DE69106537T2 - Elektrochemische Reparatur bei Hochfrequenz von offenen Stromkreisen. - Google Patents
Elektrochemische Reparatur bei Hochfrequenz von offenen Stromkreisen.Info
- Publication number
- DE69106537T2 DE69106537T2 DE69106537T DE69106537T DE69106537T2 DE 69106537 T2 DE69106537 T2 DE 69106537T2 DE 69106537 T DE69106537 T DE 69106537T DE 69106537 T DE69106537 T DE 69106537T DE 69106537 T2 DE69106537 T2 DE 69106537T2
- Authority
- DE
- Germany
- Prior art keywords
- high frequency
- open circuits
- electrochemical repair
- electrochemical
- repair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/485—Adaptation of interconnections, e.g. engineering charges, repair techniques
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Electrochemistry (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/475,636 US4994154A (en) | 1990-02-06 | 1990-02-06 | High frequency electrochemical repair of open circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69106537D1 DE69106537D1 (de) | 1995-02-23 |
DE69106537T2 true DE69106537T2 (de) | 1995-07-06 |
Family
ID=23888458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69106537T Expired - Fee Related DE69106537T2 (de) | 1990-02-06 | 1991-01-18 | Elektrochemische Reparatur bei Hochfrequenz von offenen Stromkreisen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4994154A (de) |
EP (1) | EP0441143B1 (de) |
JP (1) | JPH0732302B2 (de) |
DE (1) | DE69106537T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5141602A (en) * | 1991-06-18 | 1992-08-25 | International Business Machines Corporation | High-productivity method and apparatus for making customized interconnections |
US5686207A (en) * | 1994-08-08 | 1997-11-11 | Seiko Instruments Inc. | Method of forming and repairing a mask for photolithography |
US6120669A (en) * | 1997-04-16 | 2000-09-19 | Drexel University | Bipolar electrochemical connection of materials |
US6350363B1 (en) | 1997-04-16 | 2002-02-26 | Drexel University | Electric field directed construction of diodes using free-standing three-dimensional components |
DE19724595A1 (de) * | 1997-06-11 | 1998-12-17 | Micronas Semiconductor Holding | Verfahren zum Herstellen einer Halbleiteranordnung mit strukturierter Metallisierung |
US5972723A (en) * | 1997-10-21 | 1999-10-26 | International Business Machines Corporation | Enhanced thin film wiring net repair process |
US5937269A (en) * | 1997-10-29 | 1999-08-10 | International Business Machines Corporation | Graphics assisted manufacturing process for thin-film devices |
US6455331B2 (en) | 1997-10-31 | 2002-09-24 | International Business Machines Corporation | Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
US6048741A (en) * | 1997-10-31 | 2000-04-11 | International Business Machines Corporation | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
US6248599B1 (en) | 1999-10-13 | 2001-06-19 | International Business Machines Corporation | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
US6447663B1 (en) * | 2000-08-01 | 2002-09-10 | Ut-Battelle, Llc | Programmable nanometer-scale electrolytic metal deposition and depletion |
US20030048619A1 (en) * | 2001-06-15 | 2003-03-13 | Kaler Eric W. | Dielectrophoretic assembling of electrically functional microwires |
US7034519B2 (en) * | 2004-01-08 | 2006-04-25 | International Business Machines Corporation | High frequency measurement for current-in-plane-tunneling |
WO2013021847A1 (ja) * | 2011-08-11 | 2013-02-14 | 東京エレクトロン株式会社 | 半導体装置の製造方法、半導体装置及び配線形成用治具 |
CN104011890B (zh) * | 2012-01-30 | 2016-08-24 | 株式会社村田制作所 | 电子部件的制造方法 |
JP6507148B2 (ja) * | 2014-02-21 | 2019-04-24 | 学校法人早稲田大学 | 自己修復型配線及び伸縮デバイス |
US9721856B2 (en) | 2015-06-25 | 2017-08-01 | International Business Machines Corporation | Implementing resistance defect performance mitigation using test signature directed self heating and increased voltage |
CN113207237B (zh) * | 2021-03-15 | 2022-05-17 | 广东工业大学 | 一种纳米金属辅助定向电镀及电解的线路成型与修复方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2955959A (en) * | 1958-09-22 | 1960-10-11 | Rose Arthur H Du | Chemical nickel plating |
US3506545A (en) * | 1967-02-14 | 1970-04-14 | Ibm | Method for plating conductive patterns with high resolution |
US3645855A (en) * | 1970-08-14 | 1972-02-29 | Ibm | Ultrasonic repair plating of microscopic interconnections |
US3833375A (en) * | 1972-03-09 | 1974-09-03 | Rca Corp | Method of repairing an imperfect pattern of metalized portions on a substrate |
US3960674A (en) * | 1974-12-20 | 1976-06-01 | Western Electric Company, Inc. | Method of depositing a metal on a surface comprising an electrically non-conductive ferrite |
US4103043A (en) * | 1976-02-06 | 1978-07-25 | Ing. C. Olivetti & C., S.P.A. | Thermographic printing method |
US4239789A (en) * | 1979-05-08 | 1980-12-16 | International Business Machines Corporation | Maskless method for electroless plating patterns |
US4217183A (en) * | 1979-05-08 | 1980-08-12 | International Business Machines Corporation | Method for locally enhancing electroplating rates |
US4259367A (en) * | 1979-07-30 | 1981-03-31 | International Business Machines Corporation | Fine line repair technique |
GB2067845B (en) * | 1980-01-23 | 1984-04-26 | Int Computers Ltd | Manufacture of printed circuit boards |
US4340617A (en) * | 1980-05-19 | 1982-07-20 | Massachusetts Institute Of Technology | Method and apparatus for depositing a material on a surface |
DE3025875A1 (de) * | 1980-07-08 | 1982-02-04 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zur reparatur von leiterbahnunterbrechungen |
US4349583A (en) * | 1981-07-28 | 1982-09-14 | International Business Machines Corporation | Laser enhanced maskless method for plating and simultaneous plating and etching of patterns |
US4383016A (en) * | 1981-09-25 | 1983-05-10 | Ppg Industries, Inc. | Method for repairing glass photomasks |
US4496900A (en) * | 1982-04-30 | 1985-01-29 | International Business Machines Corporation | Nonlinearity detection using fault-generated second harmonic |
US4615904A (en) * | 1982-06-01 | 1986-10-07 | Massachusetts Institute Of Technology | Maskless growth of patterned films |
US4608117A (en) * | 1982-06-01 | 1986-08-26 | Massachusetts Institute Of Technology | Maskless growth of patterned films |
US4611744A (en) * | 1982-06-23 | 1986-09-16 | Refurbished Turbine Components Ltd. | Turbine blade repair |
US4630355A (en) * | 1985-03-08 | 1986-12-23 | Energy Conversion Devices, Inc. | Electric circuits having repairable circuit lines and method of making the same |
US4704304A (en) * | 1986-10-27 | 1987-11-03 | International Business Machines Corporation | Method for repair of opens in thin film lines on a substrate |
US4919971A (en) * | 1988-09-23 | 1990-04-24 | International Business Machines Corporation | Self-induced repairing of conductor lines |
-
1990
- 1990-02-06 US US07/475,636 patent/US4994154A/en not_active Expired - Lifetime
-
1991
- 1991-01-10 JP JP3012451A patent/JPH0732302B2/ja not_active Expired - Lifetime
- 1991-01-18 EP EP91100549A patent/EP0441143B1/de not_active Expired - Lifetime
- 1991-01-18 DE DE69106537T patent/DE69106537T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0441143A1 (de) | 1991-08-14 |
DE69106537D1 (de) | 1995-02-23 |
JPH0732302B2 (ja) | 1995-04-10 |
JPH04213890A (ja) | 1992-08-04 |
EP0441143B1 (de) | 1995-01-11 |
US4994154A (en) | 1991-02-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |