DE69010655D1 - Anordnung für doppelseitige Rückwand. - Google Patents

Anordnung für doppelseitige Rückwand.

Info

Publication number
DE69010655D1
DE69010655D1 DE69010655T DE69010655T DE69010655D1 DE 69010655 D1 DE69010655 D1 DE 69010655D1 DE 69010655 T DE69010655 T DE 69010655T DE 69010655 T DE69010655 T DE 69010655T DE 69010655 D1 DE69010655 D1 DE 69010655D1
Authority
DE
Germany
Prior art keywords
double
arrangement
rear wall
sided rear
sided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69010655T
Other languages
English (en)
Other versions
DE69010655T2 (de
Inventor
Conrad Jean Aug
Wayne Joseph Casanova
William Dale Corfits
Roger Francis Dimmick
Stephen Edward Wheeler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69010655D1 publication Critical patent/DE69010655D1/de
Publication of DE69010655T2 publication Critical patent/DE69010655T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1445—Back panel mother boards with double-sided connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
DE69010655T 1990-01-19 1990-11-27 Anordnung für doppelseitige Rückwand. Expired - Fee Related DE69010655T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/467,450 US5023754A (en) 1990-01-19 1990-01-19 Double-sided backplane assembly

Publications (2)

Publication Number Publication Date
DE69010655D1 true DE69010655D1 (de) 1994-08-18
DE69010655T2 DE69010655T2 (de) 1995-01-12

Family

ID=23855748

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69010655T Expired - Fee Related DE69010655T2 (de) 1990-01-19 1990-11-27 Anordnung für doppelseitige Rückwand.

Country Status (5)

Country Link
US (1) US5023754A (de)
EP (1) EP0438012B1 (de)
JP (1) JPH04153808A (de)
BR (1) BR9006652A (de)
DE (1) DE69010655T2 (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5119273A (en) * 1990-01-29 1992-06-02 The United States Of America As Represented By The Secretary Of The Navy High speed parallel backplane
DE69112145T2 (de) * 1990-07-03 1996-05-02 Ibm Gehäuse für Subsysteme in einem Datenverarbeitungssystem.
US5305183A (en) * 1991-07-09 1994-04-19 Edison Welding Institute Portable personal computer with passive backplane having a doublesided staggered connector array
EP0598028B1 (de) * 1991-08-09 1998-11-25 Tandem Computers Incorporated Elektronische baugruppe mit verbesserter erdung
US5208729A (en) * 1992-02-14 1993-05-04 International Business Machines Corporation Multi-chip module
US5296748A (en) * 1992-06-24 1994-03-22 Network Systems Corporation Clock distribution system
US5302923A (en) * 1992-07-16 1994-04-12 Hewlett-Packard Company Interconnection plate having high frequency transmission line through paths
US5313369A (en) * 1992-11-03 1994-05-17 Digital Equipment Corporation Reduced tolerance interconnect system
US5362295A (en) * 1993-02-23 1994-11-08 William Nurge Exercise belt system
DE4309172C1 (de) * 1993-03-22 1994-10-06 Siemens Nixdorf Inf Syst Verbindungsrückwand für Baugruppenträger
CA2124773C (en) * 1994-05-31 1998-11-03 Raymond Bruce Wallace Backplane and shelf
US5652697A (en) * 1995-11-13 1997-07-29 Ast Research, Inc. Computer system backplane having ground tabs for interconnecting the backplane ground to the computer system chassis
WO1997034452A1 (de) * 1996-03-13 1997-09-18 Siemens Nixdorf Informationssysteme Ag Gerätechassis für elektronische geräte
US5748451A (en) * 1996-08-14 1998-05-05 International Business Machines Corporation Power distribution/stiffener for active back plane technologies
US5856632A (en) * 1996-12-03 1999-01-05 A K Stamping Co. Inc. Card cage shielding contactor
US5808876A (en) * 1997-06-20 1998-09-15 International Business Machines Corporation Multi-function power distribution system
JP3543555B2 (ja) * 1997-08-08 2004-07-14 株式会社日立製作所 信号伝送装置
US5923531A (en) * 1997-10-14 1999-07-13 International Business Machines Corporation Enhanced circuit board arrangement for a computer
US5929377A (en) * 1997-10-15 1999-07-27 International Business Machines Corporation Apparatus for preventing leakage of electromagnetic radiation from electronic enclosures
ATE217475T1 (de) * 1997-12-16 2002-05-15 Siemens Ag Baugruppenrahmen zur aufnahme von unterschiedlichen baugruppen
US6166919A (en) * 1997-12-16 2000-12-26 Notrel Networks Corporation Casing mountable filler module
US6266247B1 (en) 1998-08-24 2001-07-24 Racal Instruments Inc. Power supply connection system
US6320750B2 (en) * 1998-11-24 2001-11-20 Trw Inc. Sub-modular configurable avionics
TW379824U (en) * 1998-12-28 2000-01-11 Foxconn Prec Components Co Ltd Heat radiating apparatus
TW511723U (en) * 1998-12-28 2002-11-21 Foxconn Prec Components Co Ltd Memory bus module
US6285563B1 (en) * 1999-03-31 2001-09-04 Emc Corporation Support bracket for a printed circuit board connectable to daughter boards
US6195266B1 (en) 1999-03-31 2001-02-27 International Business Machines Corporation Electromechanical emissions grounding device for ultra high speed processors
DE69933706T2 (de) * 1999-05-31 2007-08-23 Fujitsu Ltd., Kawasaki Kommunikations vorrichtung und steckeinheit
US6239984B1 (en) * 1999-08-12 2001-05-29 3Com Corporation Backplane circuit board for an electronic chassis
US6496366B1 (en) * 1999-10-26 2002-12-17 Rackable Systems, Llc High density computer equipment storage system
US6437992B1 (en) * 1999-12-21 2002-08-20 Sun Microsystems, Inc. Hot pluggable printed circuit board insulating system and method
US6549027B1 (en) 2000-02-01 2003-04-15 Sun Microsystems, Inc. Apparatus and method for testing for compatibility between circuit boards
US6411520B1 (en) * 2000-04-18 2002-06-25 Grass Valley Group Modular equipment frame and modules
US6760339B1 (en) * 2000-05-20 2004-07-06 Equipe Communications Corporation Multi-layer network device in one telecommunications rack
US7023845B1 (en) * 2000-06-13 2006-04-04 Ciena Corporation Network device including multiple mid-planes
US6376779B1 (en) * 2000-08-24 2002-04-23 Nortel Networks Limited Printed circuit board having a plurality of spaced apart scrap border support tabs
US7042737B1 (en) * 2000-12-12 2006-05-09 Lsi Logic Corporation System for efficiently channeling high frequency data signals through sheet metal containment
US6498732B2 (en) * 2000-12-22 2002-12-24 Aurora Networks, Inc. Chassis for front and back inserted modules
JP2002232167A (ja) * 2001-01-31 2002-08-16 Fujitsu Ltd 伝送装置、サブラックおよびコネクタユニット
US6618270B2 (en) * 2001-02-27 2003-09-09 Trioniq Inc. System and method for shielding electronic components
US6646868B2 (en) * 2001-06-04 2003-11-11 Sun Microsystems, Inc. Computer bus rack having an increased density of card slots
US6639795B1 (en) * 2002-02-15 2003-10-28 Steve Cooper Flow through butterfly backpane
JP2003332777A (ja) * 2002-05-14 2003-11-21 Fujitsu Ltd 通信装置
KR100440590B1 (ko) * 2002-06-26 2004-07-19 한국전자통신연구원 고밀도 케이블 접속을 위한 백플레인 장치
DE10230704C1 (de) * 2002-07-08 2003-10-30 Siemens Ag Elektrisch geschirmter Baugruppenträger
US6870743B2 (en) * 2003-03-17 2005-03-22 Unisys Corporation Cellular computer system
US7095622B2 (en) * 2003-06-11 2006-08-22 Hewlett-Packard Development Company, L.P. Backplane support system with stiffener
US6924986B1 (en) * 2003-06-27 2005-08-02 Emc Corporation Invertible, pluggable module for variable I/O densities
DE602004005598T2 (de) * 2003-07-08 2008-01-24 Viasystems Group, Inc. Verfahren zur herstellung einer midplane
US7180751B1 (en) 2004-02-19 2007-02-20 Isothermal Systems Research, Inc. Input/output transition board system
US7251145B1 (en) * 2004-08-18 2007-07-31 Sun Microsystems, Inc. Inject/eject mechanism for circuit boards
US7840738B2 (en) 2006-10-10 2010-11-23 Honeywell International Inc. Connector system
KR101392668B1 (ko) * 2009-10-16 2014-05-07 후지쯔 가부시끼가이샤 판금 구조 및 전자 장치
US9232666B2 (en) * 2013-11-08 2016-01-05 Tyco Electronics Corporation Cable backplane system having stiffeners
US9398720B1 (en) * 2014-05-30 2016-07-19 Emc Corporation Chassis with airflow and thermal management
KR102335321B1 (ko) * 2019-12-10 2021-12-08 한국과학기술연구원 탈부착 가능한 회로보드를 이용하여 복수의 기능들을 구현하는 초음파 치료 및 진단 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3184645A (en) * 1960-03-24 1965-05-18 Cutler Hammer Inc Electrical circuit assembly
US3668476A (en) * 1970-09-11 1972-06-06 Seeburg Corp Self-locking enclosure for electronic circuitry and method of assembling the same
FR2521814B1 (fr) * 1982-02-16 1985-09-27 Transrack Bac pour cartes de circuits, destine notamment aux coffrets et baies d'appareillages electroniques
JPS609284A (ja) * 1983-06-29 1985-01-18 Toshiba Corp 垂直フリ−ラン検出装置
DE3335110A1 (de) * 1983-09-28 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Rahmen zur aufnahme von einschiebbaren elektrischen baugruppen
FR2559335B1 (fr) * 1984-02-08 1986-05-23 Telemecanique Electrique Cellule modulaire de support et de protection de cartes electroniques
US4674812A (en) * 1985-03-28 1987-06-23 Siemens Aktiengesellschaft Backplane wiring for electrical printed circuit cards
US4632476A (en) * 1985-08-30 1986-12-30 At&T Bell Laboratories Terminal grounding unit
US4876630A (en) * 1987-06-22 1989-10-24 Reliance Comm/Tec Corporation Mid-plane board and assembly therefor
US4900948A (en) * 1988-03-16 1990-02-13 Micro Control Company Apparatus providing signals for burn-in of integrated circuits
US4922125A (en) * 1988-03-17 1990-05-01 International Business Machines Corporation System cable assembly and component packaging

Also Published As

Publication number Publication date
EP0438012B1 (de) 1994-07-13
DE69010655T2 (de) 1995-01-12
US5023754A (en) 1991-06-11
BR9006652A (pt) 1991-10-01
EP0438012A2 (de) 1991-07-24
EP0438012A3 (en) 1992-09-02
JPH04153808A (ja) 1992-05-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee