DE69224314T2 - Integrierte Wärmesenke für Halbleitermodule - Google Patents

Integrierte Wärmesenke für Halbleitermodule

Info

Publication number
DE69224314T2
DE69224314T2 DE69224314T DE69224314T DE69224314T2 DE 69224314 T2 DE69224314 T2 DE 69224314T2 DE 69224314 T DE69224314 T DE 69224314T DE 69224314 T DE69224314 T DE 69224314T DE 69224314 T2 DE69224314 T2 DE 69224314T2
Authority
DE
Germany
Prior art keywords
heat sink
semiconductor modules
integrated heat
integrated
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69224314T
Other languages
English (en)
Other versions
DE69224314D1 (de
Inventor
James Francis Burgess
Rik Wivina Anna Adels Dedonker
Constantine Alois Neugebauer
Donald Wayne Jones
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Application granted granted Critical
Publication of DE69224314D1 publication Critical patent/DE69224314D1/de
Publication of DE69224314T2 publication Critical patent/DE69224314T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69224314T 1991-04-08 1992-04-07 Integrierte Wärmesenke für Halbleitermodule Expired - Fee Related DE69224314T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68184591A 1991-04-08 1991-04-08

Publications (2)

Publication Number Publication Date
DE69224314D1 DE69224314D1 (de) 1998-03-12
DE69224314T2 true DE69224314T2 (de) 1998-09-10

Family

ID=24737084

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69224314T Expired - Fee Related DE69224314T2 (de) 1991-04-08 1992-04-07 Integrierte Wärmesenke für Halbleitermodule

Country Status (4)

Country Link
US (1) US5293070A (de)
EP (1) EP0508717B1 (de)
JP (1) JP3254001B2 (de)
DE (1) DE69224314T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024056772A1 (de) 2022-09-16 2024-03-21 Robert Bosch Gmbh Wärmetauscher zur kühlung von komponenten

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GB9303940D0 (en) * 1993-02-26 1993-04-14 Gec Alsthom Ltd Heat sink
AU687541B2 (en) * 1994-06-21 1998-02-26 Kitashiba Electric Co., Ltd. Induction heater apparatus
DE19506093C2 (de) * 1995-02-22 2000-12-07 Dilas Diodenlaser Gmbh Diodenlaserbauelement
US5892279A (en) * 1995-12-11 1999-04-06 Northrop Grumman Corporation Packaging for electronic power devices and applications using the packaging
DE19605302A1 (de) * 1996-02-14 1997-08-21 Fraunhofer Ges Forschung Kühlkörper mit einer Montagefläche für ein elektronisches Bauteil
US5801442A (en) * 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
EP0948430A4 (de) * 1996-10-25 2003-04-16 Yuzhi Qu Supraleitendes wärmeübertragungsmedium
JP3816194B2 (ja) 1996-11-22 2006-08-30 ファナック株式会社 冷却装置、光源装置、面発光装置、およびその製造方法
DE19900603A1 (de) 1999-01-11 2000-07-13 Bosch Gmbh Robert Elektronisches Halbleitermodul
US6230791B1 (en) 1999-08-30 2001-05-15 Electric Boat Corporation Heat transfer cold plate arrangement
JP4009056B2 (ja) * 2000-05-25 2007-11-14 三菱電機株式会社 パワーモジュール
DE10056172A1 (de) * 2000-11-13 2002-06-27 Vodafone Pilotentwicklung Gmbh Elektrisches Bauteil
EP1227353B1 (de) * 2001-01-16 2005-05-04 Curamik Electronics GmbH Spiegel für Laseranwendungen sowie Verfahren zu seiner Herstellung
US6434003B1 (en) * 2001-04-24 2002-08-13 York International Corporation Liquid-cooled power semiconductor device heatsink
US6965514B2 (en) * 2002-01-16 2005-11-15 Rockwell Automation Technologies, Inc. Fluid cooled vehicle drive module
US6898072B2 (en) * 2002-01-16 2005-05-24 Rockwell Automation Technologies, Inc. Cooled electrical terminal assembly and device incorporating same
US7142434B2 (en) * 2002-01-16 2006-11-28 Rockwell Automation Technologies, Inc. Vehicle drive module having improved EMI shielding
US7187568B2 (en) 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved terminal structure
US7177153B2 (en) 2002-01-16 2007-02-13 Rockwell Automation Technologies, Inc. Vehicle drive module having improved cooling configuration
US7061775B2 (en) * 2002-01-16 2006-06-13 Rockwell Automation Technologies, Inc. Power converter having improved EMI shielding
US6972957B2 (en) * 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US7032695B2 (en) * 2002-01-16 2006-04-25 Rockwell Automation Technologies, Inc. Vehicle drive module having improved terminal design
US7187548B2 (en) * 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved fluid cooling
US7723208B2 (en) * 2003-09-24 2010-05-25 Intel Corporation Integrated re-combiner for electroosmotic pumps using porous frits
US7304418B2 (en) * 2003-10-24 2007-12-04 Seiko Epson Corporation Light source apparatus with light-emitting chip which generates light and heat
DE102004012026B3 (de) * 2004-03-11 2005-11-17 Hüttinger Elektronik GmbH & Co. KG Anordnung zum Kühlen
US7307475B2 (en) 2004-05-28 2007-12-11 Ixys Corporation RF generator with voltage regulator
WO2005125296A1 (en) * 2004-06-15 2005-12-29 Tm4 Inc. Cooling device for electric circuit
ITMI20041652A1 (it) * 2004-08-13 2004-11-13 Bosari Thermal Man S R L Scambiatore di calore e metodo per produrlo
DE102004057497B4 (de) * 2004-11-29 2012-01-12 Siemens Ag Wärmeaustauschvorrichtung und Verfahren zum Herstellen der Wärmeaustauschvorrichtung sowie Anordnung eines Bauelements und der Wärmeaustauschvorrichtung und Verfahren zum Herstellen der Anordnung
US7492595B2 (en) * 2005-03-31 2009-02-17 Tecnisco Limited Semiconductor cooling device and stack of semiconductor cooling devices
US7755185B2 (en) 2006-09-29 2010-07-13 Infineon Technologies Ag Arrangement for cooling a power semiconductor module
WO2008055515A1 (en) 2006-11-06 2008-05-15 Siemens Aktiengesellschaft Variable speed drive for subsea applications
US8014110B2 (en) * 2007-01-22 2011-09-06 Johnson Controls Technology Company Variable speed drive with integral bypass contactor
US8495890B2 (en) * 2007-01-22 2013-07-30 Johnson Controls Technology Company Cooling member
US8149579B2 (en) * 2008-03-28 2012-04-03 Johnson Controls Technology Company Cooling member
JP5120604B2 (ja) * 2007-05-22 2013-01-16 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
JP4216319B2 (ja) * 2007-06-19 2009-01-28 ファナック株式会社 インバータ筐体の冷却構造
US7957166B2 (en) * 2007-10-30 2011-06-07 Johnson Controls Technology Company Variable speed drive
US7764494B2 (en) * 2007-11-20 2010-07-27 Basic Electronics, Inc. Liquid cooled module
US8991478B2 (en) * 2010-03-29 2015-03-31 Hamilton Sundstrand Space Systems International, Inc. Compact two sided cold plate with transfer tubes
US8872328B2 (en) * 2012-12-19 2014-10-28 General Electric Company Integrated power module package
KR101646375B1 (ko) * 2014-11-05 2016-08-12 현대자동차주식회사 차량용 인덕터장치
JP2023166635A (ja) * 2020-10-01 2023-11-22 京セラドキュメントソリューションズ株式会社 流体冷却式コールドプレート及び流体冷却式コールドプレートの製造方法
US11910578B2 (en) * 2021-09-23 2024-02-20 Contitech Techno-Chemie Gmbh Vehicle electronics cooling systems and methods

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US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
US3911553A (en) * 1974-03-04 1975-10-14 Gen Electric Method for bonding metal to ceramic
US4025997A (en) * 1975-12-23 1977-05-31 International Telephone & Telegraph Corporation Ceramic mounting and heat sink device
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
US4551787A (en) * 1983-02-07 1985-11-05 Sperry Corporation Apparatus for use in cooling integrated circuit chips
DE3402003A1 (de) * 1984-01-21 1985-07-25 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
US4563383A (en) * 1984-03-30 1986-01-07 General Electric Company Direct bond copper ceramic substrate for electronic applications
FR2579060B1 (fr) * 1985-03-18 1987-04-17 Socapex Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte
DE3805851A1 (de) * 1988-02-25 1989-08-31 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
DE4010193C3 (de) * 1990-03-30 1998-03-26 Rheinmetall Ind Ag Leiterkarte für eine Leistungs-Elektronikschaltung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024056772A1 (de) 2022-09-16 2024-03-21 Robert Bosch Gmbh Wärmetauscher zur kühlung von komponenten
DE102022209786A1 (de) 2022-09-16 2024-03-21 Robert Bosch Gesellschaft mit beschränkter Haftung Wärmetauscher zur Kühlung von Komponenten

Also Published As

Publication number Publication date
JP3254001B2 (ja) 2002-02-04
DE69224314D1 (de) 1998-03-12
EP0508717A1 (de) 1992-10-14
US5293070A (en) 1994-03-08
JPH05102362A (ja) 1993-04-23
EP0508717B1 (de) 1998-02-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee