DE69014420D1 - Schaltungsmodul mit Konvektionskühlung mit einem fliessenden Kühlmittel zwischen einer wärmeproduzierenden Komponente und der Stirnseite eines Kolbens. - Google Patents

Schaltungsmodul mit Konvektionskühlung mit einem fliessenden Kühlmittel zwischen einer wärmeproduzierenden Komponente und der Stirnseite eines Kolbens.

Info

Publication number
DE69014420D1
DE69014420D1 DE69014420T DE69014420T DE69014420D1 DE 69014420 D1 DE69014420 D1 DE 69014420D1 DE 69014420 T DE69014420 T DE 69014420T DE 69014420 T DE69014420 T DE 69014420T DE 69014420 D1 DE69014420 D1 DE 69014420D1
Authority
DE
Germany
Prior art keywords
piston
face
heat
circuit module
producing component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69014420T
Other languages
English (en)
Other versions
DE69014420T2 (de
Inventor
Gregory Martin Chrysler
Richard Chao-Fan Chu
Robert Edward Simons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69014420D1 publication Critical patent/DE69014420D1/de
Application granted granted Critical
Publication of DE69014420T2 publication Critical patent/DE69014420T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69014420T 1989-06-15 1990-05-07 Schaltungsmodul mit Konvektionskühlung mit einem fliessenden Kühlmittel zwischen einer wärmeproduzierenden Komponente und der Stirnseite eines Kolbens. Expired - Fee Related DE69014420T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/366,945 US4928207A (en) 1989-06-15 1989-06-15 Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston

Publications (2)

Publication Number Publication Date
DE69014420D1 true DE69014420D1 (de) 1995-01-12
DE69014420T2 DE69014420T2 (de) 1995-05-24

Family

ID=23445278

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69014420T Expired - Fee Related DE69014420T2 (de) 1989-06-15 1990-05-07 Schaltungsmodul mit Konvektionskühlung mit einem fliessenden Kühlmittel zwischen einer wärmeproduzierenden Komponente und der Stirnseite eines Kolbens.

Country Status (4)

Country Link
US (1) US4928207A (de)
EP (1) EP0402614B1 (de)
JP (1) JPH0330458A (de)
DE (1) DE69014420T2 (de)

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US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
FR2664684A1 (fr) * 1990-07-10 1992-01-17 Metal Process Dispositif de controle de la temperature d'une piece par contacts multiples.
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5294830A (en) * 1991-05-21 1994-03-15 International Business Machines Corporation Apparatus for indirect impingement cooling of integrated circuit chips
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
JP2748732B2 (ja) * 1991-07-19 1998-05-13 日本電気株式会社 液体冷媒循環システム
JPH05141831A (ja) * 1991-11-15 1993-06-08 Nec Corp 液体冷媒循環量制御構造
JP2792304B2 (ja) * 1992-01-22 1998-09-03 日本電気株式会社 集積回路用冷却装置
US5241131A (en) * 1992-04-14 1993-08-31 International Business Machines Corporation Erosion/corrosion resistant diaphragm
US5239443A (en) * 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5412536A (en) * 1994-03-28 1995-05-02 International Business Machines Corporation Local condensation control for liquid impingement two-phase cooling
US5463872A (en) * 1994-09-08 1995-11-07 International Business Machines Corporation High performance thermal interface for low temperature electronic modules
KR19990045764A (ko) * 1995-09-20 1999-06-25 핀트족 마르시아디 흡수쌍 냉동 장치
US5873258A (en) 1995-09-20 1999-02-23 Sun Microsystems, Inc Sorption refrigeration appliance
US6244056B1 (en) 1995-09-20 2001-06-12 Sun Microsystems, Inc. Controlled production of ammonia and other gases
US5842356A (en) * 1995-09-20 1998-12-01 Sun Microsystems, Inc. Electromagnetic wave-activated sorption refrigeration system
US5855119A (en) * 1995-09-20 1999-01-05 Sun Microsystems, Inc. Method and apparatus for cooling electrical components
US5916259A (en) 1995-09-20 1999-06-29 Sun Microsystems, Inc. Coaxial waveguide applicator for an electromagnetic wave-activated sorption system
US6052284A (en) * 1996-08-06 2000-04-18 Advantest Corporation Printed circuit board with electronic devices mounted thereon
JP2000357766A (ja) * 1999-06-14 2000-12-26 Hitachi Ltd モジュール内への液体冷媒の封止方法
JP4141613B2 (ja) * 2000-03-09 2008-08-27 富士通株式会社 密閉サイクル冷凍装置および密閉サイクル冷凍装置用乾式蒸発器
US7003979B1 (en) 2000-03-13 2006-02-28 Sun Microsystems, Inc. Method and apparatus for making a sorber
US7267357B2 (en) * 2001-02-15 2007-09-11 Miller Sports International, Inc. Multi-function binding system
US6867976B2 (en) * 2002-02-12 2005-03-15 Hewlett-Packard Development Company, L.P. Pin retention for thermal transfer interfaces, and associated methods
US7035104B2 (en) * 2002-08-06 2006-04-25 Mudawar Thermal Systems Inc. Apparatus for heat transfer and critical heat flux enhancement
JP3847691B2 (ja) * 2002-09-26 2006-11-22 三菱電機株式会社 電力用半導体装置
US6943444B2 (en) 2003-10-30 2005-09-13 International Business Machines Corporation Cooling of surface temperature of a device
US7280363B2 (en) * 2005-01-21 2007-10-09 Delphi Technologies, Inc. Apparatus for controlling thermal interface between cold plate and integrated circuit chip
US20060169438A1 (en) * 2005-01-28 2006-08-03 Malone Christopher G Thermally conductive cover directly attached to heat producing component
US7264041B2 (en) * 2005-06-14 2007-09-04 International Business Machines Corporation Compliant thermal interface structure with vapor chamber
ATE510337T1 (de) * 2006-08-25 2011-06-15 Abb Research Ltd Kühleinrichtung für ein elektrisches betriebsmittel
US7567090B2 (en) * 2006-10-23 2009-07-28 International Business Machines Corporation Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application
CN101252089B (zh) * 2008-03-20 2010-10-06 上海交通大学 利用微汽泡喷射沸腾冷却微电子芯片的方法
TWI559843B (zh) 2008-04-21 2016-11-21 液體冷卻解決方案股份有限公司 用於電子裝置液體浸沒冷卻之陣列連接式殼體及機架系統
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8964384B2 (en) * 2012-07-27 2015-02-24 Hewlett-Packard Development Company, L.P. Component cooling
US9096079B2 (en) * 2012-10-11 2015-08-04 Eastman Kodak Company Dryer impinging heating liquid onto moistened medium
EP3227624B1 (de) * 2014-12-03 2021-01-27 GE Intelligent Platforms, Inc. Verfahren zur bereitstellung einer kombinierten energiedissipationsanordnung
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
CN109755199B (zh) * 2019-02-20 2020-11-06 合肥工业大学 一种微小通道射流散热器
US10964625B2 (en) 2019-02-26 2021-03-30 Google Llc Device and method for direct liquid cooling via metal channels
JP7195542B2 (ja) * 2019-04-05 2022-12-26 富士電機株式会社 冷却器、半導体モジュール
WO2020257923A1 (en) * 2019-06-27 2020-12-30 Hypertechnologie Ciara Inc. Microgap system for cooling electronics with direct contact
CN113257759A (zh) * 2020-02-10 2021-08-13 华为技术有限公司 散热器、单板、电子设备及制造方法
US10966338B1 (en) 2020-03-11 2021-03-30 Peter C. Salmon Densely packed electronic systems
US11546991B2 (en) 2020-03-11 2023-01-03 Peter C. Salmon Densely packed electronic systems
US11393807B2 (en) 2020-03-11 2022-07-19 Peter C. Salmon Densely packed electronic systems
US11769710B2 (en) * 2020-03-27 2023-09-26 Xilinx, Inc. Heterogeneous integration module comprising thermal management apparatus
US20220015262A1 (en) * 2020-07-09 2022-01-13 Intel Corporation Technologies for dynamic cooling in a multi-chip package with programmable impingement valves
US11776876B2 (en) * 2021-01-25 2023-10-03 International Business Machines Corporation Distributing heatsink load across a processor module with separable input/output (I/O) connectors
US11523543B1 (en) 2022-02-25 2022-12-06 Peter C. Salmon Water cooled server
US11445640B1 (en) 2022-02-25 2022-09-13 Peter C. Salmon Water cooled server
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Also Published As

Publication number Publication date
EP0402614A1 (de) 1990-12-19
JPH0330458A (ja) 1991-02-08
US4928207A (en) 1990-05-22
EP0402614B1 (de) 1994-11-30
DE69014420T2 (de) 1995-05-24
JPH0587985B2 (de) 1993-12-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee