DE69405924D1 - Verfahren zur Herstellung eines Siliziumkörper enthaltenden Gegenstands - Google Patents
Verfahren zur Herstellung eines Siliziumkörper enthaltenden GegenstandsInfo
- Publication number
- DE69405924D1 DE69405924D1 DE69405924T DE69405924T DE69405924D1 DE 69405924 D1 DE69405924 D1 DE 69405924D1 DE 69405924 T DE69405924 T DE 69405924T DE 69405924 T DE69405924 T DE 69405924T DE 69405924 D1 DE69405924 D1 DE 69405924D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- containing silicon
- article containing
- silicon body
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/084,689 US5391269A (en) | 1993-06-29 | 1993-06-29 | Method of making an article comprising a silicon body |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69405924D1 true DE69405924D1 (de) | 1997-11-06 |
DE69405924T2 DE69405924T2 (de) | 1998-04-09 |
Family
ID=22186612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69405924T Expired - Fee Related DE69405924T2 (de) | 1993-06-29 | 1994-06-22 | Verfahren zur Herstellung eines Siliziumkörper enthaltenden Gegenstands |
Country Status (4)
Country | Link |
---|---|
US (1) | US5391269A (de) |
EP (1) | EP0632487B1 (de) |
JP (1) | JP3162910B2 (de) |
DE (1) | DE69405924T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5890745A (en) * | 1997-01-29 | 1999-04-06 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined fluidic coupler |
US6103095A (en) * | 1998-02-27 | 2000-08-15 | Candescent Technologies Corporation | Non-hazardous wet etching method |
US6312581B1 (en) | 1999-11-30 | 2001-11-06 | Agere Systems Optoelectronics Guardian Corp. | Process for fabricating an optical device |
KR100442615B1 (ko) * | 2002-03-05 | 2004-08-02 | 삼성전자주식회사 | 정전용량 감소를 위한 적층구조 및 그 제조방법 |
US20060108672A1 (en) * | 2004-11-24 | 2006-05-25 | Brennan John M | Die bonded device and method for transistor packages |
US7852615B2 (en) * | 2008-01-22 | 2010-12-14 | Avx Corporation | Electrolytic capacitor anode treated with an organometallic compound |
US7768773B2 (en) * | 2008-01-22 | 2010-08-03 | Avx Corporation | Sintered anode pellet etched with an organic acid for use in an electrolytic capacitor |
US7760488B2 (en) * | 2008-01-22 | 2010-07-20 | Avx Corporation | Sintered anode pellet treated with a surfactant for use in an electrolytic capacitor |
US10399166B2 (en) | 2015-10-30 | 2019-09-03 | General Electric Company | System and method for machining workpiece of lattice structure and article machined therefrom |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4765865A (en) * | 1987-05-04 | 1988-08-23 | Ford Motor Company | Silicon etch rate enhancement |
US5179609A (en) * | 1991-08-30 | 1993-01-12 | At&T Bell Laboratories | Optical assembly including fiber attachment |
-
1993
- 1993-06-29 US US08/084,689 patent/US5391269A/en not_active Expired - Lifetime
-
1994
- 1994-06-22 EP EP94304524A patent/EP0632487B1/de not_active Expired - Lifetime
- 1994-06-22 DE DE69405924T patent/DE69405924T2/de not_active Expired - Fee Related
- 1994-06-29 JP JP14689794A patent/JP3162910B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0632487B1 (de) | 1997-10-01 |
JP3162910B2 (ja) | 2001-05-08 |
JPH07321087A (ja) | 1995-12-08 |
US5391269A (en) | 1995-02-21 |
EP0632487A3 (de) | 1996-06-26 |
EP0632487A2 (de) | 1995-01-04 |
DE69405924T2 (de) | 1998-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |