DE69025731T2 - Apparat zur bondierung von leitungen an nichtkoplanaren substraten - Google Patents

Apparat zur bondierung von leitungen an nichtkoplanaren substraten

Info

Publication number
DE69025731T2
DE69025731T2 DE69025731T DE69025731T DE69025731T2 DE 69025731 T2 DE69025731 T2 DE 69025731T2 DE 69025731 T DE69025731 T DE 69025731T DE 69025731 T DE69025731 T DE 69025731T DE 69025731 T2 DE69025731 T2 DE 69025731T2
Authority
DE
Germany
Prior art keywords
coplanar substrates
bonding cables
cables
bonding
coplanar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69025731T
Other languages
English (en)
Other versions
DE69025731D1 (de
Inventor
Gerald Dunn
Dean Haagenson
Michael Pirozzoli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Unisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corp filed Critical Unisys Corp
Publication of DE69025731D1 publication Critical patent/DE69025731D1/de
Application granted granted Critical
Publication of DE69025731T2 publication Critical patent/DE69025731T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
DE69025731T 1989-05-16 1990-05-02 Apparat zur bondierung von leitungen an nichtkoplanaren substraten Expired - Fee Related DE69025731T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/353,377 US4896811A (en) 1989-05-16 1989-05-16 Machine for bonding leads to non-coplanar substrates
PCT/US1990/002447 WO1990014688A1 (en) 1989-05-16 1990-05-02 Machine for bonding leads to non-coplanar substrates

Publications (2)

Publication Number Publication Date
DE69025731D1 DE69025731D1 (de) 1996-04-11
DE69025731T2 true DE69025731T2 (de) 1996-10-31

Family

ID=23388843

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69025731T Expired - Fee Related DE69025731T2 (de) 1989-05-16 1990-05-02 Apparat zur bondierung von leitungen an nichtkoplanaren substraten

Country Status (5)

Country Link
US (1) US4896811A (de)
EP (1) EP0434786B1 (de)
JP (1) JPH03506103A (de)
DE (1) DE69025731T2 (de)
WO (1) WO1990014688A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869715A (en) * 1988-04-21 1989-09-26 Sherburne Fred S Ultrasonic cone and method of construction
CH680176A5 (de) * 1989-11-14 1992-06-30 Esec Sa
US5447509A (en) * 1991-01-11 1995-09-05 Baxter International Inc. Ultrasound catheter system having modulated output with feedback control
US5127573A (en) * 1991-05-22 1992-07-07 Industrial Technology Research Institute Tape automated bonding apparatus with automatic leveling stage
JP2839215B2 (ja) * 1991-09-04 1998-12-16 株式会社カイジョー ボンディング装置
JP3295529B2 (ja) * 1994-05-06 2002-06-24 松下電器産業株式会社 Ｉｃ部品実装方法及び装置
US6047875A (en) * 1995-09-20 2000-04-11 Unitek Miyachi Coporation Reflow soldering self-aligning fixture
US6019154A (en) * 1996-09-20 2000-02-01 Motorola, Inc. Self leveling operation stage for ultrasonic welding
US6204467B1 (en) * 1998-03-24 2001-03-20 Ford Global Technologies, Inc. Method and apparatus for resistive welding
TWI244419B (en) * 2003-09-25 2005-12-01 Unaxis Internat Tranding Ltd Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate
DE102006003735A1 (de) * 2006-01-26 2007-08-09 Infineon Technologies Ag Anordnung zum Befestigen von elektronischen Bauelementen auf einem Träger
WO2010149314A1 (de) 2009-06-22 2010-12-29 Firma Leonhard Kurz Stiftung & Co. Kg Fügevorrichtung zum fügen zweier werkstücke mit entweder einem schwenkbaren stempel oder einem schwenkbaren auflagetisch
US10186450B2 (en) * 2014-07-21 2019-01-22 Asm Ip Holding B.V. Apparatus and method for adjusting a pedestal assembly for a reactor
CN114512579B (zh) * 2022-02-18 2022-10-11 广东工业大学 一种Mini/micro芯片柔性飞行刺晶装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3442432A (en) * 1967-06-15 1969-05-06 Western Electric Co Bonding a beam-leaded device to a substrate
US3448911A (en) * 1967-06-15 1969-06-10 Western Electric Co Compensating base for simultaneously bonding multiple leads
US3574923A (en) * 1967-06-15 1971-04-13 Western Electric Co Compensating base for simultaneously bonding multiple leads
US3957185A (en) * 1975-08-25 1976-05-18 Western Electric Company, Inc. Methods of and apparatus for thermocompression bonding with a compensating system
US4573627A (en) * 1984-12-20 1986-03-04 The United States Of America As Represented By The Secretary Of The Army Indium bump hybrid bonding method and system

Also Published As

Publication number Publication date
US4896811A (en) 1990-01-30
DE69025731D1 (de) 1996-04-11
EP0434786B1 (de) 1996-03-06
JPH03506103A (ja) 1991-12-26
EP0434786A1 (de) 1991-07-03
WO1990014688A1 (en) 1990-11-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee