DE69202080T2 - Thin sheets of a copper-based alloy, which cause low wear of the punching tool during processing, and their use for electrical and electronic components. - Google Patents
Thin sheets of a copper-based alloy, which cause low wear of the punching tool during processing, and their use for electrical and electronic components.Info
- Publication number
- DE69202080T2 DE69202080T2 DE1992602080 DE69202080T DE69202080T2 DE 69202080 T2 DE69202080 T2 DE 69202080T2 DE 1992602080 DE1992602080 DE 1992602080 DE 69202080 T DE69202080 T DE 69202080T DE 69202080 T2 DE69202080 T2 DE 69202080T2
- Authority
- DE
- Germany
- Prior art keywords
- copper
- electrical
- electronic components
- during processing
- based alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3059620A JP2503793B2 (en) | 1991-03-01 | 1991-03-01 | Cu alloy plate material for electric and electronic parts, which has the effect of suppressing the wear of punching dies |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69202080D1 DE69202080D1 (en) | 1995-05-24 |
DE69202080T2 true DE69202080T2 (en) | 1995-09-14 |
Family
ID=13118472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1992602080 Expired - Lifetime DE69202080T2 (en) | 1991-03-01 | 1992-02-26 | Thin sheets of a copper-based alloy, which cause low wear of the punching tool during processing, and their use for electrical and electronic components. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0501438B1 (en) |
JP (1) | JP2503793B2 (en) |
DE (1) | DE69202080T2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5633094A (en) * | 1994-10-28 | 1997-05-27 | Hitachi, Ltd. | Valve having facing layers of co-free Ni-base Alloy |
JP3739214B2 (en) * | 1998-03-26 | 2006-01-25 | 株式会社神戸製鋼所 | Copper alloy sheet for electronic parts |
JP3520034B2 (en) | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | Copper alloy materials for electronic and electrical equipment parts |
US7090732B2 (en) | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
JP3520046B2 (en) | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | High strength copper alloy |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5834536B2 (en) * | 1980-06-06 | 1983-07-27 | 日本鉱業株式会社 | Copper alloy for lead material of semiconductor equipment |
US4656003A (en) * | 1984-10-20 | 1987-04-07 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy and production of the same |
JPH066725B2 (en) * | 1985-12-05 | 1994-01-26 | 本田技研工業株式会社 | Method for producing sintered copper alloy having self-lubricating property |
JPH01272733A (en) * | 1988-04-25 | 1989-10-31 | Mitsubishi Shindoh Co Ltd | Lead frame material made of cu alloy for semiconductor device |
JPH0266130A (en) * | 1988-08-29 | 1990-03-06 | Mitsubishi Shindoh Co Ltd | Cu alloy for terminal and connector having less wear or blanking die |
JPH0776397B2 (en) * | 1989-07-25 | 1995-08-16 | 三菱伸銅株式会社 | Cu alloy electrical equipment connector |
-
1991
- 1991-03-01 JP JP3059620A patent/JP2503793B2/en not_active Expired - Lifetime
-
1992
- 1992-02-26 DE DE1992602080 patent/DE69202080T2/en not_active Expired - Lifetime
- 1992-02-26 EP EP19920103249 patent/EP0501438B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2503793B2 (en) | 1996-06-05 |
EP0501438B1 (en) | 1995-04-19 |
JPH04276036A (en) | 1992-10-01 |
EP0501438A1 (en) | 1992-09-02 |
DE69202080D1 (en) | 1995-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |