DE69431233T2 - Bestimmung des Oberflächenisolationswiderstands von Leiterplatten - Google Patents

Bestimmung des Oberflächenisolationswiderstands von Leiterplatten

Info

Publication number
DE69431233T2
DE69431233T2 DE69431233T DE69431233T DE69431233T2 DE 69431233 T2 DE69431233 T2 DE 69431233T2 DE 69431233 T DE69431233 T DE 69431233T DE 69431233 T DE69431233 T DE 69431233T DE 69431233 T2 DE69431233 T2 DE 69431233T2
Authority
DE
Germany
Prior art keywords
determination
printed circuit
circuit boards
insulation resistance
surface insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69431233T
Other languages
English (en)
Other versions
DE69431233D1 (de
Inventor
John P Peterson
Randal T Fox
Richard A Szymanowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Nortel Networks Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nortel Networks Ltd filed Critical Nortel Networks Ltd
Publication of DE69431233D1 publication Critical patent/DE69431233D1/de
Application granted granted Critical
Publication of DE69431233T2 publication Critical patent/DE69431233T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
    • G01R31/1263—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
    • G01R31/129—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation of components or parts made of semiconducting materials; of LV components or parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69431233T 1993-12-13 1994-12-02 Bestimmung des Oberflächenisolationswiderstands von Leiterplatten Expired - Fee Related DE69431233T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/165,473 US5457390A (en) 1993-12-13 1993-12-13 Circuit board manufacture

Publications (2)

Publication Number Publication Date
DE69431233D1 DE69431233D1 (de) 2002-10-02
DE69431233T2 true DE69431233T2 (de) 2003-01-02

Family

ID=22599043

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69431233T Expired - Fee Related DE69431233T2 (de) 1993-12-13 1994-12-02 Bestimmung des Oberflächenisolationswiderstands von Leiterplatten

Country Status (4)

Country Link
US (2) US5457390A (de)
EP (1) EP0657744B1 (de)
CA (1) CA2135953A1 (de)
DE (1) DE69431233T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017106989B4 (de) * 2016-04-04 2020-12-24 Fanuc Corporation Verschlechterungserkennungsgerät für eine leiterplatte

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054720A (en) * 1997-11-06 2000-04-25 International Business Machines Corporation Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture
US6040530A (en) * 1997-12-05 2000-03-21 Hewlett-Packard Company Versatile printed circuit board for testing processing reliability
US6777965B1 (en) * 1998-07-28 2004-08-17 Micron Technology, Inc. Interposer for electrically coupling a semiconductive device to an electrical apparatus
JP2000183467A (ja) * 1998-12-14 2000-06-30 Oki Electric Ind Co Ltd 半田付着防止機構
DE19910407A1 (de) * 1999-03-02 2000-09-21 Siemens Ag Testplatte
US6256769B1 (en) 1999-09-30 2001-07-03 Unisys Corporation Printed circuit board routing techniques
US6295207B1 (en) * 1999-10-12 2001-09-25 3Com Corporation Retractable and removable extensions with edge plated PCB's in thin-profile electronic devices
US6429385B1 (en) * 2000-08-08 2002-08-06 Micron Technology, Inc. Non-continuous conductive layer for laminated substrates
US8289031B1 (en) * 2011-05-16 2012-10-16 Rao Dantam K Apparatus for measuring insulation characteristics of coated steel sheet
CN103269563B (zh) * 2013-04-27 2016-03-16 合肥京东方光电科技有限公司 覆晶薄膜柔性电路板及显示装置
US11102921B2 (en) * 2019-02-19 2021-08-24 IEC Electronics Corp. Electrically testing cleanliness of a panel having an electronic assembly

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3360749A (en) * 1964-12-09 1967-12-26 Bell Telephone Labor Inc Elastic wave delay device
US3446972A (en) * 1966-07-18 1969-05-27 Kollmorgen Corp Automatic gain control for photomultiplier tubes employing a monitoring photocell
US3541440A (en) * 1967-08-22 1970-11-17 Rca Corp Use in an automatic testing system of a simulator of an article being tested for testing the testing system
US3621482A (en) * 1969-12-04 1971-11-16 Zenith Radio Corp Tunable surface-wave signal-translating device
US3599092A (en) * 1970-03-12 1971-08-10 Rca Corp Kinescope simulator used in checking an automatic testing system
US4289384A (en) * 1979-04-30 1981-09-15 Bell & Howell Company Electrode structures and interconnecting system
US4386459A (en) * 1980-07-11 1983-06-07 Bell Telephone Laboratories, Incorporated Electrical measurement of level-to-level misalignment in integrated circuits
FR2555011B1 (fr) * 1983-11-15 1986-01-24 Thomson Csf Carte imprimee a empreintes
JPS61234375A (ja) * 1985-04-10 1986-10-18 Hitachi Ltd プリント基板の検査方法およびその検査装置
US4730160A (en) * 1986-03-20 1988-03-08 United Technologies Corporation Programmable thermal emulator test die
FR2690275B1 (fr) * 1992-04-21 1994-06-10 Asulab Sa Moyens de positionnement d'un dispositif microelectronique et ensemble de montage d'un tel dispositif.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017106989B4 (de) * 2016-04-04 2020-12-24 Fanuc Corporation Verschlechterungserkennungsgerät für eine leiterplatte

Also Published As

Publication number Publication date
DE69431233D1 (de) 2002-10-02
US5457390A (en) 1995-10-10
EP0657744A3 (de) 1996-10-30
EP0657744B1 (de) 2002-08-28
US5552567A (en) 1996-09-03
CA2135953A1 (en) 1995-06-14
EP0657744A2 (de) 1995-06-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee