DE69104131D1 - Drehkathode. - Google Patents

Drehkathode.

Info

Publication number
DE69104131D1
DE69104131D1 DE69104131T DE69104131T DE69104131D1 DE 69104131 D1 DE69104131 D1 DE 69104131D1 DE 69104131 T DE69104131 T DE 69104131T DE 69104131 T DE69104131 T DE 69104131T DE 69104131 D1 DE69104131 D1 DE 69104131D1
Authority
DE
Germany
Prior art keywords
rotary cathode
cathode
rotary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69104131T
Other languages
English (en)
Other versions
DE69104131T2 (de
Inventor
Roland Devigne
Jean-Pierre Beaufays
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Glass France SAS
Saint Gobain Vitrage SA
Original Assignee
Saint Gobain Vitrage SA
Saint Gobain Vitrage International SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Vitrage SA, Saint Gobain Vitrage International SA filed Critical Saint Gobain Vitrage SA
Application granted granted Critical
Publication of DE69104131D1 publication Critical patent/DE69104131D1/de
Publication of DE69104131T2 publication Critical patent/DE69104131T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
DE69104131T 1990-06-08 1991-06-06 Drehkathode. Expired - Fee Related DE69104131T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9000577A BE1003701A3 (fr) 1990-06-08 1990-06-08 Cathode rotative.

Publications (2)

Publication Number Publication Date
DE69104131D1 true DE69104131D1 (de) 1994-10-27
DE69104131T2 DE69104131T2 (de) 1995-03-23

Family

ID=3884817

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69104131T Expired - Fee Related DE69104131T2 (de) 1990-06-08 1991-06-06 Drehkathode.

Country Status (6)

Country Link
US (1) US5158660A (de)
EP (1) EP0461035B1 (de)
JP (1) JPH06128741A (de)
BE (1) BE1003701A3 (de)
DE (1) DE69104131T2 (de)
ES (1) ES2062715T3 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5405517A (en) * 1993-12-06 1995-04-11 Curtis M. Lampkin Magnetron sputtering method and apparatus for compound thin films
US5507931A (en) * 1993-12-30 1996-04-16 Deposition Technologies, Inc. Sputter deposition process
ZA956811B (en) * 1994-09-06 1996-05-14 Boc Group Inc Dual cylindrical target magnetron with multiple anodes
FR2725073B1 (fr) * 1994-09-22 1996-12-20 Saint Gobain Vitrage Cathode rotative de pulverisation cathodique a plusieurs cibles
DE19508405A1 (de) * 1995-03-09 1996-09-12 Leybold Ag Kathodenanordnung für eine Vorrichtung zum Zerstäuben von einem Target-Paar
DE19623359A1 (de) * 1995-08-17 1997-02-20 Leybold Ag Vorrichtung zum Beschichten eines Substrats
DE19610253C2 (de) * 1996-03-15 1999-01-14 Fraunhofer Ges Forschung Zerstäubungseinrichtung
DE19735469A1 (de) * 1997-08-16 1999-02-18 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung
DE19747923C2 (de) * 1997-10-30 2002-09-12 Leybold Systems Gmbh Sputterkathode
US6761804B2 (en) 2002-02-11 2004-07-13 Applied Materials, Inc. Inverted magnetron
DE10336422A1 (de) * 2003-08-08 2005-03-17 Applied Films Gmbh & Co. Kg Vorrichtung zur Kathodenzerstäubung
SG118232A1 (en) * 2004-02-27 2006-06-27 Superiorcoat Private Ltd Cathodic arc coating apparatus
US20050224343A1 (en) * 2004-04-08 2005-10-13 Richard Newcomb Power coupling for high-power sputtering
US20060065524A1 (en) * 2004-09-30 2006-03-30 Richard Newcomb Non-bonded rotatable targets for sputtering
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
US20060278521A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for controlling ion density and energy using modulated power signals
US20060278524A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for modulating power signals to control sputtering
US20070051388A1 (en) * 2005-09-06 2007-03-08 Applied Materials, Inc. Apparatus and methods for using high frequency chokes in a substrate deposition apparatus
US7842355B2 (en) * 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
US20070095281A1 (en) * 2005-11-01 2007-05-03 Stowell Michael W System and method for power function ramping of microwave liner discharge sources
DE102006009160B4 (de) * 2006-02-22 2010-01-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung für die Separation von Partikeln aus einem Plasma
US20080127887A1 (en) * 2006-12-01 2008-06-05 Applied Materials, Inc. Vertically mounted rotary cathodes in sputtering system on elevated rails
US20080197015A1 (en) * 2007-02-16 2008-08-21 Terry Bluck Multiple-magnetron sputtering source with plasma confinement
US20090197015A1 (en) * 2007-12-25 2009-08-06 Applied Materials, Inc. Method and apparatus for controlling plasma uniformity
US9175383B2 (en) * 2008-01-16 2015-11-03 Applied Materials, Inc. Double-coating device with one process chamber
EP2081212B1 (de) 2008-01-16 2016-03-23 Applied Materials, Inc. Doppelbeschichtungsvorrichtung mit einer Prozesskammer
US20100018857A1 (en) * 2008-07-23 2010-01-28 Seagate Technology Llc Sputter cathode apparatus allowing thick magnetic targets
US9751254B2 (en) 2008-10-09 2017-09-05 Bobst Manchester Ltd Apparatus for treating substrates
EP2175047B1 (de) * 2008-10-09 2017-02-08 Bobst Manchester Ltd Vorrichtung zur Plasmabehandlung von Substraten und Verfahren
EP2276054A1 (de) * 2009-07-13 2011-01-19 Applied Materials, Inc. Sputtersystem, drehbare zylinderförmige Targetanordnung, Sicherungsrohr, Targetelement und Kühlschild
DE102013206210B4 (de) * 2013-04-09 2017-05-04 Von Ardenne Gmbh Vakuumbeschichtungsvorrichtung und Verfahren zur Mehrfachbeschichtung
KR102245606B1 (ko) * 2015-01-14 2021-04-28 삼성디스플레이 주식회사 마그네트론 증착 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4116793A (en) * 1974-12-23 1978-09-26 Telic Corporation Glow discharge method and apparatus
GB2096177B (en) * 1981-04-07 1985-07-17 Fournier Paul R Improved integrated sputtering apparatus and method
DD217964A3 (de) * 1981-10-02 1985-01-23 Ardenne Manfred Einrichtung zum hochratezerstaeuben nach dem plasmatronprinzip
DE3371439D1 (en) * 1982-01-26 1987-06-11 Materials Research Corp Magnetron reactive bias sputtering method and apparatus
US4445997A (en) * 1983-08-17 1984-05-01 Shatterproof Glass Corporation Rotatable sputtering apparatus
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
US5047131A (en) * 1989-11-08 1991-09-10 The Boc Group, Inc. Method for coating substrates with silicon based compounds

Also Published As

Publication number Publication date
US5158660A (en) 1992-10-27
EP0461035B1 (de) 1994-09-21
ES2062715T3 (es) 1994-12-16
JPH06128741A (ja) 1994-05-10
EP0461035A1 (de) 1991-12-11
DE69104131T2 (de) 1995-03-23
BE1003701A3 (fr) 1992-05-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee