DE69312421T2 - Installierungsstruktur für Bauteile und Verfahren zur Herstellung einer Installierungsstruktur für Bauteile - Google Patents

Installierungsstruktur für Bauteile und Verfahren zur Herstellung einer Installierungsstruktur für Bauteile

Info

Publication number
DE69312421T2
DE69312421T2 DE69312421T DE69312421T DE69312421T2 DE 69312421 T2 DE69312421 T2 DE 69312421T2 DE 69312421 T DE69312421 T DE 69312421T DE 69312421 T DE69312421 T DE 69312421T DE 69312421 T2 DE69312421 T2 DE 69312421T2
Authority
DE
Germany
Prior art keywords
components
installation structure
producing
installation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69312421T
Other languages
English (en)
Other versions
DE69312421D1 (de
Inventor
Naohiro Shiota
Rikuro Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minebea Co Ltd
Original Assignee
Minebea Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minebea Co Ltd filed Critical Minebea Co Ltd
Application granted granted Critical
Publication of DE69312421D1 publication Critical patent/DE69312421D1/de
Publication of DE69312421T2 publication Critical patent/DE69312421T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Push-Button Switches (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture Of Switches (AREA)
DE69312421T 1992-08-17 1993-08-17 Installierungsstruktur für Bauteile und Verfahren zur Herstellung einer Installierungsstruktur für Bauteile Expired - Fee Related DE69312421T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4240034A JPH0669636A (ja) 1992-08-17 1992-08-17 部品装着構造と部品装着方法

Publications (2)

Publication Number Publication Date
DE69312421D1 DE69312421D1 (de) 1997-08-28
DE69312421T2 true DE69312421T2 (de) 1997-11-06

Family

ID=17053488

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69312421T Expired - Fee Related DE69312421T2 (de) 1992-08-17 1993-08-17 Installierungsstruktur für Bauteile und Verfahren zur Herstellung einer Installierungsstruktur für Bauteile

Country Status (4)

Country Link
US (1) US6144558A (de)
EP (1) EP0593155B1 (de)
JP (1) JPH0669636A (de)
DE (1) DE69312421T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013201926A1 (de) 2013-02-06 2014-08-07 Robert Bosch Gmbh Verfahren zum elektrischen Kontaktieren eines Bauteils und Bauteilverbund

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5820716A (en) * 1993-11-05 1998-10-13 Micron Technology, Inc. Method for surface mounting electrical components to a substrate
IT1283673B1 (it) * 1996-08-02 1998-04-23 Italtel Spa Processo di montaggio superficiale di componenti per oscillatori su circuiti stampati, utilizzante resina epossidica conduttiva
US6535393B2 (en) * 1998-12-04 2003-03-18 Micron Technology, Inc. Electrical device allowing for increased device densities
JP3209977B2 (ja) * 1999-04-02 2001-09-17 沖電気工業株式会社 半導体モジュ−ル
US6651319B2 (en) 2001-09-07 2003-11-25 Visteon Global Technologies, Inc. Compliant standoff for low pressure sensing device
DE10145468C1 (de) * 2001-09-14 2003-01-16 Infineon Technologies Ag Verfahren und Vorrichtung zum Befestigen von Halbleitereinrichtungen auf einer Schalteinrichtung
TWI243462B (en) * 2004-05-14 2005-11-11 Advanced Semiconductor Eng Semiconductor package including passive component
WO2017103344A1 (en) * 2015-12-18 2017-06-22 Teknologian Tutkimuskeskus Vtt Oy Electronics substrate and method for manufacturing an electronics substrate
JP6570728B2 (ja) * 2016-02-18 2019-09-04 三菱電機株式会社 電子装置およびその製造方法
US10388464B2 (en) * 2016-09-19 2019-08-20 Biotronik Se & Co. Kg Method for manufacturing a leadless solid electrolyte capacitor and corresponding capacitor

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4085433A (en) * 1976-11-22 1978-04-18 Baranowski Conrad J Method and apparatus for improving packaging density of discrete electronic components
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
JPS55156482U (de) * 1979-04-26 1980-11-11
US4635354A (en) * 1982-07-22 1987-01-13 Texas Instruments Incorporated Low cost electronic apparatus construction method
JPS59191761U (ja) * 1983-06-07 1984-12-19 日本電気株式会社 プリント板
EP0218022B1 (de) * 1985-08-14 1992-07-29 OMRON Corporation Montagestruktur für einen oberflächenmontierten Bauelementtyp und Verfahren zum Montieren dieses Bauelementtyps auf einer Leiterplatte
US4716500A (en) * 1985-10-18 1987-12-29 Tektronix, Inc. Probe cable assembly
US4868637A (en) * 1985-11-26 1989-09-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
US4774634A (en) * 1986-01-21 1988-09-27 Key Tronic Corporation Printed circuit board assembly
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
US4818823A (en) * 1987-07-06 1989-04-04 Micro-Circuits, Inc. Adhesive component means for attaching electrical components to conductors
GB8727926D0 (en) * 1987-11-28 1987-12-31 British Aerospace Surface mounting leadless components on conductor pattern supporting substrates
US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
US5574629A (en) * 1989-06-09 1996-11-12 Sullivan; Kenneth W. Solderless printed wiring devices
JPH0774328B2 (ja) * 1989-09-05 1995-08-09 千住金属工業株式会社 電子部品の仮固定用粘着剤
US5042971A (en) * 1990-04-16 1991-08-27 Ambrose Stephen D Method of manufacturing an electrical circuit system and electrical circuit system
US5155904A (en) * 1991-04-03 1992-10-20 Compaq Computer Corporation Reflow and wave soldering techniques for bottom side components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013201926A1 (de) 2013-02-06 2014-08-07 Robert Bosch Gmbh Verfahren zum elektrischen Kontaktieren eines Bauteils und Bauteilverbund

Also Published As

Publication number Publication date
EP0593155A1 (de) 1994-04-20
US6144558A (en) 2000-11-07
DE69312421D1 (de) 1997-08-28
EP0593155B1 (de) 1997-07-23
JPH0669636A (ja) 1994-03-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PATENTANWAELTE KNOBLAUCH UND KNOBLAUCH, 60322 FRANK

8339 Ceased/non-payment of the annual fee