09-11 Commissariat Energie Atomique Source d'electrons a cathodes emissives a micropointes.
US5201992A (en) * 1990-07-12 1993-04-13 Bell Communications Research, Inc. Method for making tapered microminiature silicon structures
JP2626276B2 (ja) 1991-02-06 1997-07-02 双葉電子工業株式会社 電子放出素子
JP2550798B2 (ja) * 1991-04-12 1996-11-06 富士通株式会社 微小冷陰極の製造方法
US5100355A (en) 1991-06-28 1992-03-31 Bell Communications Research, Inc. Microminiature tapered all-metal structures
US5266530A (en) * 1991-11-08 1993-11-30 Bell Communications Research, Inc. Self-aligned gated electron field emitter
US5199917A (en) 1991-12-09 1993-04-06 Cornell Research Foundation, Inc. Silicon tip field emission cathode arrays and fabrication thereof
US5229331A (en) * 1992-02-14 1993-07-20 Micron Technology, Inc. Method to form self-aligned gate structures around cold cathode emitter tips using chemical mechanical polishing technology
US5151061A (en) 1992-02-21 1992-09-29 Micron Technology, Inc. Method to form self-aligned tips for flat panel displays
US5259799A (en) 1992-03-02 1993-11-09 Micron Technology, Inc. Method to form self-aligned gate structures and focus rings
US5186670A (en) 1992-03-02 1993-02-16 Micron Technology, Inc. Method to form self-aligned gate structures and focus rings
US5205770A (en) 1992-03-12 1993-04-27 Micron Technology, Inc. Method to form high aspect ratio supports (spacers) for field emission display using micro-saw technology
US5210472A (en) 1992-04-07 1993-05-11 Micron Technology, Inc. Flat panel display in which low-voltage row and column address signals control a much pixel activation voltage
US5232549A (en) 1992-04-14 1993-08-03 Micron Technology, Inc. Spacers for field emission display fabricated via self-aligned high energy ablation
US5302238A (en) 1992-05-15 1994-04-12 Micron Technology, Inc. Plasma dry etch to produce atomically sharp asperities useful as cold cathodes
US5283500A (en) 1992-05-28 1994-02-01 At&T Bell Laboratories Flat panel field emission display apparatus
US5269877A (en) 1992-07-02 1993-12-14 Xerox Corporation Field emission structure and method of forming same
US5266350A (en) 1992-07-14 1993-11-30 The Dow Chemical Company Processes and materials for treatment and repair of electrolytic cell separators
GB9216647D0 (en) * 1992-08-05 1992-09-16 Isis Innovation Cold cathodes
US5378182A (en) 1993-07-22 1995-01-03 Industrial Technology Research Institute Self-aligned process for gated field emitters
AU4145196A (en) 1994-11-04 1996-05-31 Micron Display Technology, Inc. Method for sharpening emitter sites using low temperature oxidation processes

Also Published As

Publication number Publication date
AU4145196A (en) 1996-05-31
EP0789931B1 (de) 2000-06-28
JP3095780B2 (ja) 2000-10-10
US6312965B1 (en) 2001-11-06
KR100287271B1 (ko) 2001-04-16
JPH10507576A (ja) 1998-07-21
EP0789931A1 (de) 1997-08-20
WO1996014650A1 (en) 1996-05-17
US5923948A (en) 1999-07-13
DE69517700T2 (de) 2000-11-23

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