DE69400209D1 - Automatische Einrichtung für den Zusammenbau von elektronischen Teilen - Google Patents

Automatische Einrichtung für den Zusammenbau von elektronischen Teilen

Info

Publication number
DE69400209D1
DE69400209D1 DE69400209T DE69400209T DE69400209D1 DE 69400209 D1 DE69400209 D1 DE 69400209D1 DE 69400209 T DE69400209 T DE 69400209T DE 69400209 T DE69400209 T DE 69400209T DE 69400209 D1 DE69400209 D1 DE 69400209D1
Authority
DE
Germany
Prior art keywords
electronic parts
automatic device
assembling electronic
assembling
automatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69400209T
Other languages
English (en)
Other versions
DE69400209T2 (de
Inventor
Kazuhiro Hineno
Masao Okado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Instruments Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Application granted granted Critical
Publication of DE69400209D1 publication Critical patent/DE69400209D1/de
Publication of DE69400209T2 publication Critical patent/DE69400209T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69400209T 1993-01-18 1994-01-18 Automatische Einrichtung für den Zusammenbau von elektronischen Teilen Expired - Lifetime DE69400209T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05006204A JP3081400B2 (ja) 1993-01-18 1993-01-18 電子部品自動装着装置

Publications (2)

Publication Number Publication Date
DE69400209D1 true DE69400209D1 (de) 1996-07-04
DE69400209T2 DE69400209T2 (de) 1996-10-17

Family

ID=11632011

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69400209T Expired - Lifetime DE69400209T2 (de) 1993-01-18 1994-01-18 Automatische Einrichtung für den Zusammenbau von elektronischen Teilen

Country Status (5)

Country Link
US (1) US5582493A (de)
EP (1) EP0607927B1 (de)
JP (1) JP3081400B2 (de)
KR (1) KR0174578B1 (de)
DE (1) DE69400209T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5853108A (en) * 1995-08-21 1998-12-29 Matsushita Electric Industrial Co., Ltd. Parts feed apparatus and parts feed method
AUPP108197A0 (en) 1997-12-22 1998-01-22 Dow Corning Australia Pty Ltd Stable emulsions
US6547097B1 (en) * 1999-05-27 2003-04-15 The Knight Group Llc Dispensing apparatus and method
JP3498692B2 (ja) * 1999-10-18 2004-02-16 株式会社村田製作所 チップ部品の供給装置
CN103561559B (zh) * 2013-11-21 2016-04-06 何丽进 一种齿轮驱动的竖直部分具有弹性材料的芯片安装装置
CN103561561B (zh) * 2013-11-21 2016-04-13 徐萍 一种由滑块驱动的带锁止销的芯片安装装置
CN103561560B (zh) * 2013-11-21 2016-01-27 吴琼 一种螺杆驱动的压板空腔中设弹性材料的芯片安装装置
CN103607876B (zh) * 2013-11-21 2016-02-10 方小刚 一种齿轮驱动的在压板空腔中设弹性材料的芯片安装装置
CN103561558B (zh) * 2013-11-21 2016-02-24 吴琼 一种由螺杆驱动的带锁止销的芯片安装装置
CN103732050B (zh) * 2014-01-03 2016-03-23 浙江师范大学 一种齿轮驱动的带有限位凸出的芯片安装装置
CN113543511B (zh) * 2021-08-11 2023-08-18 常州冯卡斯登智能科技有限公司 一种具有自动疏通功能的贴片机进料装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993359A (en) * 1975-04-21 1976-11-23 Continental Oil Company Hydraulic solids handling system
US4033031A (en) * 1976-04-22 1977-07-05 Augat, Inc. Method and machine for inserting electrical contacts into electrical interconnection boards
DE7811290U1 (de) * 1977-04-19 1982-02-04 Modular Automation Ltd., Sutto Coldfield, West Midlands Mit druckluft betriebene ausgabevorrichtung zum trennen und ausgeben von kleineren, insbesondere laenglichen werkstuecken
US4459743A (en) * 1980-12-05 1984-07-17 J. Osawa Camera Sales Co., Ltd. Automatic mounting apparatus for chip components
US4801044A (en) * 1986-05-27 1989-01-31 Nitto Kogyo Kabushiki Kaisha Chip separation and alignment apparatus
US4759124A (en) * 1987-04-28 1988-07-26 Universal Instruments Corp. Method and apparatus for controlling component pickup and placement pressures
US5075961A (en) * 1989-10-12 1991-12-31 Dynapert Inc. Radial component insertion machine
JPH03145799A (ja) * 1989-10-31 1991-06-20 Hitachi Ltd チップ電子部品供給装置
GB2262736B (en) * 1991-12-18 1995-06-21 Tdk Corp Electronic component packaging means,and supply mechanism for and method of supplying electronic components by using the electronic component packaging means

Also Published As

Publication number Publication date
JP3081400B2 (ja) 2000-08-28
EP0607927A1 (de) 1994-07-27
US5582493A (en) 1996-12-10
KR0174578B1 (ko) 1999-05-01
JPH06216582A (ja) 1994-08-05
DE69400209T2 (de) 1996-10-17
KR940018161A (ko) 1994-08-16
EP0607927B1 (de) 1996-05-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI HIGH-TECH INSTRUMENTS CO., LTD., GUNMA, JP