DE69119793T2 - Gehäuse für Hochfrequenzschaltung - Google Patents

Gehäuse für Hochfrequenzschaltung

Info

Publication number
DE69119793T2
DE69119793T2 DE69119793T DE69119793T DE69119793T2 DE 69119793 T2 DE69119793 T2 DE 69119793T2 DE 69119793 T DE69119793 T DE 69119793T DE 69119793 T DE69119793 T DE 69119793T DE 69119793 T2 DE69119793 T2 DE 69119793T2
Authority
DE
Germany
Prior art keywords
housing
frequency switching
switching
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69119793T
Other languages
English (en)
Other versions
DE69119793D1 (de
Inventor
Katsuyuki Oshiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE69119793D1 publication Critical patent/DE69119793D1/de
Application granted granted Critical
Publication of DE69119793T2 publication Critical patent/DE69119793T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Waveguides (AREA)
DE69119793T 1990-01-17 1991-01-02 Gehäuse für Hochfrequenzschaltung Expired - Fee Related DE69119793T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007978A JPH03212006A (ja) 1990-01-17 1990-01-17 高周波回路用パッケージ

Publications (2)

Publication Number Publication Date
DE69119793D1 DE69119793D1 (de) 1996-07-04
DE69119793T2 true DE69119793T2 (de) 1996-10-02

Family

ID=11680540

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69119793T Expired - Fee Related DE69119793T2 (de) 1990-01-17 1991-01-02 Gehäuse für Hochfrequenzschaltung

Country Status (5)

Country Link
US (1) US5239126A (de)
EP (1) EP0438056B1 (de)
JP (1) JPH03212006A (de)
KR (1) KR910015078A (de)
DE (1) DE69119793T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5418685A (en) * 1992-02-21 1995-05-23 Robert Bosch Gmbh Housing for a control device having a printed circuit board with an electrically and thermally conducting lining
US5880403A (en) * 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US5594199A (en) * 1995-03-23 1997-01-14 Ford Motor Company EMI baffle for electronic control
US5814761A (en) * 1995-09-07 1998-09-29 Shakti Audio Innovations Passive EMI dissipation apparatus and method
JPH1174396A (ja) * 1997-08-28 1999-03-16 Kyocera Corp 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ
US6178311B1 (en) 1998-03-02 2001-01-23 Western Multiplex Corporation Method and apparatus for isolating high frequency signals in a printed circuit board
US6534711B1 (en) 1998-04-14 2003-03-18 The Goodyear Tire & Rubber Company Encapsulation package and method of packaging an electronic circuit module
US6412977B1 (en) 1998-04-14 2002-07-02 The Goodyear Tire & Rubber Company Method for measuring temperature with an integrated circuit device
US6543279B1 (en) 1998-04-14 2003-04-08 The Goodyear Tire & Rubber Company Pneumatic tire having transponder and method of measuring pressure within a pneumatic tire
CA2324325A1 (en) * 1998-04-14 1999-10-21 The Goodyear Tire & Rubber Company Encapsulation package and method of packaging an electronic circuit module
DE19822888A1 (de) * 1998-05-22 1999-12-09 Mannesmann Vdo Ag Elektronischer Schaltkreis mit einem hochfrequenzbedämpfenden Schirmgehäuse
US6064286A (en) * 1998-07-31 2000-05-16 The Whitaker Corporation Millimeter wave module with an interconnect from an interior cavity
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US20020179315A1 (en) * 2001-05-29 2002-12-05 Brown Thomas Edward Circuit shell enclosure
US6980439B2 (en) * 2001-12-27 2005-12-27 Intel Corporation EMI shield for transceiver
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU490203A1 (ru) * 1973-03-12 1975-10-30 Предприятие П/Я А-1353 Цоколь герметичного реле
JPS6055083B2 (ja) * 1973-05-29 1985-12-03 ヤンマー農機株式会社 刈取結束機
JPS6189651A (ja) * 1984-10-08 1986-05-07 Fujitsu Ltd 半導体装置
US4658334A (en) * 1986-03-19 1987-04-14 Rca Corporation RF signal shielding enclosure of electronic systems
DK385587A (da) * 1986-08-01 1988-02-02 Siemens Ag Kredsloebsplade til anvendelse inden for kommunikationsteknikken
US4868639A (en) * 1986-08-11 1989-09-19 Fujitsu Limited Semiconductor device having waveguide-coaxial line transformation structure
FR2618629B1 (fr) * 1987-07-23 1993-04-23 Telecommunications Sa Boitier hermetique pour circuit electronique hybride
FR2629271B1 (fr) * 1988-03-25 1991-03-29 Thomson Hybrides Microondes Dispositif d'interconnexion et de protection d'une pastille nue de composant hyperfrequence
US4890199A (en) * 1988-11-04 1989-12-26 Motorola, Inc. Miniature shield with opposing cantilever spring fingers
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus

Also Published As

Publication number Publication date
DE69119793D1 (de) 1996-07-04
KR910015078A (ko) 1991-08-31
EP0438056A2 (de) 1991-07-24
EP0438056B1 (de) 1996-05-29
JPH03212006A (ja) 1991-09-17
US5239126A (en) 1993-08-24
EP0438056A3 (en) 1991-12-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee