DE69009165D1 - Drahtverbindungssystem. - Google Patents
Drahtverbindungssystem.Info
- Publication number
- DE69009165D1 DE69009165D1 DE69009165T DE69009165T DE69009165D1 DE 69009165 D1 DE69009165 D1 DE 69009165D1 DE 69009165 T DE69009165 T DE 69009165T DE 69009165 T DE69009165 T DE 69009165T DE 69009165 D1 DE69009165 D1 DE 69009165D1
- Authority
- DE
- Germany
- Prior art keywords
- wire connection
- connection system
- wire
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10336—Aluminium gallium arsenide [AlGaAs]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
- H05K2201/0792—Means against parasitic impedance; Means against eddy currents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/460,418 US5004317A (en) | 1990-01-03 | 1990-01-03 | Wire bond connection system with cancellation of mutual coupling |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69009165D1 true DE69009165D1 (de) | 1994-06-30 |
DE69009165T2 DE69009165T2 (de) | 1994-12-01 |
Family
ID=23828625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69009165T Expired - Fee Related DE69009165T2 (de) | 1990-01-03 | 1990-09-19 | Drahtverbindungssystem. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5004317A (de) |
EP (1) | EP0436074B1 (de) |
JP (1) | JPH0652821B2 (de) |
DE (1) | DE69009165T2 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5408534A (en) * | 1992-03-05 | 1995-04-18 | Knowles Electronics, Inc. | Electret microphone assembly, and method of manufacturer |
US5295214A (en) * | 1992-11-16 | 1994-03-15 | International Business Machines Corporation | Optical module with tolerant wave soldered joints |
US5604831A (en) * | 1992-11-16 | 1997-02-18 | International Business Machines Corporation | Optical module with fluxless laser reflow soldered joints |
US5343548A (en) * | 1992-12-15 | 1994-08-30 | International Business Machines Corporation | Method and apparatus for batch, active alignment of laser arrays to fiber arrays |
US6109508A (en) * | 1998-03-11 | 2000-08-29 | Texas Instruments Incorporated | Fine pitch bonding method using rectangular wire and capillary bore |
US7754539B2 (en) | 2003-10-08 | 2010-07-13 | Sige Semiconductor Inc. | Module integration integrated circuits |
US7409200B2 (en) * | 2003-10-08 | 2008-08-05 | Sige Semiconductor Inc. | Module integration integrated circuits |
US6992377B2 (en) * | 2004-02-26 | 2006-01-31 | Freescale Semiconductor, Inc. | Semiconductor package with crossing conductor assembly and method of manufacture |
US7350175B2 (en) * | 2004-09-29 | 2008-03-25 | Matsushita Electric Industrial Co., Ltd. | Circuit board design system, design data analysis method and recording medium with analysis program recorded thereon |
US7606018B2 (en) * | 2005-07-25 | 2009-10-20 | Tdk Corporation | Surge absorbing circuit |
US8110932B2 (en) * | 2007-10-12 | 2012-02-07 | Infineon Technologies Ag | Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire |
US8030763B2 (en) * | 2008-06-26 | 2011-10-04 | Freescale Semiconductor, Inc. | Semiconductor package with reduced inductive coupling between adjacent bondwire arrays |
US7872325B2 (en) * | 2009-02-24 | 2011-01-18 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Reduced-crosstalk wirebonding in an optical communication system |
US8289043B2 (en) | 2010-03-26 | 2012-10-16 | International Business Machines Corporation | Simulation of printed circuit board impedance variations and crosstalk effects |
US9625671B2 (en) | 2013-10-23 | 2017-04-18 | Lasermax, Inc. | Laser module and system |
US9859680B2 (en) | 2013-12-17 | 2018-01-02 | Lasermax, Inc. | Shock resistant laser module |
US9628027B2 (en) | 2014-03-14 | 2017-04-18 | Nxp Usa, Inc. | Multi-path devices with mutual inductance compensation networks and methods thereof |
US9686856B2 (en) * | 2014-04-02 | 2017-06-20 | Finisar Corporation | Transmission lines |
US9979356B2 (en) | 2014-12-17 | 2018-05-22 | Nxp Usa, Inc. | Magnetically coupled load modulation |
US9831835B2 (en) | 2016-02-26 | 2017-11-28 | Nxp Usa, Inc. | Multiple path amplifier with pre-cancellation |
US10855333B2 (en) * | 2018-06-28 | 2020-12-01 | Texas Instruments Incorporated | Crosstalk reduction in receiver inductive loop using capturing loop in transmitting inductive loop |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963920A (en) * | 1975-03-10 | 1976-06-15 | General Dynamics Corporation | Integrated optical-to-electrical signal transducing system and apparatus |
FR2527039A1 (fr) * | 1982-05-14 | 1983-11-18 | Inf Milit Spatiale Aeronaut | Dispositif de protection d'un dispositif electronique contre les tensions engendrees par un champ electromagnetique |
US4758805A (en) * | 1983-10-28 | 1988-07-19 | Nippondenso Co., Ltd. | High frequency interference prevention filter for electric instruments |
JPS6273809A (ja) * | 1985-09-26 | 1987-04-04 | Nippon Denso Co Ltd | 電子機器のための高周波フイルタ |
-
1990
- 1990-01-03 US US07/460,418 patent/US5004317A/en not_active Expired - Fee Related
- 1990-09-19 EP EP90117990A patent/EP0436074B1/de not_active Expired - Lifetime
- 1990-09-19 DE DE69009165T patent/DE69009165T2/de not_active Expired - Fee Related
- 1990-10-31 JP JP2292234A patent/JPH0652821B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH03212968A (ja) | 1991-09-18 |
DE69009165T2 (de) | 1994-12-01 |
EP0436074A1 (de) | 1991-07-10 |
EP0436074B1 (de) | 1994-05-25 |
JPH0652821B2 (ja) | 1994-07-06 |
US5004317A (en) | 1991-04-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |