DE68925782D1 - Verfahren zur Herstellung eines zusammengesetzten Materials mit Mehrfachkern - Google Patents

Verfahren zur Herstellung eines zusammengesetzten Materials mit Mehrfachkern

Info

Publication number
DE68925782D1
DE68925782D1 DE68925782T DE68925782T DE68925782D1 DE 68925782 D1 DE68925782 D1 DE 68925782D1 DE 68925782 T DE68925782 T DE 68925782T DE 68925782 T DE68925782 T DE 68925782T DE 68925782 D1 DE68925782 D1 DE 68925782D1
Authority
DE
Germany
Prior art keywords
production
composite material
multiple cores
cores
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68925782T
Other languages
English (en)
Other versions
DE68925782T2 (de
Inventor
Kazuyuki Nakasuji
Chihiro Hayashi
Yoshiyuki C O Suita Suzushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Proterial Ltd
Original Assignee
Sumitomo Metal Industries Ltd
Sumitomo Special Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd, Sumitomo Special Metals Co Ltd filed Critical Sumitomo Metal Industries Ltd
Application granted granted Critical
Publication of DE68925782D1 publication Critical patent/DE68925782D1/de
Publication of DE68925782T2 publication Critical patent/DE68925782T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE68925782T 1988-11-22 1989-11-21 Verfahren zur Herstellung eines zusammengesetzten Materials mit Mehrfachkern Expired - Fee Related DE68925782T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63295264A JPH07115214B2 (ja) 1988-11-22 1988-11-22 多芯構造複合材料の製造方法

Publications (2)

Publication Number Publication Date
DE68925782D1 true DE68925782D1 (de) 1996-04-04
DE68925782T2 DE68925782T2 (de) 1996-09-05

Family

ID=17818341

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68925782T Expired - Fee Related DE68925782T2 (de) 1988-11-22 1989-11-21 Verfahren zur Herstellung eines zusammengesetzten Materials mit Mehrfachkern

Country Status (4)

Country Link
US (1) US5007577A (de)
EP (1) EP0370769B1 (de)
JP (1) JPH07115214B2 (de)
DE (1) DE68925782T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310520A (en) * 1993-01-29 1994-05-10 Texas Instruments Incorporated Circuit system, a composite material for use therein, and a method of making the material
US6568060B1 (en) * 1999-06-04 2003-05-27 Polymet Corporation Method and fixture for filled billet packing
US6904657B2 (en) * 2002-04-29 2005-06-14 Polymet Corporation Brittle wire extrusion method and apparatus
US7063453B2 (en) * 2004-02-23 2006-06-20 Xaloy, Inc. Enhanced thermal conduction in apparatus for plasticating resinous material
DE102007019885B4 (de) * 2007-04-27 2010-11-25 Wieland-Werke Ag Kühlkörper mit matrixförmig strukturierter Oberfläche
CN102019501B (zh) * 2009-09-10 2012-10-10 中国航空工业集团公司北京航空制造工程研究所 一种搅拌摩擦焊接圆形环缝的方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US246407A (en) * 1881-08-30 Manufacture of electrical conductors
US3204326A (en) * 1960-12-19 1965-09-07 American Optical Corp Multi-element energy-conducting structures and method of making the same
US3355796A (en) * 1965-05-26 1967-12-05 Texas Instruments Inc Manufacture of clad rods, wires and the like
US3463620A (en) * 1968-02-28 1969-08-26 Olin Mathieson Cylindrical or rod-like composite article
FR2197682B1 (de) * 1972-09-01 1978-02-17 Felten & Guilleaume Carlswerk
US3991928A (en) * 1974-08-22 1976-11-16 United Technologies Corporation Method of fabricating titanium alloy matrix composite materials
US4209122A (en) * 1978-12-18 1980-06-24 Polymet Corporation Manufacture of high performance alloy in elongated form
SE420964B (sv) * 1980-03-27 1981-11-09 Asea Ab Kompositmaterial och sett for dess framstellning
JPS61114848A (ja) * 1984-11-12 1986-06-02 工業技術院長 金属基複合材料の製造法
US4598859A (en) * 1985-02-08 1986-07-08 Pfizer Inc. Exhausting gas from a metal assembly
JPS628488A (ja) * 1985-07-04 1987-01-16 三菱電機株式会社 シ−ズヒ−タ
JPS62294155A (ja) * 1986-06-13 1987-12-21 Nippon Seisen Kk ＮｉＴｉ系機能合金用複合材
US5004143A (en) * 1986-07-31 1991-04-02 Sumitomo Metal Industries, Ltd. Method of manufacturing clad bar

Also Published As

Publication number Publication date
JPH02142682A (ja) 1990-05-31
DE68925782T2 (de) 1996-09-05
JPH07115214B2 (ja) 1995-12-13
US5007577A (en) 1991-04-16
EP0370769B1 (de) 1996-02-28
EP0370769A3 (en) 1990-09-19
EP0370769A2 (de) 1990-05-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee