DE69327069T2 - Vorrichtung und Verfahren zur Plasmaerzeugung - Google Patents
Vorrichtung und Verfahren zur PlasmaerzeugungInfo
- Publication number
- DE69327069T2 DE69327069T2 DE69327069T DE69327069T DE69327069T2 DE 69327069 T2 DE69327069 T2 DE 69327069T2 DE 69327069 T DE69327069 T DE 69327069T DE 69327069 T DE69327069 T DE 69327069T DE 69327069 T2 DE69327069 T2 DE 69327069T2
- Authority
- DE
- Germany
- Prior art keywords
- generating plasma
- plasma
- generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
- H01J2237/0044—Neutralising arrangements of objects being observed or treated
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9805692 | 1992-04-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69327069D1 DE69327069D1 (de) | 1999-12-30 |
DE69327069T2 true DE69327069T2 (de) | 2000-04-06 |
Family
ID=14209632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69327069T Expired - Lifetime DE69327069T2 (de) | 1992-04-17 | 1993-04-16 | Vorrichtung und Verfahren zur Plasmaerzeugung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5449977A (de) |
EP (1) | EP0566143B1 (de) |
KR (1) | KR0127663B1 (de) |
DE (1) | DE69327069T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5674321A (en) * | 1995-04-28 | 1997-10-07 | Applied Materials, Inc. | Method and apparatus for producing plasma uniformity in a magnetic field-enhanced plasma reactor |
US6095084A (en) * | 1996-02-02 | 2000-08-01 | Applied Materials, Inc. | High density plasma process chamber |
US6113731A (en) * | 1997-01-02 | 2000-09-05 | Applied Materials, Inc. | Magnetically-enhanced plasma chamber with non-uniform magnetic field |
SE511139C2 (sv) * | 1997-11-20 | 1999-08-09 | Hana Barankova | Plasmabearbetningsapparat med vridbara magneter |
US6355183B1 (en) * | 1998-09-04 | 2002-03-12 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for plasma etching |
US6579421B1 (en) | 1999-01-07 | 2003-06-17 | Applied Materials, Inc. | Transverse magnetic field for ionized sputter deposition |
US6478924B1 (en) | 2000-03-07 | 2002-11-12 | Applied Materials, Inc. | Plasma chamber support having dual electrodes |
US8048806B2 (en) | 2000-03-17 | 2011-11-01 | Applied Materials, Inc. | Methods to avoid unstable plasma states during a process transition |
US8617351B2 (en) | 2002-07-09 | 2013-12-31 | Applied Materials, Inc. | Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction |
US7374636B2 (en) * | 2001-07-06 | 2008-05-20 | Applied Materials, Inc. | Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor |
JP4009087B2 (ja) | 2001-07-06 | 2007-11-14 | アプライド マテリアルズ インコーポレイテッド | 半導体製造装置における磁気発生装置、半導体製造装置および磁場強度制御方法 |
CA2359597C (en) * | 2001-10-23 | 2003-10-21 | Roland Kenny | Beverage can holder |
US6962644B2 (en) | 2002-03-18 | 2005-11-08 | Applied Materials, Inc. | Tandem etch chamber plasma processing system |
US20030230385A1 (en) * | 2002-06-13 | 2003-12-18 | Applied Materials, Inc. | Electro-magnetic configuration for uniformity enhancement in a dual chamber plasma processing system |
TWI283899B (en) | 2002-07-09 | 2007-07-11 | Applied Materials Inc | Capacitively coupled plasma reactor with magnetic plasma control |
US7458335B1 (en) | 2002-10-10 | 2008-12-02 | Applied Materials, Inc. | Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils |
US7059268B2 (en) * | 2002-12-20 | 2006-06-13 | Tokyo Electron Limited | Method, apparatus and magnet assembly for enhancing and localizing a capacitively coupled plasma |
US7422654B2 (en) * | 2003-02-14 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
US20050181052A1 (en) * | 2004-02-17 | 2005-08-18 | Patel Satishkumar A. | Lansoprazole microtablets |
US8253057B1 (en) | 2004-09-03 | 2012-08-28 | Jack Hunt | System and method for plasma generation |
JP5367522B2 (ja) * | 2009-09-24 | 2013-12-11 | 東京エレクトロン株式会社 | プラズマ処理装置及びシャワーヘッド |
US8773020B2 (en) | 2010-10-22 | 2014-07-08 | Applied Materials, Inc. | Apparatus for forming a magnetic field and methods of use thereof |
US9269546B2 (en) | 2010-10-22 | 2016-02-23 | Applied Materials, Inc. | Plasma reactor with electron beam plasma source having a uniform magnetic field |
CN108575042B (zh) * | 2017-03-09 | 2021-04-09 | 北京北方华创微电子装备有限公司 | 一种线圈、介质筒和等离子体腔室 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4657619A (en) * | 1985-11-29 | 1987-04-14 | Donnell Kevin P O | Diverter magnet arrangement for plasma processing system |
JPS6393881A (ja) * | 1986-10-08 | 1988-04-25 | Anelva Corp | プラズマ処理装置 |
US5032202A (en) * | 1989-10-03 | 1991-07-16 | Martin Marietta Energy Systems, Inc. | Plasma generating apparatus for large area plasma processing |
US5081398A (en) * | 1989-10-20 | 1992-01-14 | Board Of Trustees Operating Michigan State University | Resonant radio frequency wave coupler apparatus using higher modes |
US5079481A (en) * | 1990-08-02 | 1992-01-07 | Texas Instruments Incorporated | Plasma-assisted processing magneton with magnetic field adjustment |
US5376211A (en) * | 1990-09-29 | 1994-12-27 | Tokyo Electron Limited | Magnetron plasma processing apparatus and processing method |
-
1993
- 1993-04-16 DE DE69327069T patent/DE69327069T2/de not_active Expired - Lifetime
- 1993-04-16 EP EP93106240A patent/EP0566143B1/de not_active Expired - Lifetime
- 1993-04-16 KR KR1019930006391A patent/KR0127663B1/ko not_active IP Right Cessation
-
1994
- 1994-10-20 US US08/326,360 patent/US5449977A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR0127663B1 (ko) | 1998-04-01 |
DE69327069D1 (de) | 1999-12-30 |
US5449977A (en) | 1995-09-12 |
KR930022492A (ko) | 1993-11-24 |
EP0566143A1 (de) | 1993-10-20 |
EP0566143B1 (de) | 1999-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: TOKYO ELECTRON LTD., TOKIO/TOKYO, JP |