DE68926480D1 - Hochdruck-Photolack Siliconisierungsverfahren und Vorrichtung - Google Patents

Hochdruck-Photolack Siliconisierungsverfahren und Vorrichtung

Info

Publication number
DE68926480D1
DE68926480D1 DE68926480T DE68926480T DE68926480D1 DE 68926480 D1 DE68926480 D1 DE 68926480D1 DE 68926480 T DE68926480 T DE 68926480T DE 68926480 T DE68926480 T DE 68926480T DE 68926480 D1 DE68926480 D1 DE 68926480D1
Authority
DE
Germany
Prior art keywords
high pressure
siliconization process
photoresist
pressure photoresist
siliconization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68926480T
Other languages
English (en)
Other versions
DE68926480T2 (de
Inventor
Cecil J Davis
George R Misium
Cesar M Garza
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE68926480D1 publication Critical patent/DE68926480D1/de
Application granted granted Critical
Publication of DE68926480T2 publication Critical patent/DE68926480T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE1989626480 1988-09-16 1989-09-13 Hochdruck-Photolack Siliconisierungsverfahren und Vorrichtung Expired - Fee Related DE68926480T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24587888A 1988-09-16 1988-09-16
US26520588A 1988-10-31 1988-10-31

Publications (2)

Publication Number Publication Date
DE68926480D1 true DE68926480D1 (de) 1996-06-20
DE68926480T2 DE68926480T2 (de) 1996-10-02

Family

ID=26937529

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1989626480 Expired - Fee Related DE68926480T2 (de) 1988-09-16 1989-09-13 Hochdruck-Photolack Siliconisierungsverfahren und Vorrichtung

Country Status (3)

Country Link
EP (1) EP0359221B1 (de)
JP (1) JP3111071B2 (de)
DE (1) DE68926480T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4040117C2 (de) * 1990-12-13 1994-02-17 Fotochem Werke Gmbh Stahlenempfindliches Material für die Elektronenstrahl- und Röntgenstrahllithographie und Verfahren zur Trockenentwicklung des Materials
EP1228528B1 (de) * 1999-09-10 2014-08-13 Oerlikon USA Inc. Prozess und anordnung zur herstellung magnetischer pole

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001666B1 (ko) * 1985-07-19 1990-03-17 후지쓰가부시끼가이샤 화합물 반도체의 에피택셜층 성장용의 화학적 유기 금속 기상 성장장치
FR2590405B1 (fr) * 1985-11-21 1988-02-05 Pons Michel Procede de gravure de materiaux organiques par plasma
CA1287594C (en) * 1986-04-04 1991-08-13 Miroslav Eror Method and apparatus for handling and processing wafer like materials
WO1987006561A1 (en) * 1986-04-28 1987-11-05 Varian Associates, Inc. Modular semiconductor wafer transport and processing system
US4768291A (en) * 1987-03-12 1988-09-06 Monarch Technologies Corporation Apparatus for dry processing a semiconductor wafer

Also Published As

Publication number Publication date
EP0359221A3 (de) 1992-08-19
EP0359221B1 (de) 1996-05-15
JP3111071B2 (ja) 2000-11-20
DE68926480T2 (de) 1996-10-02
EP0359221A2 (de) 1990-03-21
JPH02210446A (ja) 1990-08-21

Similar Documents

Publication Publication Date Title
DE3852634D1 (de) Nietverfahren und Vorrichtung.
DE69028796T2 (de) Evakuierungsvorrichtung und Evakuierungsverfahren
DE69014151D1 (de) Entwicklungsgerät und Prozesskassette hierfür.
DE69020047D1 (de) Druckfixierungs- und Entwicklungsgerät.
DE68912293D1 (de) Verpackungsverfahren und -vorrichtung.
DE68911230D1 (de) Unterdruckgiessverfahren und Vorrichtung.
DE69009863D1 (de) Emulgierungsverfahren und -vorrichtung.
DE69007779D1 (de) Trocknungsverfahren und vorrichtung dazu.
DE69015403T2 (de) Entwicklungsverfahren und -gerät.
DE69114968T3 (de) Entwicklungsverfahren und Vorrichtung.
DE3886910T2 (de) Emulgierungsverfahren und -vorrichtung.
NO902767D0 (no) Fremgangsmaate og innretning for behandling av en fiberstoff-vaeske-blanding.
DE69030347D1 (de) Plasmaprozess, Verfahren und Gerät
DE69003608D1 (de) Vorrichtung zum granulieren und ueberziehen.
DE69010820D1 (de) Stärkefreies Formverfahren und Vorrichtung.
DE68903452T2 (de) Vorrichtung zum granulieren und ueberziehen.
DE68925946T2 (de) Festkörperbildmatrix, Vorrichtung und Bildherstellungsverfahren
DE59002636D1 (de) Vorrichtung zum handhaben von objekten und anwendung der vorrichtung.
IT1231215B (it) Procedimento e dispositivo di formatura
DE68917118T2 (de) Nietverfahren und- vorrichtung.
IT9020592A0 (it) procedimento e dispositivo
DE69301224D1 (de) Verbrennungsverfahren und Vorrichtung
DE68926480T2 (de) Hochdruck-Photolack Siliconisierungsverfahren und Vorrichtung
DE59003441D1 (de) Schweissverfahren und Vorrichtung.
DE68905293D1 (de) Rektifikationsverfahren und vorrichtung dafuer.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee