DE69222611D1 - Lot für oxidschichtbildendes metall und legierungen - Google Patents

Lot für oxidschichtbildendes metall und legierungen

Info

Publication number
DE69222611D1
DE69222611D1 DE69222611T DE69222611T DE69222611D1 DE 69222611 D1 DE69222611 D1 DE 69222611D1 DE 69222611 T DE69222611 T DE 69222611T DE 69222611 T DE69222611 T DE 69222611T DE 69222611 D1 DE69222611 D1 DE 69222611D1
Authority
DE
Germany
Prior art keywords
solder
alloys
layering metal
oxide
oxide layering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69222611T
Other languages
English (en)
Other versions
DE69222611T2 (de
Inventor
James Kronberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Department of Energy
Original Assignee
US Department of Energy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by US Department of Energy filed Critical US Department of Energy
Application granted granted Critical
Publication of DE69222611D1 publication Critical patent/DE69222611D1/de
Publication of DE69222611T2 publication Critical patent/DE69222611T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/32Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/327Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C comprising refractory compounds, e.g. carbides

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
DE69222611T 1991-04-08 1992-04-08 Lot für oxidschichtbildendes metall und legierungen Expired - Fee Related DE69222611T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/681,290 US5147471A (en) 1991-04-08 1991-04-08 Solder for oxide layer-building metals and alloys
PCT/US1992/002660 WO1992017617A1 (en) 1991-04-08 1992-04-08 Solder for oxide layer-building metals and alloys

Publications (2)

Publication Number Publication Date
DE69222611D1 true DE69222611D1 (de) 1997-11-13
DE69222611T2 DE69222611T2 (de) 1998-04-23

Family

ID=24734641

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69222611T Expired - Fee Related DE69222611T2 (de) 1991-04-08 1992-04-08 Lot für oxidschichtbildendes metall und legierungen

Country Status (5)

Country Link
US (1) US5147471A (de)
EP (1) EP0538446B1 (de)
JP (1) JPH05508113A (de)
DE (1) DE69222611T2 (de)
WO (1) WO1992017617A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4316175A1 (de) * 1993-05-14 1994-11-17 Daimler Benz Ag Lötverbindung und Lötverfahren
JP3223678B2 (ja) * 1993-12-24 2001-10-29 三菱電機株式会社 はんだ付け用フラックスおよびクリームはんだ
US5834374A (en) * 1994-09-30 1998-11-10 International Business Machines Corporation Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
JP3226213B2 (ja) * 1996-10-17 2001-11-05 松下電器産業株式会社 半田材料及びそれを用いた電子部品
EP0856376B1 (de) * 1996-12-03 2000-02-09 Lucent Technologies Inc. Gegenstand mit dispergierten Teilchen enthaltendes feinkörniges Weichlot
JP3601278B2 (ja) * 1996-12-17 2004-12-15 ソニー株式会社 はんだ材料
US6649127B2 (en) 1996-12-17 2003-11-18 Sony Chemicals Corp Lead-free solder material having good wettability
JP3311282B2 (ja) * 1997-10-13 2002-08-05 株式会社東芝 金属部材の接合方法及び接合体
DE19859735B4 (de) * 1998-12-23 2006-04-27 Erbslöh Ag Verfahren zur partiellen oder vollständigen Beschichtung der Oberflächen von Bauteilen aus Aluminium und seinen Legierungen mit Lot, Fluß- und Bindemittel zur Hartverlötung
CA2370770A1 (en) 1999-04-16 2000-10-26 Edison Welding Institute Soldering alloy
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
US6840434B2 (en) * 2002-04-09 2005-01-11 Ford Motor Company Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same
WO2009013210A1 (en) * 2007-07-23 2009-01-29 Henkel Limited Solder flux
WO2009028147A1 (ja) * 2007-08-24 2009-03-05 Kabushiki Kaisha Toshiba 接合用組成物
CN101245427B (zh) * 2008-03-26 2010-06-16 戴国水 一种添加合金元素的无铅喷金料
FI121814B (fi) * 2008-07-02 2011-04-29 Valvas Oy Menetelmä kannatustangon sähkövirran ottajan aikaansaamiseksi ja kannatustanko
FI121813B (fi) * 2009-06-25 2011-04-29 Valvas Oy Menetelmä elektrolyysissa käytettävän virtakiskon aikaansaamiseksi ja virtakisko
DE102010000520A1 (de) 2010-02-23 2011-08-25 SCHOTT Solar AG, 55122 Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück
DE102014116288A1 (de) * 2014-11-07 2016-05-12 Danfoss Silicon Power Gmbh Sinterpaste und Verfahren zum Bonden von Verbindungspartnern
TWI677889B (zh) * 2018-07-03 2019-11-21 易湘雲 鉍基合金作為開關或插座斷電元件的方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2733168A (en) * 1956-01-31 Tin-zinc base alloys
US863058A (en) * 1904-01-12 1907-08-13 Nathaniel L Foster Solder for aluminium.
US1239785A (en) * 1916-05-01 1917-09-11 George Gardiner Soldering compound.
US1619852A (en) * 1924-07-21 1927-03-08 Conti Emile Solder for aluminum and its alloys
US2004372A (en) * 1931-03-31 1935-06-11 Kuppers Metallwerke G M B H Solder for aluminium and its alloys
US2252414A (en) * 1939-12-29 1941-08-12 Aluminum Co Of America Solder
US2505633A (en) * 1946-03-18 1950-04-25 Purdue Research Foundation Alloys of germanium and method of making same
GB671079A (en) * 1949-11-16 1952-04-30 Richard Chadwick Improvements in or relating to solders
US2766152A (en) * 1951-11-16 1956-10-09 Sylvania Electric Prod Method of producing germanium crystals
US2864733A (en) * 1955-06-28 1958-12-16 Frederick J Kranich Zinc-tin solder for aluminum
US3087813A (en) * 1960-01-30 1963-04-30 Acas Internat Ltd Non-corrosion solder for light metal alloys
US3146097A (en) * 1962-04-23 1964-08-25 Nat Res Corp Tin base alloys
US3457067A (en) * 1966-12-02 1969-07-22 Nat Res Corp Tin base alloys
SU241950A1 (ru) * 1968-02-09 1969-04-18 И. А. Бойко, Н. В. Кургузов, И. К. Скл ров и А. И. Голубев
DD109094A1 (de) * 1973-08-22 1974-10-12
US3925110A (en) * 1974-04-25 1975-12-09 Western Electric Co Superplastic alloy of tin and zinc
US4386051A (en) * 1980-09-19 1983-05-31 Edgington Robert E Tin, lead, zinc alloy
US4670217A (en) * 1985-07-26 1987-06-02 J. W. Harris Company Solder composition
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition

Also Published As

Publication number Publication date
WO1992017617A1 (en) 1992-10-15
DE69222611T2 (de) 1998-04-23
EP0538446A1 (de) 1993-04-28
EP0538446A4 (en) 1993-08-25
EP0538446B1 (de) 1997-10-08
JPH05508113A (ja) 1993-11-18
US5147471A (en) 1992-09-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee