DE69031460D1 - Planarisierende Ablagerung aus Silsesquioxan-Copolymer - Google Patents
Planarisierende Ablagerung aus Silsesquioxan-CopolymerInfo
- Publication number
- DE69031460D1 DE69031460D1 DE69031460T DE69031460T DE69031460D1 DE 69031460 D1 DE69031460 D1 DE 69031460D1 DE 69031460 T DE69031460 T DE 69031460T DE 69031460 T DE69031460 T DE 69031460T DE 69031460 D1 DE69031460 D1 DE 69031460D1
- Authority
- DE
- Germany
- Prior art keywords
- planarizing
- deposit made
- silsesquioxane copolymer
- silsesquioxane
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
- H01L21/3122—Layers comprising organo-silicon compounds layers comprising polysiloxane compounds
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/494,006 US5043789A (en) | 1990-03-15 | 1990-03-15 | Planarizing silsesquioxane copolymer coating |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69031460D1 true DE69031460D1 (de) | 1997-10-23 |
DE69031460T2 DE69031460T2 (de) | 1998-03-26 |
Family
ID=23962616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69031460T Expired - Fee Related DE69031460T2 (de) | 1990-03-15 | 1990-10-05 | Planarisierende Ablagerung aus Silsesquioxan-Copolymer |
Country Status (4)
Country | Link |
---|---|
US (1) | US5043789A (de) |
EP (1) | EP0447611B1 (de) |
JP (1) | JP2575540B2 (de) |
DE (1) | DE69031460T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112048226A (zh) * | 2020-09-13 | 2020-12-08 | 上海普信高分子材料有限公司 | 一种耐酸碱氟硅丙烯酸树脂涂层及其制备方法 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04233732A (ja) * | 1990-08-16 | 1992-08-21 | Motorola Inc | 半導体の製造工程で使用するスピン・オン誘電体 |
US5194928A (en) * | 1991-01-14 | 1993-03-16 | International Business Machines Corporation | Passivation of metal in metal/polyimide structure |
US5492730A (en) * | 1992-12-28 | 1996-02-20 | Aluminum Company Of America | Siloxane coating process for metal or ceramic substrates |
US5397741A (en) * | 1993-03-29 | 1995-03-14 | International Business Machines Corporation | Process for metallized vias in polyimide |
US5484867A (en) * | 1993-08-12 | 1996-01-16 | The University Of Dayton | Process for preparation of polyhedral oligomeric silsesquioxanes and systhesis of polymers containing polyhedral oligomeric silsesqioxane group segments |
US5412053A (en) * | 1993-08-12 | 1995-05-02 | The University Of Dayton | Polymers containing alternating silsesquioxane and bridging group segments and process for their preparation |
US5438022A (en) * | 1993-12-14 | 1995-08-01 | At&T Global Information Solutions Company | Method for using low dielectric constant material in integrated circuit fabrication |
EP0701121A4 (de) * | 1994-03-11 | 1997-09-03 | Kawasaki Steel Co | Verfahren zur bewertung der zur erzeugung von isolationsbeschichtung verwendeten siloxane,beschichtungsflüssigkeit verwendet zur erzeugung der isolationsbeschichtung,verfahren zur herstellung der flüssigkeit,verfahren zur herstellung der isolationsbeschichtung für halbleiterbauelemente,und verfahren zur herstellung von halbleiterbauelemente durch die anwendung von obigen verfahren |
US5456952A (en) * | 1994-05-17 | 1995-10-10 | Lsi Logic Corporation | Process of curing hydrogen silsesquioxane coating to form silicon oxide layer |
US5527737A (en) * | 1994-05-27 | 1996-06-18 | Texas Instruments Incorporated | Selective formation of low-density, low-dielectric-constant insulators in narrow gaps for line-to-line capacitance reduction |
EP0701277B1 (de) * | 1994-05-27 | 2008-02-27 | Texas Instruments Incorporated | Verbindungsverfahren mit Benutzung eines porösen Isolators zur Reduzierung der Kapazitäten zwischen Leiterbahnen |
US5527562A (en) * | 1994-10-21 | 1996-06-18 | Aluminum Company Of America | Siloxane coatings for aluminum reflectors |
US5534731A (en) * | 1994-10-28 | 1996-07-09 | Advanced Micro Devices, Incorporated | Layered low dielectric constant technology |
KR0179838B1 (ko) * | 1995-09-02 | 1999-04-15 | 문정환 | 반도체 소자의 절연막 구조 및 절연막 평탄화 방법 |
US6824879B2 (en) * | 1999-06-10 | 2004-11-30 | Honeywell International Inc. | Spin-on-glass anti-reflective coatings for photolithography |
JP2003502449A (ja) * | 1999-06-10 | 2003-01-21 | ハネウエル・インターナシヨナル・インコーポレーテツド | フォトリソグラフィ用スピンオンガラス反射防止コーティング |
US6368400B1 (en) * | 2000-07-17 | 2002-04-09 | Honeywell International | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography |
US6569932B2 (en) | 2001-07-06 | 2003-05-27 | Benjamin S. Hsiao | Blends of organic silicon compounds with ethylene-based polymers |
US7108771B2 (en) * | 2001-12-13 | 2006-09-19 | Advanced Technology Materials, Inc. | Method for removal of impurities in cyclic siloxanes useful as precursors for low dielectric constant thin films |
US7423166B2 (en) * | 2001-12-13 | 2008-09-09 | Advanced Technology Materials, Inc. | Stabilized cyclosiloxanes for use as CVD precursors for low-dielectric constant thin films |
US7456488B2 (en) * | 2002-11-21 | 2008-11-25 | Advanced Technology Materials, Inc. | Porogen material |
KR20060066080A (ko) * | 2003-08-01 | 2006-06-15 | 다우 코닝 코포레이션 | 광전지 어플리케이션을 위한 실리콘 기반의 유전성 코팅 및필름 |
KR20060131735A (ko) * | 2003-10-07 | 2006-12-20 | 허니웰 인터내셔날 인코포레이티드 | 집적 회로 장치를 위한 코팅 및 하드 마스크 조성물, 생산방법 및 이들의 용도 |
US8053159B2 (en) | 2003-11-18 | 2011-11-08 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
US8053375B1 (en) | 2006-11-03 | 2011-11-08 | Advanced Technology Materials, Inc. | Super-dry reagent compositions for formation of ultra low k films |
US8642246B2 (en) | 2007-02-26 | 2014-02-04 | Honeywell International Inc. | Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof |
US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
KR20120046532A (ko) * | 2010-11-02 | 2012-05-10 | 한국생명공학연구원 | 항생물부착성 ssq/peg 네트워크 및 그 제조방법 |
US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
US10138381B2 (en) | 2012-05-10 | 2018-11-27 | Burning Bush Group, Llc | High performance silicon based thermal coating compositions |
WO2014008443A2 (en) | 2012-07-03 | 2014-01-09 | Burning Bush Group, Llc | High performance silicon based coating compositions |
US10544329B2 (en) | 2015-04-13 | 2020-01-28 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
CN107922257A (zh) | 2015-09-02 | 2018-04-17 | 康宁股份有限公司 | 抗微生物‑抗反射制品及其制造方法 |
US10544330B2 (en) * | 2017-01-20 | 2020-01-28 | Honeywell International Inc. | Gap filling dielectric materials |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US276597A (en) * | 1883-05-01 | Stove-pipe thimble and flue-stopper | ||
US4349609A (en) * | 1979-06-21 | 1982-09-14 | Fujitsu Limited | Electronic device having multilayer wiring structure |
US4222792A (en) * | 1979-09-10 | 1980-09-16 | International Business Machines Corporation | Planar deep oxide isolation process utilizing resin glass and E-beam exposure |
US4480009A (en) * | 1980-12-15 | 1984-10-30 | M&T Chemicals Inc. | Siloxane-containing polymers |
EP0076656B1 (de) * | 1981-10-03 | 1988-06-01 | Japan Synthetic Rubber Co., Ltd. | In Lösungsmitteln lösliche Organopolysilsesquioxane, Verfahren zu ihrer Herstellung, Zusammensetzungen und Halbleitervorrichtungen, die diese verwenden |
US4564562A (en) * | 1984-05-29 | 1986-01-14 | At&T Technologies, Inc. | Silicone encapsulated devices |
US4670299A (en) * | 1984-11-01 | 1987-06-02 | Fujitsu Limited | Preparation of lower alkyl polysilsesquioxane and formation of insulating layer of silylated polymer on electronic circuit board |
US4723978A (en) * | 1985-10-31 | 1988-02-09 | International Business Machines Corporation | Method for a plasma-treated polysiloxane coating |
US4801507A (en) * | 1987-07-02 | 1989-01-31 | Akzo American Inc. | Arylsiloxane/silicate compositions useful as interlayer dielectric films |
US4981530A (en) * | 1988-11-28 | 1991-01-01 | International Business Machines Corporation | Planarizing ladder-type silsesquioxane polymer insulation layer |
-
1990
- 1990-03-15 US US07/494,006 patent/US5043789A/en not_active Expired - Lifetime
- 1990-10-05 DE DE69031460T patent/DE69031460T2/de not_active Expired - Fee Related
- 1990-10-05 EP EP90119114A patent/EP0447611B1/de not_active Expired - Lifetime
-
1991
- 1991-02-14 JP JP3040822A patent/JP2575540B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112048226A (zh) * | 2020-09-13 | 2020-12-08 | 上海普信高分子材料有限公司 | 一种耐酸碱氟硅丙烯酸树脂涂层及其制备方法 |
CN112048226B (zh) * | 2020-09-13 | 2021-09-03 | 上海普信高分子材料有限公司 | 一种耐酸碱氟硅丙烯酸树脂涂层及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP0447611A3 (en) | 1991-10-16 |
DE69031460T2 (de) | 1998-03-26 |
US5043789A (en) | 1991-08-27 |
JPH07258607A (ja) | 1995-10-09 |
JP2575540B2 (ja) | 1997-01-29 |
EP0447611A2 (de) | 1991-09-25 |
EP0447611B1 (de) | 1997-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69031460D1 (de) | Planarisierende Ablagerung aus Silsesquioxan-Copolymer | |
DE69132627D1 (de) | Halbleiter-bauteil | |
DE69321543D1 (de) | Gefärbte Schicht | |
DE69103489D1 (de) | Filmbildende Organopolysiloxanzusammensetzung. | |
FI930113A (fi) | Dieseloljor innehaollande organometalliska komplex | |
DE69124446D1 (de) | Organosiliciumzusammensetzungen | |
DE69119980D1 (de) | Polysilethylensiloxan | |
DE69121331D1 (de) | Oxymethylencopolymerzusammensetzung | |
KR900011869A (ko) | 물을 시팅시키는 쯔비터이오노머성 아미노작용성 실록산 | |
DE69118214D1 (de) | Digitaler Halbleiterschaltkreis | |
DE69122559D1 (de) | Polysilethylensiloxan | |
FI103799B1 (fi) | Siloksaanikopolymeeri | |
DE69219664T2 (de) | Dreidimensionales Polysilan | |
DE69129361T2 (de) | Digitales Filter | |
DE69127705D1 (de) | Palettierer | |
GB9118724D0 (en) | Multiple layer semiconductor | |
DE69217788T2 (de) | Überzugscopolymer | |
EP0724300A3 (de) | Halbleitervorrichtung mit reflektierender Schicht | |
FI925724A (fi) | Producering av immunoglobuliner i trichoderma | |
NO921176L (no) | Krafttilfoersels-grensesnitt | |
NO177767C (no) | Virelås | |
DE69125134D1 (de) | Hitzehärtbare Organopolysiloxanzusammensetzung | |
DE69124086D1 (de) | Halbleiterbauelement | |
KR920008926U (ko) | 주방용 칼집 | |
KR920010990U (ko) | 자개 활패기 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |