DE69505099D1 - Elektrische widerstandsstruktur - Google Patents
Elektrische widerstandsstrukturInfo
- Publication number
- DE69505099D1 DE69505099D1 DE69505099T DE69505099T DE69505099D1 DE 69505099 D1 DE69505099 D1 DE 69505099D1 DE 69505099 T DE69505099 T DE 69505099T DE 69505099 T DE69505099 T DE 69505099T DE 69505099 D1 DE69505099 D1 DE 69505099D1
- Authority
- DE
- Germany
- Prior art keywords
- electric resistance
- resistance structure
- electric
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Non-Adjustable Resistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94202264 | 1994-08-05 | ||
PCT/IB1995/000565 WO1996004668A1 (en) | 1994-08-05 | 1995-07-17 | Electrically resistive structure |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69505099D1 true DE69505099D1 (de) | 1998-11-05 |
DE69505099T2 DE69505099T2 (de) | 1999-05-20 |
Family
ID=8217088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69505099T Expired - Fee Related DE69505099T2 (de) | 1994-08-05 | 1995-07-17 | Elektrische widerstandsstruktur |
Country Status (5)
Country | Link |
---|---|
US (1) | US6297556B1 (de) |
EP (1) | EP0725969B1 (de) |
JP (1) | JPH09503627A (de) |
DE (1) | DE69505099T2 (de) |
WO (1) | WO1996004668A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6194990B1 (en) * | 1999-03-16 | 2001-02-27 | Motorola, Inc. | Printed circuit board with a multilayer integral thin-film metal resistor and method therefor |
JP4780689B2 (ja) * | 2001-03-09 | 2011-09-28 | ローム株式会社 | チップ抵抗器 |
US7986027B2 (en) * | 2006-10-20 | 2011-07-26 | Analog Devices, Inc. | Encapsulated metal resistor |
US9704944B2 (en) * | 2013-02-28 | 2017-07-11 | Texas Instruments Deutschland Gmbh | Three precision resistors of different sheet resistance at same level |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3883947A (en) * | 1971-11-05 | 1975-05-20 | Bosch Gmbh Robert | Method of making a thin film electronic circuit unit |
US3781610A (en) * | 1972-05-22 | 1973-12-25 | G Bodway | Thin film circuits and method for manufacture |
FR2210881B1 (de) * | 1972-12-14 | 1976-04-23 | Honeywell Bull | |
US4019168A (en) * | 1975-08-21 | 1977-04-19 | Airco, Inc. | Bilayer thin film resistor and method for manufacture |
US4164607A (en) * | 1977-04-04 | 1979-08-14 | General Dynamics Corporation Electronics Division | Thin film resistor having a thin layer of resistive metal of a nickel, chromium, gold alloy |
DE3200983A1 (de) * | 1982-01-14 | 1983-07-21 | Siemens AG, 1000 Berlin und 8000 München | Elektrisches netzwerk |
IT1179418B (it) * | 1984-07-20 | 1987-09-16 | Selenia Ind Elettroniche | Procedimento per la realizzazione di resistori integrati a film sottile con doppio strato resistivo, mediante erosione ionica |
DE3605425A1 (de) * | 1986-02-20 | 1987-08-27 | Standard Elektrik Lorenz Ag | Duennschichtschaltung und ein verfahren zu ihrer herstellung |
US4690728A (en) * | 1986-10-23 | 1987-09-01 | Intel Corporation | Pattern delineation of vertical load resistor |
US4891977A (en) * | 1988-12-16 | 1990-01-09 | Honeywell Inc. | Microbridge sensor bonding pad design for improved adhesion |
US5021867A (en) * | 1989-05-30 | 1991-06-04 | Westinghouse Electric Corp. | Refractory resistors with etch stop for superconductor integrated circuits |
US5041191A (en) * | 1989-11-13 | 1991-08-20 | Rockwell International Corporation | Diffusion barrier for thin film hybrid circuits |
JPH07115175A (ja) * | 1993-10-14 | 1995-05-02 | Nec Corp | 半導体装置 |
-
1995
- 1995-07-17 JP JP8506352A patent/JPH09503627A/ja not_active Ceased
- 1995-07-17 WO PCT/IB1995/000565 patent/WO1996004668A1/en active IP Right Grant
- 1995-07-17 DE DE69505099T patent/DE69505099T2/de not_active Expired - Fee Related
- 1995-07-17 EP EP95923526A patent/EP0725969B1/de not_active Expired - Lifetime
-
1997
- 1997-03-10 US US08/814,451 patent/US6297556B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69505099T2 (de) | 1999-05-20 |
JPH09503627A (ja) | 1997-04-08 |
WO1996004668A1 (en) | 1996-02-15 |
EP0725969A1 (de) | 1996-08-14 |
EP0725969B1 (de) | 1998-09-30 |
US6297556B1 (en) | 2001-10-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |