DE69308497D1 - Schutzvorrichtung für Telekommunikationsanlagen - Google Patents

Schutzvorrichtung für Telekommunikationsanlagen

Info

Publication number
DE69308497D1
DE69308497D1 DE69308497T DE69308497T DE69308497D1 DE 69308497 D1 DE69308497 D1 DE 69308497D1 DE 69308497 T DE69308497 T DE 69308497T DE 69308497 T DE69308497 T DE 69308497T DE 69308497 D1 DE69308497 D1 DE 69308497D1
Authority
DE
Germany
Prior art keywords
protection device
telecommunications systems
telecommunications
systems
protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69308497T
Other languages
English (en)
Other versions
DE69308497T2 (de
Inventor
Pravin N Popat
Gennady Baskin
Gary L Tonnies
Diethard Unterweger
Ronald J Candelet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69308497D1 publication Critical patent/DE69308497D1/de
Application granted granted Critical
Publication of DE69308497T2 publication Critical patent/DE69308497T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00—Overvoltage arresters using spark gaps
    • H01T4/08—Overvoltage arresters using spark gaps structurally associated with protected apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37155—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/3754—Coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Protection Of Static Devices (AREA)
DE69308497T 1992-12-07 1993-12-03 Schutzvorrichtung für Telekommunikationsanlagen Expired - Fee Related DE69308497T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/987,038 US5327318A (en) 1992-12-07 1992-12-07 Telecommunication equipment protector

Publications (2)

Publication Number Publication Date
DE69308497D1 true DE69308497D1 (de) 1997-04-10
DE69308497T2 DE69308497T2 (de) 1997-06-12

Family

ID=25533005

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69308497T Expired - Fee Related DE69308497T2 (de) 1992-12-07 1993-12-03 Schutzvorrichtung für Telekommunikationsanlagen

Country Status (4)

Country Link
US (2) US5327318A (de)
EP (1) EP0601809B1 (de)
JP (1) JPH06261448A (de)
DE (1) DE69308497T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5506174A (en) * 1994-07-12 1996-04-09 General Instrument Corp. Automated assembly of semiconductor devices using a pair of lead frames
US5721773A (en) * 1995-03-30 1998-02-24 Lucent-Technologies Inc. Lightning protected maintenance termaination unit
JP2781783B2 (ja) * 1996-07-30 1998-07-30 山形日本電気株式会社 半導体装置用パッケージ
US5955960A (en) * 1997-03-24 1999-09-21 Jean-Luc Monnier Tamper resistant electronic lock and method of using same
US6104591A (en) * 1998-03-09 2000-08-15 Teccor Electronics, Inc. Telephone line protection element
US6084761A (en) 1998-03-09 2000-07-04 Teccor Electronics, Lp Telephone line surge protector
US6980647B1 (en) 1999-01-12 2005-12-27 Teccor Electronics, Lp Primary telephone line protector with failsafe
US6385030B1 (en) 1999-09-02 2002-05-07 Marconi Communications, Inc. Reduced signal loss surge protection circuit
TWM313372U (en) * 2006-11-01 2007-06-01 Polytronics Technology Corp Over-current and over-voltage protection assembly apparatus
US8179655B2 (en) 2008-03-28 2012-05-15 Pulse Electronics, Inc. Surge protection apparatus and methods
US9041188B2 (en) * 2012-11-10 2015-05-26 Vishay General Semiconductor Llc Axial semiconductor package
JP6330689B2 (ja) * 2015-02-19 2018-05-30 株式会社オートネットワーク技術研究所 電気接点対およびコネクタ用端子対

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3975664A (en) * 1975-07-28 1976-08-17 Reliable Electric Company Line protector for communication circuit
US4631805A (en) * 1981-03-23 1986-12-30 Motorola Inc. Semiconductor device including plateless package fabrication method
US4774558A (en) * 1984-03-05 1988-09-27 Hughes Aircraft Company Thermally-activated, shorting diode switch having non-operationally-alterable junction path
JPS61150617A (ja) * 1984-12-24 1986-07-09 日本電信電話株式会社 サ−ジ防護回路
GB8713440D0 (en) * 1987-06-09 1987-07-15 Texas Instruments Ltd Semiconductor device
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
JPH03263363A (ja) * 1990-02-23 1991-11-22 Fuji Electric Co Ltd 半導体装置
US5150271A (en) * 1990-08-21 1992-09-22 Texas Instruments Incorporated Telecommunication equipment protector
US5130882A (en) * 1991-04-12 1992-07-14 The United States Of America As Represented By The Secretary Of The Air Force Multilayer circuit board transient protection device
US5224008A (en) * 1991-06-25 1993-06-29 Texas Instruments Incorporated Surge protection device and system

Also Published As

Publication number Publication date
US5327318A (en) 1994-07-05
EP0601809A1 (de) 1994-06-15
US5334553A (en) 1994-08-02
JPH06261448A (ja) 1994-09-16
EP0601809B1 (de) 1997-03-05
DE69308497T2 (de) 1997-06-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee